JPWO2022085715A1 - - Google Patents

Info

Publication number
JPWO2022085715A1
JPWO2022085715A1 JP2022557579A JP2022557579A JPWO2022085715A1 JP WO2022085715 A1 JPWO2022085715 A1 JP WO2022085715A1 JP 2022557579 A JP2022557579 A JP 2022557579A JP 2022557579 A JP2022557579 A JP 2022557579A JP WO2022085715 A1 JPWO2022085715 A1 JP WO2022085715A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022557579A
Other languages
Japanese (ja)
Other versions
JPWO2022085715A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022085715A1 publication Critical patent/JPWO2022085715A1/ja
Publication of JPWO2022085715A5 publication Critical patent/JPWO2022085715A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
    • H05K1/0298—Multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed inductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0338—Layered conductor, e.g. layered metal substrate, layered finish layer or layered thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H05K2201/0792—Means against parasitic impedance; Means against eddy currents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09672—Superposed layout, i.e. in different planes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1126—Firing, i.e. heating a powder or paste above the melting temperature of at least one of its constituents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/308—Sacrificial means, e.g. for temporarily filling a space for making a via or a cavity or for making rigid-flexible PCBs
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2022557579A 2020-10-22 2021-10-20 Pending JPWO2022085715A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020177476 2020-10-22
PCT/JP2021/038730 WO2022085715A1 (ja) 2020-10-22 2021-10-20 多層構造体およびその製造方法

Publications (2)

Publication Number Publication Date
JPWO2022085715A1 true JPWO2022085715A1 (https=) 2022-04-28
JPWO2022085715A5 JPWO2022085715A5 (https=) 2023-06-14

Family

ID=81290614

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022557579A Pending JPWO2022085715A1 (https=) 2020-10-22 2021-10-20

Country Status (4)

Country Link
US (1) US20230262888A1 (https=)
JP (1) JPWO2022085715A1 (https=)
CN (1) CN220067840U (https=)
WO (1) WO2022085715A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI870161B (zh) * 2023-12-15 2025-01-11 同欣電子工業股份有限公司 複合式線路板結構及其製造方法

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07131161A (ja) * 1993-10-29 1995-05-19 Kyocera Corp セラミック回路基板
JP2004023770A (ja) * 2002-06-20 2004-01-22 Murata Mfg Co Ltd 非可逆回路素子および通信装置
JP2005101368A (ja) * 2003-09-25 2005-04-14 Kyocera Corp 配線基板
JP2005217579A (ja) * 2004-01-28 2005-08-11 Kyocera Corp 高周波電力増幅モジュール及び携帯端末機器
JP2008177516A (ja) * 2006-12-22 2008-07-31 Kyocera Corp コイル内蔵基板
JP2009206232A (ja) * 2008-02-27 2009-09-10 Kyocera Corp セラミック生成形体およびセラミック基板の製造方法
JP2012195471A (ja) * 2011-03-17 2012-10-11 Murata Mfg Co Ltd 積層基板の製造方法及び該方法で製造された積層基板
JP2015103809A (ja) * 2013-11-25 2015-06-04 テザト−スペースコム・ゲーエムベーハー・ウント・コー・カーゲー セラミックインレーを備えた回路板
WO2015129601A1 (ja) * 2014-02-27 2015-09-03 株式会社村田製作所 電磁石の製造方法、および、電磁石
JP2016134624A (ja) * 2015-01-22 2016-07-25 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電子素子内蔵型印刷回路基板及びその製造方法
JP2016146370A (ja) * 2015-02-06 2016-08-12 株式会社村田製作所 部品内蔵基板およびその製造方法
WO2020129945A1 (ja) * 2018-12-21 2020-06-25 株式会社村田製作所 積層体及び電子部品

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07131161A (ja) * 1993-10-29 1995-05-19 Kyocera Corp セラミック回路基板
JP2004023770A (ja) * 2002-06-20 2004-01-22 Murata Mfg Co Ltd 非可逆回路素子および通信装置
JP2005101368A (ja) * 2003-09-25 2005-04-14 Kyocera Corp 配線基板
JP2005217579A (ja) * 2004-01-28 2005-08-11 Kyocera Corp 高周波電力増幅モジュール及び携帯端末機器
JP2008177516A (ja) * 2006-12-22 2008-07-31 Kyocera Corp コイル内蔵基板
JP2009206232A (ja) * 2008-02-27 2009-09-10 Kyocera Corp セラミック生成形体およびセラミック基板の製造方法
JP2012195471A (ja) * 2011-03-17 2012-10-11 Murata Mfg Co Ltd 積層基板の製造方法及び該方法で製造された積層基板
JP2015103809A (ja) * 2013-11-25 2015-06-04 テザト−スペースコム・ゲーエムベーハー・ウント・コー・カーゲー セラミックインレーを備えた回路板
WO2015129601A1 (ja) * 2014-02-27 2015-09-03 株式会社村田製作所 電磁石の製造方法、および、電磁石
JP2016134624A (ja) * 2015-01-22 2016-07-25 サムソン エレクトロ−メカニックス カンパニーリミテッド． 電子素子内蔵型印刷回路基板及びその製造方法
JP2016146370A (ja) * 2015-02-06 2016-08-12 株式会社村田製作所 部品内蔵基板およびその製造方法
WO2020129945A1 (ja) * 2018-12-21 2020-06-25 株式会社村田製作所 積層体及び電子部品

Also Published As

Publication number Publication date
US20230262888A1 (en) 2023-08-17
WO2022085715A1 (ja) 2022-04-28
CN220067840U (zh) 2023-11-21

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