JPWO2022075409A1 - - Google Patents

Info

Publication number
JPWO2022075409A1
JPWO2022075409A1 JP2022555561A JP2022555561A JPWO2022075409A1 JP WO2022075409 A1 JPWO2022075409 A1 JP WO2022075409A1 JP 2022555561 A JP2022555561 A JP 2022555561A JP 2022555561 A JP2022555561 A JP 2022555561A JP WO2022075409 A1 JPWO2022075409 A1 JP WO2022075409A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022555561A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022075409A1 publication Critical patent/JPWO2022075409A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
    • C04B37/02—Joining burned ceramic articles with other burned ceramic articles or other articles by heating with metallic articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49866—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
JP2022555561A 2020-10-07 2021-10-07 Pending JPWO2022075409A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020169538 2020-10-07
PCT/JP2021/037152 WO2022075409A1 (ja) 2020-10-07 2021-10-07 接合体、セラミックス回路基板、および半導体装置

Publications (1)

Publication Number Publication Date
JPWO2022075409A1 true JPWO2022075409A1 (ja) 2022-04-14

Family

ID=81126526

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022555561A Pending JPWO2022075409A1 (ja) 2020-10-07 2021-10-07

Country Status (5)

Country Link
US (1) US20230187310A1 (ja)
EP (1) EP4227284A1 (ja)
JP (1) JPWO2022075409A1 (ja)
CN (1) CN115989579A (ja)
WO (1) WO2022075409A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024009851A1 (ja) * 2022-07-05 2024-01-11 株式会社 東芝 接合体、セラミックス回路基板、半導体装置、及び接合体の製造方法
CN116082055B (zh) * 2023-01-18 2023-09-26 潮州三环（集团）股份有限公司 一种拼接陶瓷及其制备方法与应用

Family Cites Families (37)

* Cited by examiner, † Cited by third party
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JPH0729859B2 (ja) * 1985-09-05 1995-04-05 株式会社東芝 セラミツクス−金属接合部材
JP4077888B2 (ja) * 1995-07-21 2008-04-23 株式会社東芝 セラミックス回路基板
JPH09249462A (ja) * 1996-03-12 1997-09-22 Ngk Insulators Ltd 接合体、その製造方法およびセラミックス部材用ろう材
JP3834351B2 (ja) * 1996-04-09 2006-10-18 株式会社東芝 セラミックス回路基板
JP3515334B2 (ja) * 1996-08-30 2004-04-05 日本特殊陶業株式会社 セラミックと金属との接合体
JP3445461B2 (ja) * 1997-03-13 2003-09-08 株式会社東芝 ハンダ接合方法および超音波センサー
JP2005095977A (ja) * 2003-08-26 2005-04-14 Sanyo Electric Co Ltd 回路装置
JP3887645B2 (ja) * 2005-07-19 2007-02-28 株式会社東芝 セラミックス回路基板の製造方法
JP2007173577A (ja) * 2005-12-22 2007-07-05 Hitachi Metals Ltd セラミックス回路基板
US20080035707A1 (en) * 2006-08-14 2008-02-14 The Regents Of The University Of California Transient-liquid-phase joining of ceramics at low temperatures
US20100068552A1 (en) * 2008-03-31 2010-03-18 Infineon Technologies Ag Module including a stable solder joint
JP5976678B2 (ja) * 2011-12-20 2016-08-24 株式会社東芝 セラミックス銅回路基板
JP6319643B2 (ja) * 2012-02-29 2018-05-09 日立金属株式会社 セラミックス−銅接合体およびその製造方法
JP6111764B2 (ja) * 2013-03-18 2017-04-12 三菱マテリアル株式会社 パワーモジュール用基板の製造方法
JP5672324B2 (ja) * 2013-03-18 2015-02-18 三菱マテリアル株式会社 接合体の製造方法及びパワーモジュール用基板の製造方法
JP6287682B2 (ja) * 2013-08-26 2018-03-07 三菱マテリアル株式会社 接合体及びパワーモジュール用基板
JP6079505B2 (ja) * 2013-08-26 2017-02-15 三菱マテリアル株式会社 接合体及びパワーモジュール用基板
CN105452195B (zh) * 2013-09-30 2018-01-02 三菱综合材料株式会社 Cu‑陶瓷接合体、Cu‑陶瓷接合体的制造方法及功率模块用基板
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WO2016079881A1 (ja) * 2014-11-21 2016-05-26 株式会社日立製作所 半導体パワーモジュールおよびその製造方法ならびに移動体
KR20180109851A (ko) * 2015-11-06 2018-10-08 이노막 21, 소시에다드 리미타다 금속 부품의 경제적 제조를 위한 방법
JP6569511B2 (ja) * 2015-12-17 2019-09-04 三菱マテリアル株式会社 接合体、冷却器付きパワーモジュール用基板、冷却器付きパワーモジュール用基板の製造方法
JP6819299B2 (ja) * 2016-01-22 2021-01-27 三菱マテリアル株式会社 接合体、パワーモジュール用基板、接合体の製造方法及びパワーモジュール用基板の製造方法
US10453783B2 (en) * 2016-05-19 2019-10-22 Mitsubishi Materials Corporation Power module substrate
EP3471517A4 (en) * 2016-06-10 2019-06-05 Tanaka Kikinzoku Kogyo K.K. CERAMIC CONDUCTOR PLATE AND METHOD FOR PRODUCING A CERAMIC CONDUCTOR PLATE
JP6904088B2 (ja) * 2016-06-30 2021-07-14 三菱マテリアル株式会社 銅／セラミックス接合体、及び、絶縁回路基板
WO2018003845A1 (ja) * 2016-06-30 2018-01-04 三菱マテリアル株式会社 銅／セラミックス接合体、及び、絶縁回路基板
JP7013374B2 (ja) 2016-07-28 2022-01-31 株式会社東芝 接合体、回路基板、および半導体装置
KR20180017635A (ko) * 2016-08-10 2018-02-21 주식회사 아모센스 고주파 기판과 그 제조 방법
CN106312220A (zh) * 2016-10-12 2017-01-11 哈尔滨工业大学（威海） 一种功率模块用陶瓷基板覆铜的低温连接方法
CN106514039B (zh) * 2016-11-03 2019-03-08 华北水利水电大学 一种铜锡钛钎料及其制备方法
CN110537256A (zh) 2017-04-25 2019-12-03 电化株式会社 陶瓷电路基板及其制造方法和使用了该陶瓷电路基板的组件
US11570890B2 (en) * 2017-05-30 2023-01-31 Denka Company Limited Ceramic circuit board and module using same
EP4006002A4 (en) * 2019-07-23 2023-09-06 NGK Insulators, Ltd. BONDED SUBSTRATE AND METHOD FOR PRODUCING A BONDED SUBSTRATE
KR20220116213A (ko) * 2019-12-19 2022-08-22 미쓰비시 마테리알 가부시키가이샤 구리/세라믹스 접합체, 및, 절연 회로 기판
WO2023234286A1 (ja) * 2022-06-02 2023-12-07 株式会社 東芝 セラミックス回路基板およびそれを用いた半導体装置
CN117362066A (zh) * 2022-07-01 2024-01-09 比亚迪股份有限公司 陶瓷覆铜基板及其制备方法

Also Published As

Publication number Publication date
US20230187310A1 (en) 2023-06-15
EP4227284A1 (en) 2023-08-16
WO2022075409A1 (ja) 2022-04-14
CN115989579A (zh) 2023-04-18

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