JPWO2022208610A1 - - Google Patents

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Publication number
JPWO2022208610A1
JPWO2022208610A1 JP2023509923A JP2023509923A JPWO2022208610A1 JP WO2022208610 A1 JPWO2022208610 A1 JP WO2022208610A1 JP 2023509923 A JP2023509923 A JP 2023509923A JP 2023509923 A JP2023509923 A JP 2023509923A JP WO2022208610 A1 JPWO2022208610 A1 JP WO2022208610A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023509923A
Other versions
JPWO2022208610A5 (ja
JP7523673B2 (ja
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Publication of JPWO2022208610A1 publication Critical patent/JPWO2022208610A1/ja
Publication of JPWO2022208610A5 publication Critical patent/JPWO2022208610A5/ja
Application granted granted Critical
Publication of JP7523673B2 publication Critical patent/JP7523673B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H01L27/088—
    • H01L29/66068—
    • H01L21/823412—
    • H01L29/42364—
    • H01L29/66681—
    • H01L29/7802—
    • H01L29/7803—
    • H01L29/7817—
    • H01L21/823487—
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • H01L29/1608—
    • H01L29/2003—
    • H01L29/66659—
    • H01L29/66712—
    • H01L29/78—
JP2023509923A 2021-03-29 2021-03-29 半導体装置、半導体装置の製造方法、及び、半導体装置の交換方法 Active JP7523673B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/013293 WO2022208610A1 (ja) 2021-03-29 2021-03-29 半導体装置、半導体装置の製造方法、及び、半導体装置の交換方法

Publications (3)

Publication Number Publication Date
JPWO2022208610A1 true JPWO2022208610A1 (ja) 2022-10-06
JPWO2022208610A5 JPWO2022208610A5 (ja) 2023-06-28
JP7523673B2 JP7523673B2 (ja) 2024-07-26

Family

ID=83455731

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023509923A Active JP7523673B2 (ja) 2021-03-29 2021-03-29 半導体装置、半導体装置の製造方法、及び、半導体装置の交換方法

Country Status (5)

Country Link
US (1) US20240145467A1 (ja)
JP (1) JP7523673B2 (ja)
CN (1) CN117043961A (ja)
DE (1) DE112021007405T5 (ja)
WO (1) WO2022208610A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7528868B2 (ja) 2021-06-04 2024-08-06 株式会社デンソー 半導体装置の製造方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2808909B2 (ja) * 1990-04-27 1998-10-08 日本電気株式会社 パワー半導体装置
SG173211A1 (en) 2001-06-26 2011-08-29 Amgen Inc Antibodies to opgl
JP2010199362A (ja) 2009-02-26 2010-09-09 Denso Corp 半導体チップの組付け方法
JP5453903B2 (ja) 2009-04-28 2014-03-26 富士電機株式会社 ワイドバンドギャップ半導体装置
JP2011082454A (ja) * 2009-10-09 2011-04-21 Panasonic Corp 絶縁膜構造体及びこれを用いた半導体装置
WO2012029652A1 (ja) 2010-09-03 2012-03-08 三菱電機株式会社 半導体装置
JP5774921B2 (ja) * 2011-06-28 2015-09-09 ルネサスエレクトロニクス株式会社 半導体装置、半導体装置の製造方法、及び電子装置
JP6218462B2 (ja) * 2013-07-04 2017-10-25 三菱電機株式会社 ワイドギャップ半導体装置

Also Published As

Publication number Publication date
CN117043961A (zh) 2023-11-10
DE112021007405T5 (de) 2024-01-18
WO2022208610A1 (ja) 2022-10-06
JP7523673B2 (ja) 2024-07-26
US20240145467A1 (en) 2024-05-02

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