JPWO2022209609A1 - - Google Patents
Info
- Publication number
- JPWO2022209609A1 JPWO2022209609A1 JP2023510739A JP2023510739A JPWO2022209609A1 JP WO2022209609 A1 JPWO2022209609 A1 JP WO2022209609A1 JP 2023510739 A JP2023510739 A JP 2023510739A JP 2023510739 A JP2023510739 A JP 2023510739A JP WO2022209609 A1 JPWO2022209609 A1 JP WO2022209609A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021059334 | 2021-03-31 | ||
| PCT/JP2022/009762 WO2022209609A1 (ja) | 2021-03-31 | 2022-03-07 | 半導体装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2022209609A1 true JPWO2022209609A1 (https=) | 2022-10-06 |
Family
ID=83458628
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023510739A Pending JPWO2022209609A1 (https=) | 2021-03-31 | 2022-03-07 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2022209609A1 (https=) |
| WO (1) | WO2022209609A1 (https=) |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1050927A (ja) * | 1996-08-06 | 1998-02-20 | Hitachi Chem Co Ltd | マルチチップ実装法 |
| JP2003017658A (ja) * | 2001-06-28 | 2003-01-17 | Toshiba Corp | 電力用半導体装置 |
| JP2008098584A (ja) * | 2006-10-16 | 2008-04-24 | Fuji Electric Device Technology Co Ltd | 半導体装置 |
| JP2010219211A (ja) * | 2009-03-16 | 2010-09-30 | Mitsubishi Electric Corp | 電力用半導体装置 |
| JP2013187494A (ja) * | 2012-03-09 | 2013-09-19 | Hitachi Ltd | 半導体装置 |
| JP2013201289A (ja) * | 2012-03-26 | 2013-10-03 | Mitsubishi Electric Corp | 半導体装置 |
| JPWO2013099050A1 (ja) * | 2011-12-28 | 2015-04-30 | 三菱電機株式会社 | 炭化珪素半導体素子の製造方法及び炭化珪素半導体素子及び炭化珪素半導体モジュール |
| DE102015200980A1 (de) * | 2015-01-22 | 2016-07-28 | Robert Bosch Gmbh | Verbindungsanordnung zwischen einem Trägerelement und einem elektronischen Schaltungsbauteil und elektronische Baugruppe |
| JP6143687B2 (ja) * | 2014-02-18 | 2017-06-07 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
| JPWO2017217369A1 (ja) * | 2016-06-14 | 2018-09-27 | 三菱電機株式会社 | 電力用半導体装置 |
| JP2018160653A (ja) * | 2017-03-22 | 2018-10-11 | 株式会社デンソー | 半導体装置 |
| WO2020012810A1 (ja) * | 2018-07-11 | 2020-01-16 | 住友電気工業株式会社 | 炭化珪素半導体装置 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2018173511A1 (ja) * | 2017-03-22 | 2018-09-27 | 株式会社デンソー | 半導体装置 |
-
2022
- 2022-03-07 JP JP2023510739A patent/JPWO2022209609A1/ja active Pending
- 2022-03-07 WO PCT/JP2022/009762 patent/WO2022209609A1/ja not_active Ceased
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1050927A (ja) * | 1996-08-06 | 1998-02-20 | Hitachi Chem Co Ltd | マルチチップ実装法 |
| JP2003017658A (ja) * | 2001-06-28 | 2003-01-17 | Toshiba Corp | 電力用半導体装置 |
| JP2008098584A (ja) * | 2006-10-16 | 2008-04-24 | Fuji Electric Device Technology Co Ltd | 半導体装置 |
| JP2010219211A (ja) * | 2009-03-16 | 2010-09-30 | Mitsubishi Electric Corp | 電力用半導体装置 |
| JPWO2013099050A1 (ja) * | 2011-12-28 | 2015-04-30 | 三菱電機株式会社 | 炭化珪素半導体素子の製造方法及び炭化珪素半導体素子及び炭化珪素半導体モジュール |
| JP2013187494A (ja) * | 2012-03-09 | 2013-09-19 | Hitachi Ltd | 半導体装置 |
| JP2013201289A (ja) * | 2012-03-26 | 2013-10-03 | Mitsubishi Electric Corp | 半導体装置 |
| JP6143687B2 (ja) * | 2014-02-18 | 2017-06-07 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
| DE102015200980A1 (de) * | 2015-01-22 | 2016-07-28 | Robert Bosch Gmbh | Verbindungsanordnung zwischen einem Trägerelement und einem elektronischen Schaltungsbauteil und elektronische Baugruppe |
| JPWO2017217369A1 (ja) * | 2016-06-14 | 2018-09-27 | 三菱電機株式会社 | 電力用半導体装置 |
| JP2018160653A (ja) * | 2017-03-22 | 2018-10-11 | 株式会社デンソー | 半導体装置 |
| WO2020012810A1 (ja) * | 2018-07-11 | 2020-01-16 | 住友電気工業株式会社 | 炭化珪素半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022209609A1 (ja) | 2022-10-06 |
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