JPWO2022051057A5 - - Google Patents

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Publication number
JPWO2022051057A5
JPWO2022051057A5 JP2023513279A JP2023513279A JPWO2022051057A5 JP WO2022051057 A5 JPWO2022051057 A5 JP WO2022051057A5 JP 2023513279 A JP2023513279 A JP 2023513279A JP 2023513279 A JP2023513279 A JP 2023513279A JP WO2022051057 A5 JPWO2022051057 A5 JP WO2022051057A5
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JP
Japan
Prior art keywords
chamber lid
airflow
apertures
chamber
aperture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2023513279A
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English (en)
Japanese (ja)
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JP2023539241A (ja
JP7564338B2 (ja
Publication date
Priority claimed from US17/010,518 external-priority patent/US20220064785A1/en
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Publication of JP2023539241A publication Critical patent/JP2023539241A/ja
Publication of JPWO2022051057A5 publication Critical patent/JPWO2022051057A5/ja
Application granted granted Critical
Publication of JP7564338B2 publication Critical patent/JP7564338B2/ja
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JP2023513279A 2020-09-02 2021-08-06 気相粒子低減のための装置及び方法 Active JP7564338B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17/010,518 US20220064785A1 (en) 2020-09-02 2020-09-02 Apparatus and methods for gas phase particle reduction
US17/010,518 2020-09-02
PCT/US2021/045077 WO2022051057A1 (en) 2020-09-02 2021-08-06 Apparatus and methods for gas phase particle reduction

Publications (3)

Publication Number Publication Date
JP2023539241A JP2023539241A (ja) 2023-09-13
JPWO2022051057A5 true JPWO2022051057A5 (zh) 2024-07-17
JP7564338B2 JP7564338B2 (ja) 2024-10-08

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ID=80358248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023513279A Active JP7564338B2 (ja) 2020-09-02 2021-08-06 気相粒子低減のための装置及び方法

Country Status (5)

Country Link
US (1) US20220064785A1 (zh)
JP (1) JP7564338B2 (zh)
KR (1) KR20230061452A (zh)
TW (1) TW202242171A (zh)
WO (1) WO2022051057A1 (zh)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6744020B2 (en) * 2001-01-04 2004-06-01 Tokyo Electron Limited Heat processing apparatus
US20020100557A1 (en) * 2001-01-29 2002-08-01 Applied Materials, Inc. ICP window heater integrated with faraday shield or floating electrode between the source power coil and the ICP window
JP4381963B2 (ja) 2003-11-19 2009-12-09 パナソニック株式会社 プラズマ処理装置
US20050145341A1 (en) * 2003-11-19 2005-07-07 Masaki Suzuki Plasma processing apparatus
JP4943669B2 (ja) * 2005-06-08 2012-05-30 東京エレクトロン株式会社 真空装置のシール構造
US20100193510A1 (en) * 2009-02-02 2010-08-05 Danilychev Vladimir A Wireless radiative system
JP5136574B2 (ja) * 2009-05-01 2013-02-06 東京エレクトロン株式会社 プラズマ処理装置及びプラズマ処理方法
JP4887440B2 (ja) 2010-04-20 2012-02-29 シャープ株式会社 プラズマ処理装置、プラズマ処理方法および半導体素子の製造方法
KR101477292B1 (ko) 2012-12-20 2014-12-29 엘아이지에이디피 주식회사 기판 처리장치
US9631417B2 (en) * 2012-12-21 2017-04-25 Milgard Manufacturing Incorporated Screen corner attachment
US10249475B2 (en) * 2014-04-01 2019-04-02 Applied Materials, Inc. Cooling mechanism utlized in a plasma reactor with enhanced temperature regulation
KR101565534B1 (ko) * 2014-11-25 2015-11-13 주식회사 원익아이피에스 진공처리장치
US20180142355A1 (en) * 2016-11-18 2018-05-24 Adnanotek Corp. System integrating atomic layer deposition and reactive ion etching
KR20190071520A (ko) * 2017-12-14 2019-06-24 이재섭 윈도우 히팅 시스템

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