JPWO2022070871A1 - - Google Patents

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Publication number
JPWO2022070871A1
JPWO2022070871A1 JP2022553777A JP2022553777A JPWO2022070871A1 JP WO2022070871 A1 JPWO2022070871 A1 JP WO2022070871A1 JP 2022553777 A JP2022553777 A JP 2022553777A JP 2022553777 A JP2022553777 A JP 2022553777A JP WO2022070871 A1 JPWO2022070871 A1 JP WO2022070871A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022553777A
Other languages
Japanese (ja)
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JP7786384B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2022070871A1 publication Critical patent/JPWO2022070871A1/ja
Application granted granted Critical
Publication of JP7786384B2 publication Critical patent/JP7786384B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0388—Macromolecular compounds which are rendered insoluble or differentially wettable with ethylenic or acetylenic bands in the side chains of the photopolymer
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F299/00—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers
    • C08F299/02—Macromolecular compounds obtained by interreacting polymers involving only carbon-to-carbon unsaturated bond reactions, in the absence of non-macromolecular monomers from unsaturated polycondensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
    • C08G61/04—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
    • C08G61/06—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/029—Inorganic compounds; Onium compounds; Organic compounds having hetero atoms other than oxygen, nitrogen or sulfur
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
    • G03F7/031—Organic compounds not covered by group G03F7/029
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

  • Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Materials For Photolithography (AREA)
JP2022553777A 2020-09-29 2021-09-13 ネガ型感光性樹脂組成物 Active JP7786384B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020164168 2020-09-29
JP2020164168 2020-09-29
PCT/JP2021/033611 WO2022070871A1 (ja) 2020-09-29 2021-09-13 ネガ型感光性樹脂組成物

Publications (2)

Publication Number Publication Date
JPWO2022070871A1 true JPWO2022070871A1 (enExample) 2022-04-07
JP7786384B2 JP7786384B2 (ja) 2025-12-16

Family

ID=80951401

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022553777A Active JP7786384B2 (ja) 2020-09-29 2021-09-13 ネガ型感光性樹脂組成物

Country Status (6)

Country Link
US (1) US20230305397A1 (enExample)
JP (1) JP7786384B2 (enExample)
KR (1) KR102786311B1 (enExample)
CN (1) CN116075534B (enExample)
TW (1) TWI908883B (enExample)
WO (1) WO2022070871A1 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2023053976A1 (enExample) * 2021-09-29 2023-04-06

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11158022A (ja) * 1997-09-29 1999-06-15 Espe Dental Ag 開環複分解重合オリゴマー類とポリマー類を基剤とする歯科用組成物
JP2006106530A (ja) * 2004-10-08 2006-04-20 Sumitomo Bakelite Co Ltd 表示体装置カラーフィルター用感光性樹脂組成物及びこれを用いた表示装置、表示体装置の製造方法
JP2006139284A (ja) * 2005-11-10 2006-06-01 Jsr Corp 半導体デバイス製造用感放射線性樹脂組成物
JP2008026600A (ja) * 2006-07-21 2008-02-07 Shin Etsu Chem Co Ltd レジスト下層膜形成材料及びパターン形成方法
JP2011154264A (ja) * 2010-01-28 2011-08-11 Shibaura Institute Of Technology イオンビーム描画用ネガ型レジスト組成物及びパターン形成方法
WO2012132150A1 (ja) * 2011-03-28 2012-10-04 日本ゼオン株式会社 熱硬化性架橋環状オレフィン樹脂組成物、熱硬化性架橋環状オレフィン樹脂フィルム、熱硬化性架橋環状オレフィン樹脂組成物の製造方法及び熱硬化性架橋環状オレフィン樹脂フィルムの製造方法
JP2017525836A (ja) * 2014-08-07 2017-09-07 テルヌ エスアーエスＴｅｌｅｎｅ Ｓａｓ 硬化性組成物及びその組成物を含む成形品

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006156821A (ja) 2004-11-30 2006-06-15 Sumitomo Bakelite Co Ltd 樹脂組成物、樹脂層、樹脂層付きキャリア材料および回路基板
TWI636330B (zh) * 2013-05-29 2018-09-21 Sumitomo Bakelite Co., Ltd. 負型感光性樹脂組成物、電子裝置及聚合物
KR102614402B1 (ko) * 2017-01-10 2023-12-15 스미또모 베이크라이트 가부시키가이샤 네거티브형 감광성 수지 조성물, 수지막 및 전자 장치

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11158022A (ja) * 1997-09-29 1999-06-15 Espe Dental Ag 開環複分解重合オリゴマー類とポリマー類を基剤とする歯科用組成物
JP2006106530A (ja) * 2004-10-08 2006-04-20 Sumitomo Bakelite Co Ltd 表示体装置カラーフィルター用感光性樹脂組成物及びこれを用いた表示装置、表示体装置の製造方法
JP2006139284A (ja) * 2005-11-10 2006-06-01 Jsr Corp 半導体デバイス製造用感放射線性樹脂組成物
JP2008026600A (ja) * 2006-07-21 2008-02-07 Shin Etsu Chem Co Ltd レジスト下層膜形成材料及びパターン形成方法
JP2011154264A (ja) * 2010-01-28 2011-08-11 Shibaura Institute Of Technology イオンビーム描画用ネガ型レジスト組成物及びパターン形成方法
WO2012132150A1 (ja) * 2011-03-28 2012-10-04 日本ゼオン株式会社 熱硬化性架橋環状オレフィン樹脂組成物、熱硬化性架橋環状オレフィン樹脂フィルム、熱硬化性架橋環状オレフィン樹脂組成物の製造方法及び熱硬化性架橋環状オレフィン樹脂フィルムの製造方法
JP2017525836A (ja) * 2014-08-07 2017-09-07 テルヌ エスアーエスＴｅｌｅｎｅ Ｓａｓ 硬化性組成物及びその組成物を含む成形品

Also Published As

Publication number Publication date
TW202216820A (zh) 2022-05-01
CN116075534B (zh) 2025-08-01
US20230305397A1 (en) 2023-09-28
KR102786311B1 (ko) 2025-03-24
KR20230076126A (ko) 2023-05-31
TWI908883B (zh) 2025-12-21
WO2022070871A1 (ja) 2022-04-07
CN116075534A (zh) 2023-05-05
JP7786384B2 (ja) 2025-12-16

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