JPWO2022065006A1 - - Google Patents

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Publication number
JPWO2022065006A1
JPWO2022065006A1 JP2022551835A JP2022551835A JPWO2022065006A1 JP WO2022065006 A1 JPWO2022065006 A1 JP WO2022065006A1 JP 2022551835 A JP2022551835 A JP 2022551835A JP 2022551835 A JP2022551835 A JP 2022551835A JP WO2022065006 A1 JPWO2022065006 A1 JP WO2022065006A1
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JP
Japan
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JP2022551835A
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JP7477628B2 (ja
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Publication of JPWO2022065006A1 publication Critical patent/JPWO2022065006A1/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q17/00—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems
    • H01Q17/008—Devices for absorbing waves radiated from an antenna; Combinations of such devices with active antenna elements or systems with a particular shape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0075—Magnetic shielding materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
JP2022551835A 2020-09-28 2021-09-06 積層体の製造方法、アンテナインパッケージの製造方法、及び積層体 Active JP7477628B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020162310 2020-09-28
JP2020162310 2020-09-28
PCT/JP2021/032590 WO2022065006A1 (ja) 2020-09-28 2021-09-06 積層体の製造方法、アンテナインパッケージの製造方法、積層体及び組成物

Publications (2)

Publication Number Publication Date
JPWO2022065006A1 true JPWO2022065006A1 (ja) 2022-03-31
JP7477628B2 JP7477628B2 (ja) 2024-05-01

Family

ID=80845235

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022551835A Active JP7477628B2 (ja) 2020-09-28 2021-09-06 積層体の製造方法、アンテナインパッケージの製造方法、及び積層体

Country Status (5)

Country Link
US (1) US20230216175A1 (ja)
EP (1) EP4220859A4 (ja)
JP (1) JP7477628B2 (ja)
TW (1) TW202212157A (ja)
WO (1) WO2022065006A1 (ja)

