JP7524340B2 - 接合体、セラミックス銅回路基板、および半導体装置 - Google Patents

接合体、セラミックス銅回路基板、および半導体装置 Download PDF

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JP7524340B2
JP7524340B2 JP2022557575A JP2022557575A JP7524340B2 JP 7524340 B2 JP7524340 B2 JP 7524340B2 JP 2022557575 A JP2022557575 A JP 2022557575A JP 2022557575 A JP2022557575 A JP 2022557575A JP 7524340 B2 JP7524340 B2 JP 7524340B2
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region
concentration
copper plate
copper
bonded body
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JPWO2022085711A5 (https=
JPWO2022085711A1 (https=
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麻紀 米津
誠一 末永
幸子 藤澤
孝 佐野
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Toshiba Corp
Niterra Materials Co Ltd
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Toshiba Materials Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/255—Arrangements for cooling characterised by their materials having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
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    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • C04B37/023—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used
    • C04B37/026—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles characterised by the interlayer used consisting of metals or metal salts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/50—Constituents or additives of the starting mixture chosen for their shape or used because of their shape or their physical appearance
    • C04B2235/54—Particle size related information
    • C04B2235/5418—Particle size related information expressed by the size of the particles or aggregates thereof
    • C04B2235/5436—Particle size related information expressed by the size of the particles or aggregates thereof micrometer sized, i.e. from 1 to 100 micron
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C04B2235/6565—Cooling rate
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    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/658—Atmosphere during thermal treatment
    • C04B2235/6581—Total pressure below 1 atmosphere, e.g. vacuum
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    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
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    • C04B2235/78—Grain sizes and shapes, product microstructures, e.g. acicular grains, equiaxed grains, platelet-structures
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/125—Metallic interlayers based on noble metals, e.g. silver
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    • C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
    • C04B2237/12—Metallic interlayers
    • C04B2237/126—Metallic interlayers wherein the active component for bonding is not the largest fraction of the interlayer
    • C04B2237/127—The active component for bonding being a refractory metal
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
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    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/32—Ceramic
    • C04B2237/34—Oxidic
    • C04B2237/345—Refractory metal oxides
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    • C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
    • C04B2237/30—Composition of layers of ceramic laminates or of ceramic or metallic articles to be joined by heating, e.g. Si substrates
    • C04B2237/40—Metallic
    • C04B2237/407—Copper
    • C—CHEMISTRY; METALLURGY
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    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Products (AREA)
JP2022557575A 2020-10-22 2021-10-20 接合体、セラミックス銅回路基板、および半導体装置 Active JP7524340B2 (ja)

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JP2020177286 2020-10-22
JP2020177286 2020-10-22
PCT/JP2021/038712 WO2022085711A1 (ja) 2020-10-22 2021-10-20 接合体、セラミックス銅回路基板、および半導体装置

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JPWO2022085711A1 JPWO2022085711A1 (https=) 2022-04-28
JPWO2022085711A5 JPWO2022085711A5 (https=) 2024-06-12
JP7524340B2 true JP7524340B2 (ja) 2024-07-29

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US (1) US20230260868A1 (https=)
EP (1) EP4234518A4 (https=)
JP (1) JP7524340B2 (https=)
CN (1) CN116457321B (https=)
WO (1) WO2022085711A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015019602A1 (ja) 2013-08-08 2015-02-12 株式会社 東芝 回路基板および半導体装置
JP2016169111A (ja) 2015-03-11 2016-09-23 デンカ株式会社 セラミックス回路基板
JP2018506496A (ja) 2015-12-28 2018-03-08 日本碍子株式会社 接合基板および接合基板の製造方法
WO2018180965A1 (ja) 2017-03-30 2018-10-04 株式会社 東芝 セラミックス銅回路基板およびそれを用いた半導体装置

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0480038B1 (en) * 1990-04-16 1997-07-09 Denki Kagaku Kogyo Kabushiki Kaisha Ceramic circuit board
JPH0923060A (ja) * 1995-07-07 1997-01-21 Asahi Chem Ind Co Ltd 新規メタライズ基板
JP3714557B2 (ja) * 2003-04-21 2005-11-09 日立金属株式会社 セラミックス基板用ろう材及びこれを用いたセラミックス回路基板、パワー半導体モジュール
CN102655126B (zh) * 2011-03-01 2016-08-03 三菱综合材料株式会社 功率模块用基板及制法、自带散热器的该基板及功率模块
CN105189109B (zh) * 2013-03-14 2017-04-05 三菱综合材料株式会社 接合体、功率模块用基板及自带散热器的功率模块用基板
EP3053899B1 (en) * 2013-09-30 2019-11-06 Mitsubishi Materials Corporation Cu/ceramic bonded body, method for manufacturing cu/ceramic bonded body, and power module substrate
KR102129339B1 (ko) * 2016-06-10 2020-07-03 다나카 기킨조쿠 고교 가부시키가이샤 세라믹스 회로 기판, 및 세라믹스 회로 기판의 제조 방법
JP6642865B2 (ja) * 2016-06-16 2020-02-12 富士電機株式会社 はんだ接合部

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015019602A1 (ja) 2013-08-08 2015-02-12 株式会社 東芝 回路基板および半導体装置
JP2016169111A (ja) 2015-03-11 2016-09-23 デンカ株式会社 セラミックス回路基板
JP2018506496A (ja) 2015-12-28 2018-03-08 日本碍子株式会社 接合基板および接合基板の製造方法
WO2018180965A1 (ja) 2017-03-30 2018-10-04 株式会社 東芝 セラミックス銅回路基板およびそれを用いた半導体装置

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CN116457321B (zh) 2024-08-06
CN116457321A (zh) 2023-07-18
EP4234518A1 (en) 2023-08-30
WO2022085711A1 (ja) 2022-04-28
EP4234518A4 (en) 2024-10-09
JPWO2022085711A1 (https=) 2022-04-28
US20230260868A1 (en) 2023-08-17

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