JPWO2022149228A1 - - Google Patents
Info
- Publication number
- JPWO2022149228A1 JPWO2022149228A1 JP2021525269A JP2021525269A JPWO2022149228A1 JP WO2022149228 A1 JPWO2022149228 A1 JP WO2022149228A1 JP 2021525269 A JP2021525269 A JP 2021525269A JP 2021525269 A JP2021525269 A JP 2021525269A JP WO2022149228 A1 JPWO2022149228 A1 JP WO2022149228A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7841—Field effect transistors with field effect produced by an insulated gate with floating body, e.g. programmable transistors
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/20—DRAM devices comprising floating-body transistors, e.g. floating-body cells
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Semiconductor Memories (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2021/000281 WO2022149228A1 (ja) | 2021-01-07 | 2021-01-07 | 半導体素子を用いたメモリ装置の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP7057033B1 JP7057033B1 (ja) | 2022-04-19 |
JPWO2022149228A1 true JPWO2022149228A1 (ja) | 2022-07-14 |
Family
ID=81291692
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021525269A Active JP7057033B1 (ja) | 2021-01-07 | 2021-01-07 | 半導体素子を用いたメモリ装置の製造方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7057033B1 (ja) |
TW (1) | TWI807553B (ja) |
WO (1) | WO2022149228A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN117652215A (zh) * | 2022-03-04 | 2024-03-05 | 长江存储科技有限责任公司 | 三维存储装置及其制造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3898715B2 (ja) * | 2004-09-09 | 2007-03-28 | 株式会社東芝 | 半導体装置およびその製造方法 |
TWI278100B (en) * | 2005-07-01 | 2007-04-01 | Nanya Technology Corp | Method of fabricating dynamic random access memory and array of the same |
JP4791986B2 (ja) * | 2007-03-01 | 2011-10-12 | 株式会社東芝 | 半導体記憶装置 |
WO2009095998A1 (ja) * | 2008-01-29 | 2009-08-06 | Unisantis Electronics (Japan) Ltd. | 半導体記憶装置 |
JP6065190B2 (ja) * | 2014-09-05 | 2017-01-25 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置 |
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2021
- 2021-01-07 WO PCT/JP2021/000281 patent/WO2022149228A1/ja active Application Filing
- 2021-01-07 JP JP2021525269A patent/JP7057033B1/ja active Active
- 2021-12-23 TW TW110148463A patent/TWI807553B/zh active
Also Published As
Publication number | Publication date |
---|---|
WO2022149228A1 (ja) | 2022-07-14 |
JP7057033B1 (ja) | 2022-04-19 |
TW202243133A (zh) | 2022-11-01 |
TWI807553B (zh) | 2023-07-01 |
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