JPWO2022209681A1 - - Google Patents
Info
- Publication number
- JPWO2022209681A1 JPWO2022209681A1 JP2023510781A JP2023510781A JPWO2022209681A1 JP WO2022209681 A1 JPWO2022209681 A1 JP WO2022209681A1 JP 2023510781 A JP2023510781 A JP 2023510781A JP 2023510781 A JP2023510781 A JP 2023510781A JP WO2022209681 A1 JPWO2022209681 A1 JP WO2022209681A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14603—Special geometry or disposition of pixel-elements, address-lines or gate-electrodes
- H01L27/14605—Structural or functional details relating to the position of the pixel elements, e.g. smaller pixel elements in the center of the imager compared to pixel elements at the periphery
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14609—Pixel-elements with integrated switching, control, storage or amplification elements
- H01L27/14612—Pixel-elements with integrated switching, control, storage or amplification elements involving a transistor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14627—Microlenses
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/1463—Pixel isolation structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14636—Interconnect structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14641—Electronic components shared by two or more pixel-elements, e.g. one amplifier shared by two pixel elements
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Light Receiving Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2024004109A JP2024041925A (ja) | 2021-03-31 | 2024-01-15 | 光検出装置 |
JP2024004108A JP2024041924A (ja) | 2021-03-31 | 2024-01-15 | 光検出装置 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021062418A JP2021101491A (ja) | 2021-03-31 | 2021-03-31 | 光検出装置及び電子機器 |
JP2021062418 | 2021-03-31 | ||
PCT/JP2022/010411 WO2022209681A1 (ja) | 2021-03-31 | 2022-03-09 | 光検出装置及び電子機器 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2024004109A Division JP2024041925A (ja) | 2021-03-31 | 2024-01-15 | 光検出装置 |
JP2024004108A Division JP2024041924A (ja) | 2021-03-31 | 2024-01-15 | 光検出装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2022209681A1 true JPWO2022209681A1 (ja) | 2022-10-06 |
JPWO2022209681A5 JPWO2022209681A5 (ja) | 2023-07-07 |
JP7422943B2 JP7422943B2 (ja) | 2024-01-26 |
Family
ID=76651396
Family Applications (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021062418A Pending JP2021101491A (ja) | 2021-03-31 | 2021-03-31 | 光検出装置及び電子機器 |
JP2023510781A Active JP7422943B2 (ja) | 2021-03-31 | 2022-03-09 | 光検出装置 |
JP2024004108A Pending JP2024041924A (ja) | 2021-03-31 | 2024-01-15 | 光検出装置 |
JP2024004109A Pending JP2024041925A (ja) | 2021-03-31 | 2024-01-15 | 光検出装置 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021062418A Pending JP2021101491A (ja) | 2021-03-31 | 2021-03-31 | 光検出装置及び電子機器 |
Family Applications After (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2024004108A Pending JP2024041924A (ja) | 2021-03-31 | 2024-01-15 | 光検出装置 |
JP2024004109A Pending JP2024041925A (ja) | 2021-03-31 | 2024-01-15 | 光検出装置 |
Country Status (7)
Country | Link |
---|---|
US (3) | US20240038815A1 (ja) |
EP (1) | EP4318592A1 (ja) |
JP (4) | JP2021101491A (ja) |
KR (3) | KR20240010547A (ja) |
CN (1) | CN117121206A (ja) |
TW (1) | TW202247443A (ja) |
WO (1) | WO2022209681A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023053531A1 (ja) * | 2021-09-30 | 2023-04-06 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置および電子機器 |
TW202341454A (zh) * | 2021-12-08 | 2023-10-16 | 日商索尼半導體解決方案公司 | 光檢測裝置及電子機器 |
WO2023106215A1 (ja) * | 2021-12-09 | 2023-06-15 | ソニーセミコンダクタソリューションズ株式会社 | 光検出装置及び電子機器 |
WO2023153245A1 (ja) * | 2022-02-08 | 2023-08-17 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置及び電子機器 |
CN118805258A (zh) * | 2022-03-31 | 2024-10-18 | 索尼半导体解决方案公司 | 摄像装置和电子设备 |
JP2024076138A (ja) * | 2022-11-24 | 2024-06-05 | ソニーセミコンダクタソリューションズ株式会社 | 撮像装置 |
JP2024127099A (ja) * | 2023-03-08 | 2024-09-20 | ソニーセミコンダクタソリューションズ株式会社 | 撮像素子及び撮像装置 |
JP2024137356A (ja) * | 2023-03-24 | 2024-10-07 | ソニーセミコンダクタソリューションズ株式会社 | 光検出装置及び電子機器 |
JP2024146132A (ja) * | 2023-03-31 | 2024-10-15 | ソニーセミコンダクタソリューションズ株式会社 | 光検出装置及び電子機器 |
JP2024146131A (ja) * | 2023-03-31 | 2024-10-15 | ソニーセミコンダクタソリューションズ株式会社 | 光検出装置及び電子機器 |
Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61232667A (ja) * | 1985-04-09 | 1986-10-16 | Fuji Xerox Co Ltd | 原稿読み取り装置 |
JP2007103590A (ja) * | 2005-10-03 | 2007-04-19 | Nikon Corp | 撮像素子、焦点検出装置、および、撮像システム |
