JPWO2022085475A1 - - Google Patents
Info
- Publication number
- JPWO2022085475A1 JPWO2022085475A1 JP2022556892A JP2022556892A JPWO2022085475A1 JP WO2022085475 A1 JPWO2022085475 A1 JP WO2022085475A1 JP 2022556892 A JP2022556892 A JP 2022556892A JP 2022556892 A JP2022556892 A JP 2022556892A JP WO2022085475 A1 JPWO2022085475 A1 JP WO2022085475A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
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- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
- C07C69/96—Esters of carbonic or haloformic acids
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
- C08K5/134—Phenols containing ester groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
- C08K5/24—Derivatives of hydrazine
- C08K5/25—Carboxylic acid hydrazides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3472—Five-membered rings
- C08K5/3475—Five-membered rings condensed with carbocyclic rings
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020176962 | 2020-10-21 | ||
PCT/JP2021/037246 WO2022085475A1 (ja) | 2020-10-21 | 2021-10-07 | 組成物、硬化物、硬化物の製造方法及び添加剤 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2022085475A1 true JPWO2022085475A1 (zh) | 2022-04-28 |
Family
ID=81290359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022556892A Pending JPWO2022085475A1 (zh) | 2020-10-21 | 2021-10-07 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2022085475A1 (zh) |
KR (1) | KR20230091872A (zh) |
CN (1) | CN116368122A (zh) |
TW (1) | TW202222892A (zh) |
WO (1) | WO2022085475A1 (zh) |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3888823A (en) * | 1972-10-13 | 1975-06-10 | Cincinnati Milacron Inc | Methoxy carboxylic acid ester ultraviolet stabilizers for polymers |
JPH0643630A (ja) * | 1991-05-28 | 1994-02-18 | Nippon Kayaku Co Ltd | 酸分解性化合物及びそれを含有するポジ型感放射線性レジスト組成物 |
US5556973A (en) * | 1994-07-27 | 1996-09-17 | Ciba-Geigy Corporation | Red-shifted tris-aryl-s-triazines and compositions stabilized therewith |
JP3637277B2 (ja) * | 2000-03-21 | 2005-04-13 | 大塚化学ホールディングス株式会社 | 難燃剤、及び難燃性樹脂組成物、及び成形物、及び電子部品 |
JP2002188077A (ja) * | 2000-10-10 | 2002-07-05 | Fuji Photo Film Co Ltd | 紫外線吸収剤前駆体を含有する組成物、及び画像形成方法 |
JP2004157231A (ja) * | 2002-11-05 | 2004-06-03 | Konica Minolta Holdings Inc | ドライイメージング材料 |
KR20060017934A (ko) * | 2004-08-23 | 2006-02-28 | 미원상사주식회사 | 평판 인쇄판용 포지티브형 감광성 조성물 및 그를 위한현상액 조성물 |
TWI400568B (zh) * | 2004-12-24 | 2013-07-01 | Mitsubishi Gas Chemical Co | 感放射線性組成物、非晶質膜及形成光阻圖案的方法 |
JP2008111102A (ja) * | 2006-10-02 | 2008-05-15 | Shin Etsu Chem Co Ltd | 難燃性接着剤組成物、ならびにそれを用いた接着剤シート、カバーレイフィルムおよびフレキシブル銅張積層板 |
US7820740B2 (en) * | 2006-10-02 | 2010-10-26 | Shin-Etsu Chemical Co., Ltd. | Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same |
JP5362811B2 (ja) * | 2009-02-21 | 2013-12-11 | デクセリアルズ株式会社 | 保護膜形成用原料液、保護膜、保護膜付き配線基板 |
US9777138B2 (en) * | 2012-07-31 | 2017-10-03 | Adeka Corporation | Latent additive and composition containing latent additive |
JP2015163671A (ja) * | 2013-12-13 | 2015-09-10 | 株式会社Adeka | ラジカル重合性組成物 |
JP2016038569A (ja) * | 2014-08-05 | 2016-03-22 | 株式会社Adeka | 感光性組成物 |
JP6389751B2 (ja) * | 2014-12-05 | 2018-09-12 | 新日鉄住金化学株式会社 | ヒドロキシ樹脂、その製造方法、エポキシ樹脂組成物及びその硬化物 |
JP6762933B2 (ja) * | 2015-05-28 | 2020-09-30 | 大塚化学株式会社 | アリルフェノキシシクロホスファゼン化合物及びその製造方法 |
JP2019191303A (ja) | 2018-04-20 | 2019-10-31 | 積水化学工業株式会社 | 硬化性組成物、電子部品、電子部品の製造方法 |
TWI814900B (zh) * | 2018-09-14 | 2023-09-11 | 日商富士軟片股份有限公司 | 近紅外線吸收性感光性組成物、硬化膜、濾光器、圖案形成方法、積層體、固體攝像元件、圖像顯示裝置及紅外線感測器 |
JP7436176B2 (ja) * | 2018-10-25 | 2024-02-21 | 株式会社Adeka | 組成物、ソルダーレジスト組成物、硬化物及び硬化物の製造方法 |
-
2021
- 2021-10-07 WO PCT/JP2021/037246 patent/WO2022085475A1/ja active Application Filing
- 2021-10-07 JP JP2022556892A patent/JPWO2022085475A1/ja active Pending
- 2021-10-07 CN CN202180069197.2A patent/CN116368122A/zh active Pending
- 2021-10-07 KR KR1020237011811A patent/KR20230091872A/ko unknown
- 2021-10-13 TW TW110137903A patent/TW202222892A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
KR20230091872A (ko) | 2023-06-23 |
WO2022085475A1 (ja) | 2022-04-28 |
TW202222892A (zh) | 2022-06-16 |
CN116368122A (zh) | 2023-06-30 |