JPWO2022202335A1 - - Google Patents
Info
- Publication number
- JPWO2022202335A1 JPWO2022202335A1 JP2022548394A JP2022548394A JPWO2022202335A1 JP WO2022202335 A1 JPWO2022202335 A1 JP WO2022202335A1 JP 2022548394 A JP2022548394 A JP 2022548394A JP 2022548394 A JP2022548394 A JP 2022548394A JP WO2022202335 A1 JPWO2022202335 A1 JP WO2022202335A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2021048213 | 2021-03-23 | ||
JP2021048213 | 2021-03-23 | ||
PCT/JP2022/010370 WO2022202335A1 (ja) | 2021-03-23 | 2022-03-09 | フェノール樹脂混合物、硬化性樹脂組成物及びその硬化物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2022202335A1 true JPWO2022202335A1 (ko) | 2022-09-29 |
JP7160512B1 JP7160512B1 (ja) | 2022-10-25 |
Family
ID=83394930
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022548394A Active JP7160512B1 (ja) | 2021-03-23 | 2022-03-09 | フェノール樹脂混合物、硬化性樹脂組成物及びその硬化物 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7160512B1 (ko) |
KR (1) | KR20230158502A (ko) |
CN (1) | CN117043220A (ko) |
TW (1) | TW202248276A (ko) |
WO (1) | WO2022202335A1 (ko) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2003041096A (ja) | 2001-07-31 | 2003-02-13 | Sumitomo Bakelite Co Ltd | エポキシ樹脂成形材料の製造方法及び半導体装置 |
JP2013006328A (ja) * | 2011-06-23 | 2013-01-10 | Sumitomo Bakelite Co Ltd | 積層板、回路基板、および半導体パッケージ |
JP5899498B2 (ja) | 2011-10-13 | 2016-04-06 | パナソニックIpマネジメント株式会社 | 半導体封止用エポキシ樹脂組成物とその製造方法および半導体装置 |
JP6120363B2 (ja) * | 2013-04-19 | 2017-04-26 | 日本化薬株式会社 | エポキシ樹脂、エポキシ樹脂組成物およびその硬化物 |
JP2015067615A (ja) * | 2013-09-26 | 2015-04-13 | 日本化薬株式会社 | エポキシ樹脂混合物、硬化性樹脂組成物、およびその硬化物 |
JP2020070303A (ja) * | 2017-03-07 | 2020-05-07 | 日本化薬株式会社 | 硬化性樹脂組成物及びその硬化物 |
-
2022
- 2022-03-09 JP JP2022548394A patent/JP7160512B1/ja active Active
- 2022-03-09 KR KR1020237031999A patent/KR20230158502A/ko unknown
- 2022-03-09 WO PCT/JP2022/010370 patent/WO2022202335A1/ja active Application Filing
- 2022-03-09 CN CN202280023933.5A patent/CN117043220A/zh active Pending
- 2022-03-21 TW TW111110372A patent/TW202248276A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
TW202248276A (zh) | 2022-12-16 |
JP7160512B1 (ja) | 2022-10-25 |
WO2022202335A1 (ja) | 2022-09-29 |
CN117043220A (zh) | 2023-11-10 |
KR20230158502A (ko) | 2023-11-20 |
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