JP2013062789A (ja) * | 2011-08-22 | 2013-04-04 | Sony Corp | 固体撮像装置及び電子機器 |
JP2013157883A (ja) * | 2012-01-31 | 2013-08-15 | Sony Corp | 固体撮像素子およびカメラシステム |
JP2014116472A (ja) * | 2012-12-10 | 2014-06-26 | Canon Inc | 固体撮像装置およびその製造方法 |
JP2017212351A (ja) * | 2016-05-26 | 2017-11-30 | キヤノン株式会社 | 撮像装置 |
JP2018160558A (ja) * | 2017-03-23 | 2018-10-11 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子、および電子機器 |
JP2018201015A (ja) * | 2017-05-29 | 2018-12-20 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置、及び電子機器 |
JP2019029985A (ja) * | 2017-08-03 | 2019-02-21 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置、及び電子機器 |
WO2019220810A1 (ja) * | 2018-05-16 | 2019-11-21 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子および固体撮像装置 |
WO2020105713A1 (ja) * | 2018-11-21 | 2020-05-28 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6299058B2 (ja) * | 2011-03-02 | 2018-03-28 | ソニー株式会社 | 固体撮像装置、固体撮像装置の製造方法及び電子機器 |
US8471316B2 (en) * | 2011-09-07 | 2013-06-25 | Omnivision Technologies, Inc. | Isolation area between semiconductor devices having additional active area |
JP6198485B2 (ja) * | 2013-06-28 | 2017-09-20 | キヤノン株式会社 | 光電変換装置、及び撮像システム |
KR102212138B1 (ko) * | 2014-08-19 | 2021-02-04 | 삼성전자주식회사 | 이미지 센서의 단위 픽셀과 이를 포함하는 픽셀 어레이 |
KR20170006520A (ko) | 2015-07-08 | 2017-01-18 | 삼성전자주식회사 | 광전 변환 소자 내에 위치하는 변환 소자 분리막을 포함하는 이미지 센서 |
EP3576152B1 (en) * | 2017-01-30 | 2021-12-29 | Sony Semiconductor Solutions Corporation | Solid-state image-capture element and electronic device |
KR102574973B1 (ko) * | 2018-09-17 | 2023-09-06 | 에스케이하이닉스 주식회사 | P-형 분리 구조를 갖는 이미지 센서 |
KR102629334B1 (ko) * | 2018-10-11 | 2024-01-26 | 에스케이하이닉스 주식회사 | 중앙에 배치된 p-형 웰-탭 영역을 갖는 활성 영역들을 포함하는 이미지 센서 |
-
2021
- 2021-03-31 JP JP2021062418A patent/JP2021101491A/ja active Pending
-
2022
- 2022-03-09 EP EP22779904.6A patent/EP4318592A1/en active Pending
- 2022-03-09 CN CN202280024070.3A patent/CN117121206A/zh active Pending
- 2022-03-09 WO PCT/JP2022/010411 patent/WO2022209681A1/ja active Application Filing
- 2022-03-09 JP JP2023510781A patent/JP7422943B2/ja active Active
- 2022-03-09 KR KR1020247001239A patent/KR20240010547A/ko active Application Filing
- 2022-03-09 KR KR1020237031069A patent/KR20230160810A/ko not_active Application Discontinuation
- 2022-03-09 KR KR1020247001238A patent/KR20240010546A/ko active Application Filing
- 2022-03-09 US US18/259,947 patent/US20240038815A1/en active Pending
- 2022-03-24 TW TW111110986A patent/TW202247443A/zh unknown
-
2024
- 2024-01-15 JP JP2024004108A patent/JP2024041924A/ja active Pending
- 2024-01-15 JP JP2024004109A patent/JP2024041925A/ja active Pending
- 2024-02-13 US US18/440,310 patent/US20240213286A1/en active Pending
- 2024-03-04 US US18/594,103 patent/US20240213288A1/en active Pending
Patent Citations (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61232667A (ja) * | 1985-04-09 | 1986-10-16 | Fuji Xerox Co Ltd | 原稿読み取り装置 |
JP2007103590A (ja) * | 2005-10-03 | 2007-04-19 | Nikon Corp | 撮像素子、焦点検出装置、および、撮像システム |
JP2013062789A (ja) * | 2011-08-22 | 2013-04-04 | Sony Corp | 固体撮像装置及び電子機器 |
JP2013157883A (ja) * | 2012-01-31 | 2013-08-15 | Sony Corp | 固体撮像素子およびカメラシステム |
JP2014116472A (ja) * | 2012-12-10 | 2014-06-26 | Canon Inc | 固体撮像装置およびその製造方法 |
JP2017212351A (ja) * | 2016-05-26 | 2017-11-30 | キヤノン株式会社 | 撮像装置 |
JP2018160558A (ja) * | 2017-03-23 | 2018-10-11 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子、および電子機器 |
JP2018201015A (ja) * | 2017-05-29 | 2018-12-20 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置、及び電子機器 |
JP2019029985A (ja) * | 2017-08-03 | 2019-02-21 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像装置、及び電子機器 |
WO2019220810A1 (ja) * | 2018-05-16 | 2019-11-21 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子および固体撮像装置 |
WO2020105713A1 (ja) * | 2018-11-21 | 2020-05-28 | ソニーセミコンダクタソリューションズ株式会社 | 固体撮像素子 |
Also Published As
Publication number | Publication date |
---|---|
US20240213286A1 (en) | 2024-06-27 |
JP2024041925A (ja) | 2024-03-27 |
TW202247443A (zh) | 2022-12-01 |
WO2022209681A1 (ja) | 2022-10-06 |
EP4318592A1 (en) | 2024-02-07 |
KR20240010547A (ko) | 2024-01-23 |
CN117121206A (zh) | 2023-11-24 |
KR20240010546A (ko) | 2024-01-23 |
US20240213288A1 (en) | 2024-06-27 |
JP2024041924A (ja) | 2024-03-27 |
US20240038815A1 (en) | 2024-02-01 |
KR20230160810A (ko) | 2023-11-24 |
JP7422943B2 (ja) | 2024-01-26 |
JP2021101491A (ja) | 2021-07-08 |
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