JPWO2022085475A1 - - Google Patents

Info

Publication number
JPWO2022085475A1
JPWO2022085475A1 JP2022556892A JP2022556892A JPWO2022085475A1 JP WO2022085475 A1 JPWO2022085475 A1 JP WO2022085475A1 JP 2022556892 A JP2022556892 A JP 2022556892A JP 2022556892 A JP2022556892 A JP 2022556892A JP WO2022085475 A1 JPWO2022085475 A1 JP WO2022085475A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022556892A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022085475A1 publication Critical patent/JPWO2022085475A1/ja
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/06—Ethers; Acetals; Ketals; Ortho-esters
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C69/00—Esters of carboxylic acids; Esters of carbonic or haloformic acids
    • C07C69/96—Esters of carbonic or haloformic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/13—Phenols; Phenolates
    • C08K5/134—Phenols containing ester groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
    • C08K5/24—Derivatives of hydrazine
    • C08K5/25—Carboxylic acid hydrazides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472—Five-membered rings
    • C08K5/3475—Five-membered rings condensed with carbocyclic rings
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/16—Nitrogen-containing compounds
    • C08K5/34—Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477—Six-membered rings
    • C08K5/3492—Triazines
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022556892A 2020-10-21 2021-10-07 Pending JPWO2022085475A1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020176962 2020-10-21
PCT/JP2021/037246 WO2022085475A1 (ja) 2020-10-21 2021-10-07 組成物、硬化物、硬化物の製造方法及び添加剤

Publications (1)

Publication Number Publication Date
JPWO2022085475A1 true JPWO2022085475A1 (ko) 2022-04-28

Family

ID=81290359

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022556892A Pending JPWO2022085475A1 (ko) 2020-10-21 2021-10-07

Country Status (5)

Country Link
JP (1) JPWO2022085475A1 (ko)
KR (1) KR20230091872A (ko)
CN (1) CN116368122A (ko)
TW (1) TW202222892A (ko)
WO (1) WO2022085475A1 (ko)

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3888823A (en) * 1972-10-13 1975-06-10 Cincinnati Milacron Inc Methoxy carboxylic acid ester ultraviolet stabilizers for polymers
JPH0643630A (ja) * 1991-05-28 1994-02-18 Nippon Kayaku Co Ltd 酸分解性化合物及びそれを含有するポジ型感放射線性レジスト組成物
US5556973A (en) * 1994-07-27 1996-09-17 Ciba-Geigy Corporation Red-shifted tris-aryl-s-triazines and compositions stabilized therewith
JP3637277B2 (ja) * 2000-03-21 2005-04-13 大塚化学ホールディングス株式会社 難燃剤、及び難燃性樹脂組成物、及び成形物、及び電子部品
JP2002188077A (ja) * 2000-10-10 2002-07-05 Fuji Photo Film Co Ltd 紫外線吸収剤前駆体を含有する組成物、及び画像形成方法
JP2004157231A (ja) * 2002-11-05 2004-06-03 Konica Minolta Holdings Inc ドライイメージング材料
KR20060017934A (ko) * 2004-08-23 2006-02-28 미원상사주식회사 평판 인쇄판용 포지티브형 감광성 조성물 및 그를 위한현상액 조성물
TWI495632B (zh) * 2004-12-24 2015-08-11 Mitsubishi Gas Chemical Co 光阻用化合物
JP2008111102A (ja) * 2006-10-02 2008-05-15 Shin Etsu Chem Co Ltd 難燃性接着剤組成物、ならびにそれを用いた接着剤シート、カバーレイフィルムおよびフレキシブル銅張積層板
US7820740B2 (en) * 2006-10-02 2010-10-26 Shin-Etsu Chemical Co., Ltd. Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same
KR20110122681A (ko) * 2009-02-21 2011-11-10 소니 케미카루 앤드 인포메이션 디바이스 가부시키가이샤 보호막 형성용 원료액, 보호막, 보호막을 구비한 배선 기판
EP2881450B1 (en) * 2012-07-31 2020-09-09 Adeka Corporation Latent additive and composition containing latent additive
JP2015163671A (ja) * 2013-12-13 2015-09-10 株式会社Adeka ラジカル重合性組成物
JP2016038569A (ja) * 2014-08-05 2016-03-22 株式会社Adeka 感光性組成物
JP6389751B2 (ja) * 2014-12-05 2018-09-12 新日鉄住金化学株式会社 ヒドロキシ樹脂、その製造方法、エポキシ樹脂組成物及びその硬化物
US10435422B2 (en) * 2015-05-28 2019-10-08 Otsuka Chemical Co., Ltd. Allyl-phenoxy-cyclophosphazene compound, and production method therefor
JP2019191303A (ja) 2018-04-20 2019-10-31 積水化学工業株式会社 硬化性組成物、電子部品、電子部品の製造方法
TWI814900B (zh) * 2018-09-14 2023-09-11 日商富士軟片股份有限公司 近紅外線吸收性感光性組成物、硬化膜、濾光器、圖案形成方法、積層體、固體攝像元件、圖像顯示裝置及紅外線感測器
JP7436176B2 (ja) * 2018-10-25 2024-02-21 株式会社Adeka 組成物、ソルダーレジスト組成物、硬化物及び硬化物の製造方法

Also Published As

Publication number Publication date
CN116368122A (zh) 2023-06-30
TW202222892A (zh) 2022-06-16
WO2022085475A1 (ja) 2022-04-28
KR20230091872A (ko) 2023-06-23

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