JPWO2022050425A1 - - Google Patents

Info

Publication number
JPWO2022050425A1
JPWO2022050425A1 JP2022547009A JP2022547009A JPWO2022050425A1 JP WO2022050425 A1 JPWO2022050425 A1 JP WO2022050425A1 JP 2022547009 A JP2022547009 A JP 2022547009A JP 2022547009 A JP2022547009 A JP 2022547009A JP WO2022050425 A1 JPWO2022050425 A1 JP WO2022050425A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022547009A
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022050425A1 publication Critical patent/JPWO2022050425A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0083—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive non-fibrous particles embedded in an electrically insulating supporting structure, e.g. powder, flakes, whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/11—Compounds containing metals of Groups 4 to 10 or of Groups 14 to 16 of the Periodic Table
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/01—Magnetic additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • C08K5/101—Esters; Ether-esters of monocarboxylic acids
    • C08K5/103—Esters; Ether-esters of monocarboxylic acids with polyalcohols

Landscapes

  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Soft Magnetic Materials (AREA)
JP2022547009A 2020-09-07 2021-09-07 Pending JPWO2022050425A1 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020149956 2020-09-07
PCT/JP2021/032862 WO2022050425A1 (ja) 2020-09-07 2021-09-07 電磁波シールド性能を有する熱可塑性樹脂組成物ならびに成形部品

Publications (1)

Publication Number Publication Date
JPWO2022050425A1 true JPWO2022050425A1 (ja) 2022-03-10

Family

ID=80491988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022547009A Pending JPWO2022050425A1 (ja) 2020-09-07 2021-09-07

Country Status (4)

Country Link
EP (1) EP4212590A4 (ja)
JP (1) JPWO2022050425A1 (ja)
CN (1) CN115605550A (ja)
WO (1) WO2022050425A1 (ja)

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6479342A (en) 1986-12-15 1989-03-24 Hitachi Metals Ltd Fe-base soft magnetic alloy and its production
JP2888370B2 (ja) 1990-09-26 1999-05-10 東京エレクトロン株式会社 基板の整列装置
JPH0810231Y2 (ja) * 1991-07-03 1996-03-27 北川工業株式会社 広周波数帯シールド用部材
JPH05145271A (ja) 1991-11-25 1993-06-11 Bando Chem Ind Ltd 筒状電磁波遮蔽装置
JPH11298187A (ja) 1998-04-09 1999-10-29 Hitachi Metals Ltd ＧＨｚ帯の電波吸収特性に優れたノイズ抑制シート
JP2004221602A (ja) * 2004-01-19 2004-08-05 Nec Tokin Corp Ｅｍｉ対策部品及びそれを備えた能動素子
JP4195400B2 (ja) 2004-02-13 2008-12-10 電気化学工業株式会社 電磁波吸収体の製造方法
JP4362403B2 (ja) 2004-03-30 2009-11-11 国立大学法人福井大学 電磁波シールド材
JP4557301B2 (ja) 2004-08-18 2010-10-06 メディカル・エイド株式会社 電磁波遮断ネットおよび金属シールド・シートを用いたインナーウエア
KR20150038751A (ko) 2008-08-22 2015-04-08 아키히로 마키노 합금 조성물, Ｆｅ계 나노 결정 합금 및 그 제조 방법, 및 자성 부품
KR101267272B1 (ko) * 2008-12-30 2013-05-23 제일모직주식회사 수지 조성물
JP2012151206A (ja) * 2011-01-18 2012-08-09 Daicel Polymer Ltd 電磁波シールド性複合成形体とその製造方法
JP5912349B2 (ja) * 2011-09-02 2016-04-27 Ｎｅｃトーキン株式会社 軟磁性合金粉末、ナノ結晶軟磁性合金粉末、その製造方法、および圧粉磁心
JP6195693B2 (ja) * 2011-11-02 2017-09-13 株式会社トーキン 軟磁性合金、軟磁性合金磁心およびその製造方法
JP6467140B2 (ja) * 2013-05-30 2019-02-06 ダイセルポリマー株式会社 ミリ波の遮蔽性能を有している成形体用の熱可塑性樹脂組成物
KR20150111469A (ko) 2014-03-25 2015-10-06 (주)엘지하우시스 전자기파 차폐시트, 및 이의 제조방법
JP6842824B2 (ja) * 2014-11-25 2021-03-17 株式会社トーキン 金属軟磁性合金と磁心の製造方法
JP6651082B2 (ja) * 2015-07-31 2020-02-19 Ｊｆｅスチール株式会社 軟磁性圧粉磁芯の製造方法
KR101772871B1 (ko) * 2016-07-11 2017-08-30 주식회사 두산 안테나 모듈 형성용 복합기판 및 이의 제조방법
KR101896435B1 (ko) * 2016-11-09 2018-09-07 엔트리움 주식회사 전자파차폐용 전자부품 패키지 및 그의 제조방법

Also Published As

Publication number Publication date
WO2022050425A1 (ja) 2022-03-10
EP4212590A1 (en) 2023-07-19
EP4212590A4 (en) 2024-03-06
CN115605550A (zh) 2023-01-13

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Legal Events

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Effective date: 20230629