JPWO2022202800A1 - - Google Patents

Info

Publication number
JPWO2022202800A1
JPWO2022202800A1 JP2023509189A JP2023509189A JPWO2022202800A1 JP WO2022202800 A1 JPWO2022202800 A1 JP WO2022202800A1 JP 2023509189 A JP2023509189 A JP 2023509189A JP 2023509189 A JP2023509189 A JP 2023509189A JP WO2022202800 A1 JPWO2022202800 A1 JP WO2022202800A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023509189A
Other versions
JPWO2022202800A5 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022202800A1 publication Critical patent/JPWO2022202800A1/ja
Publication of JPWO2022202800A5 publication Critical patent/JPWO2022202800A5/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
    • C08K5/37—Thiols
    • C08K5/378—Thiols containing heterocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
JP2023509189A 2021-03-25 2022-03-22 Pending JPWO2022202800A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2021052091 2021-03-25
PCT/JP2022/013113 WO2022202800A1 (ja) 2021-03-25 2022-03-22 ポリシルセスキオキサン組成物、及び、硬化物

Publications (2)

Publication Number Publication Date
JPWO2022202800A1 true JPWO2022202800A1 (ja) 2022-09-29
JPWO2022202800A5 JPWO2022202800A5 (ja) 2023-12-14

Family

ID=83395861

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023509189A Pending JPWO2022202800A1 (ja) 2021-03-25 2022-03-22

Country Status (5)

Country Link
JP (1) JPWO2022202800A1 (ja)
KR (1) KR20230154957A (ja)
CN (1) CN117043276A (ja)
TW (1) TW202248297A (ja)
WO (1) WO2022202800A1 (ja)

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2646289B2 (ja) * 1990-06-01 1997-08-27 富士写真フイルム株式会社 レジスト組成物
JP3628098B2 (ja) * 1996-03-29 2005-03-09 ダウ コーニング アジア株式会社 放射線硬化性組成物およびこれを用いた硬化物パターンの製造方法
JPH11300273A (ja) * 1998-04-21 1999-11-02 Tokiwa Electric Co Ltd 光触媒被覆の形成方法
US8901268B2 (en) 2004-08-03 2014-12-02 Ahila Krishnamoorthy Compositions, layers and films for optoelectronic devices, methods of production and uses thereof
JP2006096806A (ja) * 2004-09-28 2006-04-13 Fuji Photo Film Co Ltd セルロースアシレートフィルム並びにそれを用いた光学フィルム、画像表示装置
WO2008099904A1 (en) * 2007-02-09 2008-08-21 Nippon Shokubai Co., Ltd. Silane compound, production method thereof, and resin composition containing silane compound
JP5075680B2 (ja) * 2007-03-28 2012-11-21 リンテック株式会社 光素子用封止材および光素子封止体
JP5333723B2 (ja) * 2008-07-23 2013-11-06 住友ゴム工業株式会社 ゴム組成物
JP2010044870A (ja) * 2008-08-08 2010-02-25 Nippon Shokubai Co Ltd フラットパネルディスプレイ用封着層形成材料、フラットパネルディスプレイ用封着層、及び、フラットパネルディスプレイ
JP4973877B2 (ja) * 2008-09-17 2012-07-11 信越化学工業株式会社 金属表面処理剤、表面処理鋼材及びその処理方法、並びに塗装鋼材及びその製造方法
JP5215931B2 (ja) * 2009-05-07 2013-06-19 株式会社日本触媒 重合性イミド組成物
JP2011241380A (ja) * 2010-04-22 2011-12-01 Nippon Shokubai Co Ltd 硬化成型体用樹脂組成物及び硬化成型体
WO2012134788A1 (en) * 2011-03-31 2012-10-04 Dow Corning Corporation Compositions containing phosphate catalysts and methods for the preparation and use of the compositions
CN103459027A (zh) * 2011-03-31 2013-12-18 道康宁公司 包含膦酸酯催化剂的组合物以及制备和使用组合物的方法
CN104024337B (zh) * 2011-11-15 2016-08-24 株式会社日本触媒 含硅烷组合物、固化性树脂组合物和密封材
JP2015230339A (ja) * 2014-06-03 2015-12-21 株式会社日本触媒 感光性樹脂組成物及びその用途
JP2016069475A (ja) * 2014-09-29 2016-05-09 株式会社日本触媒 硬化性樹脂組成物
EP3194502A4 (en) 2015-04-13 2018-05-16 Honeywell International Inc. Polysiloxane formulations and coatings for optoelectronic applications
JP2018119023A (ja) * 2017-01-23 2018-08-02 国立大学法人大阪大学 導電性組成物及び半導体装置
JP7194496B2 (ja) * 2017-12-06 2022-12-22 株式会社日本触媒 分散体及び樹脂組成物
JP2019137841A (ja) * 2018-02-09 2019-08-22 株式会社日本触媒 硬化性樹脂組成物、それを用いた封止材及び半導体装置

Also Published As

Publication number Publication date
CN117043276A (zh) 2023-11-10
TW202248297A (zh) 2022-12-16
KR20230154957A (ko) 2023-11-09
WO2022202800A1 (ja) 2022-09-29

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