JPWO2022113362A1 - - Google Patents
Info
- Publication number
- JPWO2022113362A1 JPWO2022113362A1 JP2022565015A JP2022565015A JPWO2022113362A1 JP WO2022113362 A1 JPWO2022113362 A1 JP WO2022113362A1 JP 2022565015 A JP2022565015 A JP 2022565015A JP 2022565015 A JP2022565015 A JP 2022565015A JP WO2022113362 A1 JPWO2022113362 A1 JP WO2022113362A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
- H10F39/8063—Microlenses
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/806—Optical elements or arrangements associated with the image sensors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/002—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of materials engineered to provide properties not available in nature, e.g. metamaterials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/20—Filters
- G02B5/201—Filters in the form of arrays
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
- H04N23/12—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths with one sensor only
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/18—Complementary metal-oxide-semiconductor [CMOS] image sensors; Photodiode array image sensors
- H10F39/182—Colour image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/805—Coatings
- H10F39/8053—Colour filters
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Engineering & Computer Science (AREA)
- Solid State Image Pick-Up Elements (AREA)
- Optical Filters (AREA)
- Optical Elements Other Than Lenses (AREA)
- Diffracting Gratings Or Hologram Optical Elements (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Color Television Image Signal Generators (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2024182258A JP7852689B2 (ja) | 2020-11-30 | 2024-10-17 | 撮像素子及び撮像装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/044560 WO2022113362A1 (ja) | 2020-11-30 | 2020-11-30 | 光学素子、撮像素子及び撮像装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024182258A Division JP7852689B2 (ja) | 2020-11-30 | 2024-10-17 | 撮像素子及び撮像装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2022113362A1 true JPWO2022113362A1 (https=) | 2022-06-02 |
| JPWO2022113362A5 JPWO2022113362A5 (https=) | 2023-06-08 |
| JP7574859B2 JP7574859B2 (ja) | 2024-10-29 |
Family
ID=81754186
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2022565015A Active JP7574859B2 (ja) | 2020-11-30 | 2020-11-30 | 撮像素子及び撮像装置 |
| JP2024182258A Active JP7852689B2 (ja) | 2020-11-30 | 2024-10-17 | 撮像素子及び撮像装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024182258A Active JP7852689B2 (ja) | 2020-11-30 | 2024-10-17 | 撮像素子及び撮像装置 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US20240006440A1 (https=) |
| EP (1) | EP4242702B1 (https=) |
| JP (2) | JP7574859B2 (https=) |
| KR (1) | KR102801187B1 (https=) |
| CN (1) | CN116529637B (https=) |
| WO (1) | WO2022113362A1 (https=) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022113363A1 (ja) * | 2020-11-30 | 2022-06-02 | 日本電信電話株式会社 | 光学素子、撮像素子及び撮像装置 |
| WO2025070228A1 (ja) * | 2023-09-27 | 2025-04-03 | ソニーセミコンダクタソリューションズ株式会社 | 光検出装置 |
| US20250151435A1 (en) * | 2023-11-03 | 2025-05-08 | Visera Technologies Company Limited | Solid-state image sensor |
| US20250297855A1 (en) * | 2024-03-21 | 2025-09-25 | Kla Corporation | System and method for device-like overlay targets measurement |
| WO2025258002A1 (ja) * | 2024-06-12 | 2025-12-18 | Ｎｔｔ株式会社 | 撮像素子および撮像装置 |
| WO2026028602A1 (ja) * | 2024-07-30 | 2026-02-05 | ソニーセミコンダクタソリューションズ株式会社 | 光検出装置 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010156942A (ja) * | 2008-12-31 | 2010-07-15 | Ind Technol Res Inst | 色分離光学装置およびそれを応用した画像装置 |
| JP2011040441A (ja) * | 2009-08-06 | 2011-02-24 | Panasonic Corp | 固体撮像装置 |