Family Cites Families (62)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59173404A (ja) 1983-03-23 1984-10-01 株式会社　東洋内燃機工業社 路面塗装機の塗膜厚さ調節装置
JPS6288141A (ja) * 1985-10-14 1987-04-22 Fuji Photo Film Co Ltd 磁気記録媒体製造方法
SG77689A1 (en) 1998-06-26 2001-01-16 Ciba Sc Holding Ag New o-acyloxime photoinitiators
DK199901098A (da) 1998-08-18 2000-02-19 Ciba Sc Holding Ag Sylfonyloximer til i-linie-fotoresists med høj følsomhed og høj resisttykkelse
NL1016815C2 (nl) 1999-12-15 2002-05-14 Ciba Sc Holding Ag Oximester-fotoinitiatoren.
CN100528838C (zh) 2001-06-11 2009-08-19 西巴特殊化学品控股有限公司 具有复合结构的肟酯光引发剂
JP4415322B2 (ja) 2005-04-22 2010-02-17 日立金属株式会社 磁性体で封止したアンテナを有する電子回路
US8025237B2 (en) * 2006-01-20 2011-09-27 Panasonic Corporation Antenna built-in module, card type information device, and methods for manufacturing them
KR101474900B1 (ko) 2006-09-27 2014-12-19 후지필름 가부시키가이샤 화합물 또는 이것의 토토머, 금속착체 화합물, 착색 감광성경화 조성물, 컬러필터, 및 제조
EP2072500B1 (en) 2006-12-27 2012-09-26 Adeka Corporation Oxime ester compound and photopolymerization initiator containing the compound
KR101485436B1 (ko) 2007-03-20 2015-01-23 도레이 카부시키가이샤 흑색 수지 조성물, 수지 블랙 매트릭스, 컬러 필터 및 액정표시장치
US8349548B2 (en) 2007-05-11 2013-01-08 Basf Se Oxime ester photoinitiators
EP2285836B1 (en) 2008-06-06 2012-01-18 Basf Se Photoinitiator mixtures
JP5371313B2 (ja) 2008-07-28 2013-12-18 富士フイルム株式会社 カラーフィルタ用着色硬化性組成物、カラーフィルタ、カラーフィルタの製造方法、及び液晶表示素子
JP5577659B2 (ja) 2008-09-18 2014-08-27 東レ株式会社 感光性黒色樹脂組成物、樹脂ブラックマトリクス基板、カラーフィルター基板および液晶表示装置
JP2010164965A (ja) 2008-12-19 2010-07-29 Mitsubishi Chemicals Corp カラーフィルタ画素形成用組成物、カラーフィルタ、液晶表示装置及び有機ｅｌディスプレイ
JP5702925B2 (ja) 2008-12-26 2015-04-15 株式会社日本触媒 α−アリルオキシメチルアクリル酸系重合体及びその製造方法
JP2010262028A (ja) 2009-04-30 2010-11-18 Nippon Steel Chem Co Ltd ブラックマトリックス用感光性樹脂組成物
TWI605063B (zh) 2009-11-25 2017-11-11 住友化學股份有限公司 Resin composition and display device
EP2550307B1 (en) 2010-03-22 2017-11-22 Henkel IP & Holding GmbH Macro-photoinitiators and curable compositions thereof
JP2012014052A (ja) 2010-07-02 2012-01-19 Fujifilm Corp 着色感光性樹脂組成物、カラーフィルタ、カラーフィルタの製造方法、及び液晶表示装置
TWI520940B (zh) 2010-10-05 2016-02-11 巴地斯顏料化工廠 肟酯
US9386688B2 (en) * 2010-11-12 2016-07-05 Freescale Semiconductor, Inc. Integrated antenna package
JP5851141B2 (ja) 2011-07-29 2016-02-03 富士フイルム株式会社 着色硬化性組成物、着色硬化膜、カラーフィルタ、パターン形成方法、カラーフィルタの製造方法、固体撮像素子及び画像表示装置
JP2013114249A (ja) 2011-12-01 2013-06-10 Toppan Printing Co Ltd 黒色感光性樹脂組成物およびカラーフィルタ
KR102006041B1 (ko) 2011-12-07 2019-07-31 바스프 에스이 옥심 에스테르 광개시제
JP5772642B2 (ja) 2012-02-09 2015-09-02 Jsr株式会社 硬化性樹脂組成物、表示素子用硬化膜、表示素子用硬化膜の形成方法及び表示素子
JP6026757B2 (ja) 2012-03-12 2016-11-16 東京応化工業株式会社 感光性樹脂組成物、カラーフィルタ、表示装置、光重合開始剤、及び化合物
KR101968462B1 (ko) 2012-05-09 2019-04-11 바스프 에스이 옥심 에스테르 광개시제
JP5946389B2 (ja) 2012-07-27 2016-07-06 富士フイルム株式会社 近赤外線吸収性組成物、これを用いた近赤外線カットフィルタ及びその製造方法、並びに、カメラモジュール及びその製造方法
JP6170673B2 (ja) 2012-12-27 2017-07-26 富士フイルム株式会社 カラーフィルタ用組成物、赤外線透過フィルタ及びその製造方法、並びに赤外線センサー
