JPWO2022085711A5 - - Google Patents

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JPWO2022085711A5
JPWO2022085711A5 JP2022557575A JP2022557575A JPWO2022085711A5 JP WO2022085711 A5 JPWO2022085711 A5 JP WO2022085711A5 JP 2022557575 A JP2022557575 A JP 2022557575A JP 2022557575 A JP2022557575 A JP 2022557575A JP WO2022085711 A5 JPWO2022085711 A5 JP WO2022085711A5
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JP2022557575A
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JP7524340B2 (ja
JPWO2022085711A1 (https=
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Priority claimed from PCT/JP2021/038712 external-priority patent/WO2022085711A1/ja
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JP2022557575A 2020-10-22 2021-10-20 接合体、セラミックス銅回路基板、および半導体装置 Active JP7524340B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020177286 2020-10-22
JP2020177286 2020-10-22
PCT/JP2021/038712 WO2022085711A1 (ja) 2020-10-22 2021-10-20 接合体、セラミックス銅回路基板、および半導体装置

Publications (3)

Publication Number Publication Date
JPWO2022085711A1 JPWO2022085711A1 (https=) 2022-04-28
JPWO2022085711A5 true JPWO2022085711A5 (https=) 2024-06-12
JP7524340B2 JP7524340B2 (ja) 2024-07-29

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ID=81290598

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JP2022557575A Active JP7524340B2 (ja) 2020-10-22 2021-10-20 接合体、セラミックス銅回路基板、および半導体装置

Country Status (5)

Country Link
US (1) US20230260868A1 (https=)
EP (1) EP4234518A4 (https=)
JP (1) JP7524340B2 (https=)
CN (1) CN116457321B (https=)
WO (1) WO2022085711A1 (https=)

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0480038B1 (en) * 1990-04-16 1997-07-09 Denki Kagaku Kogyo Kabushiki Kaisha Ceramic circuit board
JPH0923060A (ja) * 1995-07-07 1997-01-21 Asahi Chem Ind Co Ltd 新規メタライズ基板
JP3714557B2 (ja) * 2003-04-21 2005-11-09 日立金属株式会社 セラミックス基板用ろう材及びこれを用いたセラミックス回路基板、パワー半導体モジュール
CN102655126B (zh) * 2011-03-01 2016-08-03 三菱综合材料株式会社 功率模块用基板及制法、自带散热器的该基板及功率模块
CN105189109B (zh) * 2013-03-14 2017-04-05 三菱综合材料株式会社 接合体、功率模块用基板及自带散热器的功率模块用基板
JP6430382B2 (ja) * 2013-08-08 2018-11-28 株式会社東芝 回路基板および半導体装置
EP3053899B1 (en) * 2013-09-30 2019-11-06 Mitsubishi Materials Corporation Cu/ceramic bonded body, method for manufacturing cu/ceramic bonded body, and power module substrate
JP6742073B2 (ja) * 2015-03-11 2020-08-19 デンカ株式会社 セラミックス回路基板
EP3398205B1 (en) * 2015-12-28 2019-10-30 NGK Insulators, Ltd. Bonded substrate and method for manufacturing bonded substrate
KR102129339B1 (ko) * 2016-06-10 2020-07-03 다나카 기킨조쿠 고교 가부시키가이샤 세라믹스 회로 기판, 및 세라믹스 회로 기판의 제조 방법
JP6642865B2 (ja) * 2016-06-16 2020-02-12 富士電機株式会社 はんだ接合部
JP6970738B2 (ja) * 2017-03-30 2021-11-24 株式会社東芝 セラミックス銅回路基板およびそれを用いた半導体装置

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