JPWO2022117451A5 - - Google Patents

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Publication number
JPWO2022117451A5
JPWO2022117451A5 JP2023530217A JP2023530217A JPWO2022117451A5 JP WO2022117451 A5 JPWO2022117451 A5 JP WO2022117451A5 JP 2023530217 A JP2023530217 A JP 2023530217A JP 2023530217 A JP2023530217 A JP 2023530217A JP WO2022117451 A5 JPWO2022117451 A5 JP WO2022117451A5
Authority
JP
Japan
Prior art keywords
electrode
layer
rram
group
dielectric layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023530217A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023551161A (ja
Publication date
Priority claimed from US17/247,155 external-priority patent/US20220173313A1/en
Application filed filed Critical
Publication of JP2023551161A publication Critical patent/JP2023551161A/ja
Publication of JPWO2022117451A5 publication Critical patent/JPWO2022117451A5/ja
Pending legal-status Critical Current

Links

JP2023530217A 2020-12-02 2021-11-26 水平rramデバイスおよびその製造方法 Pending JP2023551161A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/247,155 US20220173313A1 (en) 2020-12-02 2020-12-02 Horizontal rram device and architecture fore variability reduction
US17/247,155 2020-12-02
PCT/EP2021/083148 WO2022117451A1 (en) 2020-12-02 2021-11-26 Horizontal rram device and fabrication method thereof

Publications (2)

Publication Number Publication Date
JP2023551161A JP2023551161A (ja) 2023-12-07
JPWO2022117451A5 true JPWO2022117451A5 (zh) 2023-12-21

Family

ID=78825086

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023530217A Pending JP2023551161A (ja) 2020-12-02 2021-11-26 水平rramデバイスおよびその製造方法

Country Status (5)

Country Link
US (1) US20220173313A1 (zh)
EP (1) EP4256613A1 (zh)
JP (1) JP2023551161A (zh)
CN (1) CN116636325A (zh)
WO (1) WO2022117451A1 (zh)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7459717B2 (en) * 2005-11-28 2008-12-02 Macronix International Co., Ltd. Phase change memory cell and manufacturing method
US10333064B2 (en) * 2011-04-13 2019-06-25 Micron Technology, Inc. Vertical memory cell for high-density memory
US9647035B2 (en) * 2014-09-18 2017-05-09 Globalfoundries Singapore Pte. Ltd. Non-volatile resistive random access memory crossbar devices with maximized memory element density and methods of forming the same
US10686014B2 (en) * 2018-06-26 2020-06-16 International Business Machines Corporation Semiconductor memory device having a vertical active region
US11744166B2 (en) * 2020-08-31 2023-08-29 Globalfoundries Singapore Pte. Ltd. Resistive memory elements with multiple input terminals

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