JP6065596B2 (ja) 2013-01-16 2017-01-25 Jsr株式会社 感放射線性着色組成物、着色硬化膜及び表示素子
US20140374645A1 (en) 2013-06-24 2014-12-25 Fujifilm Corporation Magnetic recording medium and coating composition for magnetic recording medium
JP6469669B2 (ja) 2013-07-08 2019-02-13 ビーエーエスエフ ソシエタス・ヨーロピアＢａｓｆ Ｓｅ オキシムエステル光開始剤
EP3044208B1 (en) 2013-09-10 2021-12-22 Basf Se Oxime ester photoinitiators
JP2015068893A (ja) 2013-09-27 2015-04-13 東レ株式会社 樹脂ブラックマトリクス基板
JP6198058B2 (ja) 2013-12-19 2017-09-20 Dic株式会社 界面活性剤組成物、コーティング組成物及びレジスト組成物
CN103819583B (zh) 2014-03-18 2016-05-18 常州强力电子新材料股份有限公司 一种含硝基双肟酯类光引发剂及其制备方法和应用
KR102369426B1 (ko) 2014-04-04 2022-03-03 가부시키가이샤 아데카 옥심에스테르 화합물 및 상기 화합물을 함유하는 광중합 개시제
KR20190021493A (ko) 2014-05-01 2019-03-05 후지필름 가부시키가이샤 착색 조성물, 막, 컬러 필터, 패턴 형성 방법, 컬러 필터의 제조 방법, 고체 촬상 소자 및 적외선 센서
CN104076606B (zh) 2014-07-15 2019-12-03 常州强力电子新材料股份有限公司 一种含肟酯类光引发剂的感光性组合物及其应用
US10113075B2 (en) 2014-09-04 2018-10-30 Igm Malta Limited Polycyclic photoinitiators
KR102047079B1 (ko) 2015-03-11 2019-12-02 동우 화인켐 주식회사 청색 감광성 수지 조성물, 컬러필터 및 이를 포함하는 액정표시장치
JP6628072B2 (ja) 2015-05-20 2020-01-08 Dic株式会社 フッ素系界面活性剤およびこれを含有する組成物
WO2017033680A1 (ja) 2015-08-26 2017-03-02 パナソニックヘルスケアホールディングス株式会社 超低温フリーザ
JP6799540B2 (ja) 2015-09-25 2020-12-16 株式会社Adeka オキシムエステル化合物及び該化合物を含有する重合開始剤
JP2017118015A (ja) 2015-12-25 2017-06-29 株式会社トーキン 電子装置及び電磁干渉抑制体の配置方法
JP6750249B2 (ja) 2016-02-26 2020-09-02 東洋インキＳｃホールディングス株式会社 感光性着色組成物およびカラーフィルタ
JP6762739B2 (ja) 2016-03-17 2020-09-30 株式会社Ｄｎｐファインケミカル カラーフィルタ用感光性着色樹脂組成物、カラーフィルタ、表示装置
KR20180124013A (ko) 2016-03-25 2018-11-20 도레이 카부시키가이샤 착색 수지 조성물, 컬러 필터 기판, 및 액정 표시 장치
JP6860978B2 (ja) 2016-04-27 2021-04-21 東京応化工業株式会社 感光性組成物
KR20190091439A (ko) 2016-12-13 2019-08-06 니치유 가부시키가이샤 퍼옥시신나메이트 유도체, 그 화합물을 함유하는 중합성 조성물
KR102542689B1 (ko) 2017-06-01 2023-06-12 니치유 가부시키가이샤 트리아진퍼옥사이드 유도체, 그 화합물을 함유하는 중합성 조성물
JP6995309B2 (ja) 2017-08-31 2022-01-14 学校法人東京理科大学 ペルオキシエステル基を有するチオキサントン誘導体を含有する重合性組成物およびその硬化物、当該硬化物の製造方法
JP6923130B2 (ja) 2017-08-31 2021-08-18 学校法人東京理科大学 ペルオキシエステル基を有するベンゾフェノン誘導体、該化合物を含有する重合性組成物およびその硬化物、当該硬化物の製造方法
JPWO2019088055A1 (ja) 2017-10-30 2020-12-10 株式会社Adeka 化合物、組成物、硬化物及び硬化物の製造方法
JP6970922B2 (ja) 2018-03-26 2021-11-24 日油株式会社 ペルオキシシンナメート誘導体、該化合物を含有する重合性組成物およびその硬化物、並びに当該硬化物の製造方法
JP7205089B2 (ja) 2018-07-04 2023-01-17 三菱ケミカル株式会社 感光性樹脂組成物、隔壁、有機電界発光素子、画像表示装置及び照明
TWI677492B (zh) 2018-07-17 2019-11-21 奇鈦科技股份有限公司 液態光引發化合物及其應用
CN112996772B (zh) 2018-10-24 2022-10-28 三菱材料电子化成株式会社 含氟酰亚胺盐化合物及表面活性剂
JP7000301B2 (ja) 2018-12-12 2022-01-19 日東電工株式会社 電磁波吸収体
US11723181B2 (en) * 2019-03-01 2023-08-08 Lintec Corporation Electromagnetic wave absorption film, electromagnetic wave absorption sheet

Also Published As

Publication number Publication date
TW202212157A (zh) 2022-04-01
EP4220859A4 (en) 2024-03-27
EP4220859A1 (en) 2023-08-02
JP7477628B2 (ja) 2024-05-01
US20230216175A1 (en) 2023-07-06
WO2022065006A1 (ja) 2022-03-31

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