JPWO2022039019A1 - - Google Patents

Info

Publication number
JPWO2022039019A1
JPWO2022039019A1 JP2022543360A JP2022543360A JPWO2022039019A1 JP WO2022039019 A1 JPWO2022039019 A1 JP WO2022039019A1 JP 2022543360 A JP2022543360 A JP 2022543360A JP 2022543360 A JP2022543360 A JP 2022543360A JP WO2022039019 A1 JPWO2022039019 A1 JP WO2022039019A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022543360A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022039019A1 publication Critical patent/JPWO2022039019A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8423—Metallic sealing arrangements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/04—Homopolymers or copolymers of esters
    • C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
    • C08L33/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Electroluminescent Light Sources (AREA)
  • Sealing Material Composition (AREA)
JP2022543360A 2020-08-19 2021-08-03 Pending JPWO2022039019A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020138397 2020-08-19
PCT/JP2021/028768 WO2022039019A1 (ja) 2020-08-19 2021-08-03 電子デバイス封止用組成物、電子デバイス封止膜形成方法及び電子デバイス封止膜

Publications (1)

Publication Number Publication Date
JPWO2022039019A1 true JPWO2022039019A1 (zh) 2022-02-24

Family

ID=80322672

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022543360A Pending JPWO2022039019A1 (zh) 2020-08-19 2021-08-03

Country Status (3)

Country Link
JP (1) JPWO2022039019A1 (zh)
CN (1) CN116096563A (zh)
WO (1) WO2022039019A1 (zh)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117296450A (zh) * 2021-04-30 2023-12-26 柯尼卡美能达株式会社 电子器件密封用组合物、电子器件密封膜形成方法以及电子器件密封膜
WO2024024836A1 (ja) * 2022-07-29 2024-02-01 コニカミノルタ株式会社 電子デバイス封止用組成物、電子デバイス封止膜及び電子デバイス封止膜の形成方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4100439B2 (ja) * 2005-09-02 2008-06-11 大日本インキ化学工業株式会社 シール剤用光硬化性組成物、液晶シール剤、及び液晶パネル
JP5281964B2 (ja) * 2008-06-26 2013-09-04 富士フイルム株式会社 バリア性積層体、ガスバリアフィルム、デバイスおよび積層体の製造方法
JP5620852B2 (ja) * 2011-02-25 2014-11-05 富士フイルム株式会社 バリア性積層体およびバリア性積層体の製造方法
JP6019791B2 (ja) * 2012-06-19 2016-11-02 日立化成株式会社 隔壁形成材料、これを用いた感光性エレメント、隔壁の形成方法及び画像表示装置の製造方法
JP6099198B2 (ja) * 2013-03-29 2017-03-22 日本化薬株式会社 エネルギー線硬化型樹脂組成物及びその硬化物
WO2015002100A1 (ja) * 2013-07-04 2015-01-08 Jsr株式会社 有機ｅｌ素子
KR20160049953A (ko) * 2014-10-28 2016-05-10 삼성에스디아이 주식회사 광경화 조성물, 이를 포함하는 유기보호층, 및 이를 포함하는 장치
KR101943687B1 (ko) * 2015-06-19 2019-01-30 삼성에스디아이 주식회사 유기발광표시장치
JP7222976B2 (ja) * 2018-03-23 2023-02-15 リンテック株式会社 ガスバリア性積層体

Also Published As

Publication number Publication date
CN116096563A (zh) 2023-05-09
WO2022039019A1 (ja) 2022-02-24
TW202219232A (zh) 2022-05-16

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