JPWO2022209325A5 - - Google Patents
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- Publication number
- JPWO2022209325A5 JPWO2022209325A5 JP2022554354A JP2022554354A JPWO2022209325A5 JP WO2022209325 A5 JPWO2022209325 A5 JP WO2022209325A5 JP 2022554354 A JP2022554354 A JP 2022554354A JP 2022554354 A JP2022554354 A JP 2022554354A JP WO2022209325 A5 JPWO2022209325 A5 JP WO2022209325A5
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semi
- plate
- filled
- composite
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011347 resin Substances 0.000 claims 37
- 229920005989 resin Polymers 0.000 claims 37
- 239000002131 composite material Substances 0.000 claims 12
- 150000004767 nitrides Chemical class 0.000 claims 7
- 238000004519 manufacturing process Methods 0.000 claims 5
- 239000011148 porous material Substances 0.000 claims 4
- 239000011342 resin composition Substances 0.000 claims 4
- 229920001187 thermosetting polymer Polymers 0.000 claims 4
- 239000011248 coating agent Substances 0.000 claims 2
- 238000000576 coating method Methods 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 230000003746 surface roughness Effects 0.000 claims 2
- 238000005470 impregnation Methods 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000003825 pressing Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021059680 | 2021-03-31 | ||
| JP2021059680 | 2021-03-31 | ||
| PCT/JP2022/005063 WO2022209325A1 (ja) | 2021-03-31 | 2022-02-09 | 複合体及びその製造方法、樹脂充填板、並びに、積層体及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022209325A1 JPWO2022209325A1 (el) | 2022-10-06 |
| JP7217391B1 JP7217391B1 (ja) | 2023-02-02 |
| JPWO2022209325A5 true JPWO2022209325A5 (el) | 2023-03-01 |
Family
ID=83455935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022554354A Active JP7217391B1 (ja) | 2021-03-31 | 2022-02-09 | 複合体及びその製造方法、並びに、積層体及びその製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7217391B1 (el) |
| WO (1) | WO2022209325A1 (el) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023054031A1 (ja) * | 2021-09-28 | 2023-04-06 | デンカ株式会社 | 積層部品、及びその製造方法、並びに、積層体、及びその製造方法 |
| JP7374391B1 (ja) * | 2022-02-28 | 2023-11-06 | デンカ株式会社 | 複合シート、及び積層体 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008073875A (ja) * | 2006-09-19 | 2008-04-03 | Toray Ind Inc | Ｆｒｐ成形体の製造方法およびその成形体。 |
| EP3035778B1 (en) * | 2013-08-14 | 2018-10-03 | Denka Company Limited | Boron nitride/resin composite circuit board, and circuit board including boron nitride/resin composite integrated with heat radiation plate |
| JP6861697B2 (ja) * | 2016-03-10 | 2021-04-21 | デンカ株式会社 | セラミックス樹脂複合体 |
| CN111372996B (zh) * | 2017-12-05 | 2022-11-18 | 电化株式会社 | 氮化物系陶瓷树脂复合体 |
| CN111356669A (zh) * | 2018-03-07 | 2020-06-30 | 电化株式会社 | 陶瓷树脂复合体与金属板的临时粘接体、其制造方法、包含该临时粘接体的运输体、及其运输方法 |
| JPWO2020203586A1 (el) * | 2019-03-29 | 2020-10-08 |
-
2022
- 2022-02-09 WO PCT/JP2022/005063 patent/WO2022209325A1/ja active Application Filing
- 2022-02-09 JP JP2022554354A patent/JP7217391B1/ja active Active
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