JPWO2022118802A5 - - Google Patents
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- Publication number
- JPWO2022118802A5 JPWO2022118802A5 JP2022529894A JP2022529894A JPWO2022118802A5 JP WO2022118802 A5 JPWO2022118802 A5 JP WO2022118802A5 JP 2022529894 A JP2022529894 A JP 2022529894A JP 2022529894 A JP2022529894 A JP 2022529894A JP WO2022118802 A5 JPWO2022118802 A5 JP WO2022118802A5
- Authority
- JP
- Japan
- Prior art keywords
- layer portion
- mass
- bonding layer
- concentration peak
- sintered body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 8
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims 8
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims 6
- 239000000919 ceramic Substances 0.000 claims 6
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims 5
- 229910052749 magnesium Inorganic materials 0.000 claims 5
- 239000011777 magnesium Substances 0.000 claims 5
- 239000000377 silicon dioxide Substances 0.000 claims 4
- 239000000395 magnesium oxide Substances 0.000 claims 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 2
- 239000011521 glass Substances 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- RUDFQVOCFDJEEF-UHFFFAOYSA-N yttrium(III) oxide Inorganic materials [O-2].[O-2].[O-2].[Y+3].[Y+3] RUDFQVOCFDJEEF-UHFFFAOYSA-N 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2020201979 | 2020-12-04 | ||
| JP2020201979 | 2020-12-04 | ||
| PCT/JP2021/043716 WO2022118802A1 (ja) | 2020-12-04 | 2021-11-29 | セラミック焼結体及び半導体装置用基板 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022118802A1 JPWO2022118802A1 (https=) | 2022-06-09 |
| JPWO2022118802A5 true JPWO2022118802A5 (https=) | 2022-11-16 |
| JP7251001B2 JP7251001B2 (ja) | 2023-04-03 |
Family
ID=81853930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022529894A Active JP7251001B2 (ja) | 2020-12-04 | 2021-11-29 | セラミック焼結体及び半導体装置用基板 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7251001B2 (https=) |
| CN (1) | CN114867699B (https=) |
| DE (1) | DE112021000182T5 (https=) |
| WO (1) | WO2022118802A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2024053619A1 (ja) * | 2022-09-05 | 2024-03-14 | Ngkエレクトロデバイス株式会社 | セラミック基板、及びこれを備えた半導体装置用基板 |
| WO2024069888A1 (ja) * | 2022-09-29 | 2024-04-04 | Ngkエレクトロデバイス株式会社 | 半導体装置用基板及びその製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001144433A (ja) * | 1999-11-18 | 2001-05-25 | Denki Kagaku Kogyo Kk | セラミックス回路基板 |
| KR101757648B1 (ko) * | 2009-04-03 | 2017-07-14 | 가부시키가이샤 스미토모 긴조쿠 엘렉트로 디바이스 | 세라믹스 소결체 및 이를 사용한 반도체장치용 기판 |
| EP2637204B8 (en) * | 2010-11-01 | 2017-05-31 | Nippon Steel & Sumikin Electronics Devices Inc. | An electronic component element housing package |
| JP2016041632A (ja) * | 2012-12-25 | 2016-03-31 | ニッコー株式会社 | アルミナ質基板及び半導体装置用基板 |
| TWI629753B (zh) * | 2013-04-26 | 2018-07-11 | Ngk Insulators, Ltd. | 半導體用複合基板之操作基板 |
| JP7062087B2 (ja) * | 2018-12-06 | 2022-05-02 | 日本碍子株式会社 | セラミックス焼結体及び半導体装置用基板 |
| CN112789255A (zh) * | 2018-12-06 | 2021-05-11 | 日本碍子株式会社 | 陶瓷烧结体以及半导体装置用基板 |
-
2021
- 2021-11-29 JP JP2022529894A patent/JP7251001B2/ja active Active
- 2021-11-29 DE DE112021000182.5T patent/DE112021000182T5/de active Pending
- 2021-11-29 CN CN202180006937.8A patent/CN114867699B/zh active Active
- 2021-11-29 WO PCT/JP2021/043716 patent/WO2022118802A1/ja not_active Ceased
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