| JP2015028960A (ja) * | 2011-12-01 | 2015-02-12 | ソニー株式会社 | 固体撮像装置および電子機器 |
| JP2018146750A (ja) * | 2017-03-03 | 2018-09-20 | 株式会社ジャパンディスプレイ | 表示装置、表示方法及び色分離素子 |
| JP2019184986A (ja) * | 2018-04-17 | 2019-10-24 | 日本電信電話株式会社 | カラー撮像素子および撮像装置 |
| WO2020066738A1 (ja) * | 2018-09-26 | 2020-04-02 | 日本電信電話株式会社 | 偏光イメージング撮像システム |
| JP2020123964A (ja) * | 2018-04-17 | 2020-08-13 | 日本電信電話株式会社 | カラー撮像素子および撮像装置 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2005101067A1 (ja) * | 2004-04-13 | 2005-10-27 | Matsushita Electric Industrial Co., Ltd. | 集光素子および固体撮像装置 |
| KR100998098B1 (ko) * | 2004-06-22 | 2010-12-02 | 니폰덴신뎅와 가부시키가이샤 | 광학 재료, 광학 렌즈 및 프리즘 |
| EP1785750A1 (en) * | 2004-09-01 | 2007-05-16 | Matsushita Electric Industrial Co., Ltd. | Condensing element, solid-state imaging device and method for fabricating the same |
| US8384818B2 (en) | 2008-06-18 | 2013-02-26 | Panasonic Corporation | Solid-state imaging device including arrays of optical elements and photosensitive cells |
| CN102160180A (zh) * | 2009-07-24 | 2011-08-17 | 松下电器产业株式会社 | 摄像装置以及固体摄像元件 |
| US10790325B2 (en) * | 2015-07-29 | 2020-09-29 | Samsung Electronics Co., Ltd. | Imaging apparatus and image sensor including the same |
| JP2018207035A (ja) * | 2017-06-08 | 2018-12-27 | 凸版印刷株式会社 | 固体撮像素子 |
| US20200301053A1 (en) * | 2019-03-20 | 2020-09-24 | Coherent AI LLC | Optical sensing device employing light intensity detectors integrated with nanostructures |
| EP3812801B1 (en) * | 2019-10-23 | 2024-06-19 | Samsung Electronics Co., Ltd. | Image sensor including color separating lens array and electronic device including the image sensor |
| US11640645B2 (en) * | 2019-10-25 | 2023-05-02 | Samsung Electronics Co., Ltd. | Apparatus and method of acquiring image by employing color separation lens array |
| CN114447007A (zh) | 2020-10-30 | 2022-05-06 | 三星电子株式会社 | 包括分色透镜阵列的图像传感器和包括该图像传感器的电子设备 |
| WO2022113363A1 (ja) * | 2020-11-30 | 2022-06-02 | 日本電信電話株式会社 | 光学素子、撮像素子及び撮像装置 |
-
2020
- 2020-11-30 KR KR1020237017916A patent/KR102801187B1/ko active Active
- 2020-11-30 EP EP20963625.7A patent/EP4242702B1/en active Active
- 2020-11-30 JP JP2022565015A patent/JP7574859B2/ja active Active
- 2020-11-30 US US18/039,048 patent/US20240006440A1/en active Pending
- 2020-11-30 WO PCT/JP2020/044560 patent/WO2022113362A1/ja not_active Ceased
- 2020-11-30 CN CN202080107529.7A patent/CN116529637B/zh active Active
-
2024
- 2024-10-17 JP JP2024182258A patent/JP7852689B2/ja active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010156942A (ja) * | 2008-12-31 | 2010-07-15 | Ind Technol Res Inst | 色分離光学装置およびそれを応用した画像装置 |
| JP2011040441A (ja) * | 2009-08-06 | 2011-02-24 | Panasonic Corp | 固体撮像装置 |
| JP2015028960A (ja) * | 2011-12-01 | 2015-02-12 | ソニー株式会社 | 固体撮像装置および電子機器 |
| JP2018146750A (ja) * | 2017-03-03 | 2018-09-20 | 株式会社ジャパンディスプレイ | 表示装置、表示方法及び色分離素子 |
| JP2019184986A (ja) * | 2018-04-17 | 2019-10-24 | 日本電信電話株式会社 | カラー撮像素子および撮像装置 |
| JP2020123964A (ja) * | 2018-04-17 | 2020-08-13 | 日本電信電話株式会社 | カラー撮像素子および撮像装置 |
| WO2020066738A1 (ja) * | 2018-09-26 | 2020-04-02 | 日本電信電話株式会社 | 偏光イメージング撮像システム |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2022113362A1 (ja) | 2022-06-02 |
| JP7574859B2 (ja) | 2024-10-29 |
| EP4242702B1 (en) | 2026-04-15 |
| KR102801187B1 (ko) | 2025-04-29 |
| CN116529637A (zh) | 2023-08-01 |
| EP4242702A4 (en) | 2024-07-17 |
| EP4242702A1 (en) | 2023-09-13 |
| JP2024180638A (ja) | 2024-12-26 |
| US20240006440A1 (en) | 2024-01-04 |
| JP7852689B2 (ja) | 2026-04-28 |
| KR20230093325A (ko) | 2023-06-27 |
| CN116529637B (zh) | 2025-05-13 |
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