JPWO2022118802A5 - - Google Patents

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Publication number
JPWO2022118802A5
JPWO2022118802A5 JP2022529894A JP2022529894A JPWO2022118802A5 JP WO2022118802 A5 JPWO2022118802 A5 JP WO2022118802A5 JP 2022529894 A JP2022529894 A JP 2022529894A JP 2022529894 A JP2022529894 A JP 2022529894A JP WO2022118802 A5 JPWO2022118802 A5 JP WO2022118802A5
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Japan
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layer portion
mass
bonding layer
concentration peak
sintered body
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JP2022529894A
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English (en)
Japanese (ja)
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JP7251001B2 (ja
JPWO2022118802A1 (https=
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Priority claimed from PCT/JP2021/043716 external-priority patent/WO2022118802A1/ja
Publication of JPWO2022118802A1 publication Critical patent/JPWO2022118802A1/ja
Publication of JPWO2022118802A5 publication Critical patent/JPWO2022118802A5/ja
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JP2022529894A 2020-12-04 2021-11-29 セラミック焼結体及び半導体装置用基板 Active JP7251001B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020201979 2020-12-04
JP2020201979 2020-12-04
PCT/JP2021/043716 WO2022118802A1 (ja) 2020-12-04 2021-11-29 セラミック焼結体及び半導体装置用基板

Publications (3)

Publication Number Publication Date
JPWO2022118802A1 JPWO2022118802A1 (https=) 2022-06-09
JPWO2022118802A5 true JPWO2022118802A5 (https=) 2022-11-16
JP7251001B2 JP7251001B2 (ja) 2023-04-03

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JP2022529894A Active JP7251001B2 (ja) 2020-12-04 2021-11-29 セラミック焼結体及び半導体装置用基板

Country Status (4)

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JP (1) JP7251001B2 (https=)
CN (1) CN114867699B (https=)
DE (1) DE112021000182T5 (https=)
WO (1) WO2022118802A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024053619A1 (ja) * 2022-09-05 2024-03-14 Ngkエレクトロデバイス株式会社 セラミック基板、及びこれを備えた半導体装置用基板
WO2024069888A1 (ja) * 2022-09-29 2024-04-04 Ngkエレクトロデバイス株式会社 半導体装置用基板及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001144433A (ja) * 1999-11-18 2001-05-25 Denki Kagaku Kogyo Kk セラミックス回路基板
KR101757648B1 (ko) * 2009-04-03 2017-07-14 가부시키가이샤 스미토모 긴조쿠 엘렉트로 디바이스 세라믹스 소결체 및 이를 사용한 반도체장치용 기판
EP2637204B8 (en) * 2010-11-01 2017-05-31 Nippon Steel & Sumikin Electronics Devices Inc. An electronic component element housing package
JP2016041632A (ja) * 2012-12-25 2016-03-31 ニッコー株式会社 アルミナ質基板及び半導体装置用基板
TWI629753B (zh) * 2013-04-26 2018-07-11 Ngk Insulators, Ltd. 半導體用複合基板之操作基板
JP7062087B2 (ja) * 2018-12-06 2022-05-02 日本碍子株式会社 セラミックス焼結体及び半導体装置用基板
CN112789255A (zh) * 2018-12-06 2021-05-11 日本碍子株式会社 陶瓷烧结体以及半导体装置用基板

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