JPWO2022082067A5 - - Google Patents

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Publication number
JPWO2022082067A5
JPWO2022082067A5 JP2023521761A JP2023521761A JPWO2022082067A5 JP WO2022082067 A5 JPWO2022082067 A5 JP WO2022082067A5 JP 2023521761 A JP2023521761 A JP 2023521761A JP 2023521761 A JP2023521761 A JP 2023521761A JP WO2022082067 A5 JPWO2022082067 A5 JP WO2022082067A5
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JP
Japan
Prior art keywords
section
liquid refrigerant
reservoir
heat pipe
evaporator
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023521761A
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English (en)
Japanese (ja)
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JP2023545434A (ja
Publication date
Application filed filed Critical
Priority claimed from PCT/US2021/055312 external-priority patent/WO2022082067A1/en
Publication of JP2023545434A publication Critical patent/JP2023545434A/ja
Publication of JPWO2022082067A5 publication Critical patent/JPWO2022082067A5/ja
Pending legal-status Critical Current

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JP2023521761A 2020-10-16 2021-10-15 新規なヒートパイプ構成 Pending JP2023545434A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN2020121546 2020-10-16
CNPCT/CN2020/121546 2020-10-16
PCT/US2021/055312 WO2022082067A1 (en) 2020-10-16 2021-10-15 Novel heat pipe configurations

Publications (2)

Publication Number Publication Date
JP2023545434A JP2023545434A (ja) 2023-10-30
JPWO2022082067A5 true JPWO2022082067A5 (enrdf_load_stackoverflow) 2024-10-17

Family

ID=81184841

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023521761A Pending JP2023545434A (ja) 2020-10-16 2021-10-15 新規なヒートパイプ構成

Country Status (7)

Country Link
US (2) US20220124945A1 (enrdf_load_stackoverflow)
EP (1) EP4229347A4 (enrdf_load_stackoverflow)
JP (1) JP2023545434A (enrdf_load_stackoverflow)
KR (1) KR20230087578A (enrdf_load_stackoverflow)
CN (1) CN116391450A (enrdf_load_stackoverflow)
TW (1) TW202235803A (enrdf_load_stackoverflow)
WO (1) WO2022082067A1 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023081401A1 (en) * 2021-11-05 2023-05-11 Rochester Institute Of Technology Cooling device having a boiling chamber with submerged condensation and method
KR102700294B1 (ko) * 2023-12-29 2024-08-29 염원중 데이터센터 서버랙용 저전력 방열 시스템
TWI884790B (zh) * 2024-05-23 2025-05-21 其陽科技股份有限公司 浸沒式冷卻系統

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6981543B2 (en) * 2001-09-20 2006-01-03 Intel Corporation Modular capillary pumped loop cooling system
US8534348B2 (en) * 2005-09-01 2013-09-17 Molex Incorporated Heat pipe and method for manufacturing same
JP4352091B2 (ja) * 2008-03-27 2009-10-28 株式会社東芝 電子機器、冷却装置
CN102387693A (zh) * 2010-09-06 2012-03-21 鸿富锦精密工业（深圳）有限公司 散热装置及使用该散热装置的电子装置
EP2940416B1 (en) * 2012-12-28 2017-09-27 Ibérica del Espacio, S.A. Loop heat pipe apparatus for heat transfer and thermal control
CN103796491A (zh) * 2014-01-24 2014-05-14 东莞汉旭五金塑胶科技有限公司 携带式电子装置之散热装置
US9625215B2 (en) * 2014-09-21 2017-04-18 Htc Corporation Electronic device and heat dissipation plate
US10234915B2 (en) * 2015-09-09 2019-03-19 Htc Corporation Graphite thermal conductor, electronic device and method for manufacturing graphite thermal conductor
WO2017195254A1 (ja) * 2016-05-09 2017-11-16 富士通株式会社 ループヒートパイプ及びその製造方法並びに電子機器
KR102015917B1 (ko) * 2018-01-02 2019-08-29 엘지전자 주식회사 열전 모듈을 이용하는 냉각 장치
JP2019132456A (ja) * 2018-01-29 2019-08-08 株式会社デンソー 車両用サーモサイフォン式冷却装置
WO2019198860A1 (ko) * 2018-04-09 2019-10-17 엘지전자 주식회사 이동 단말기
US10830514B2 (en) * 2018-06-21 2020-11-10 Lennox Industries Inc. Method and apparatus for charge compensator reheat valve
JP7204374B2 (ja) * 2018-08-13 2023-01-16 新光電気工業株式会社 ループ型ヒートパイプ及びその製造方法
CN110779365A (zh) * 2019-12-04 2020-02-11 东莞市万维热传导技术有限公司 一种热源分布多样的吹胀式铝均温板
CN111741650B (zh) * 2020-06-19 2024-11-12 浙江嘉熙科技股份有限公司 热超导散热板、散热器及5g基站设备
WO2021253813A1 (zh) * 2020-06-19 2021-12-23 浙江嘉熙科技股份有限公司 热超导散热板、散热器及5g基站设备
FR3114684B1 (fr) * 2020-09-29 2022-09-30 Alstom Transp Tech Module de puissance électrique avec système de refroidissement

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