JPWO2022038700A1 - - Google Patents

Info

Publication number
JPWO2022038700A1
JPWO2022038700A1 JP2022543864A JP2022543864A JPWO2022038700A1 JP WO2022038700 A1 JPWO2022038700 A1 JP WO2022038700A1 JP 2022543864 A JP2022543864 A JP 2022543864A JP 2022543864 A JP2022543864 A JP 2022543864A JP WO2022038700 A1 JPWO2022038700 A1 JP WO2022038700A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022543864A
Other versions
JPWO2022038700A5 (ja
JP7296174B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022038700A1 publication Critical patent/JPWO2022038700A1/ja
Publication of JPWO2022038700A5 publication Critical patent/JPWO2022038700A5/ja
Application granted granted Critical
Publication of JP7296174B2 publication Critical patent/JP7296174B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
    • B23K1/0016—Brazing of electronic components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/087—Soldering or brazing jigs, fixtures or clamping means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75743—Suction holding means
    • H01L2224/75744—Suction holding means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/757—Means for aligning
    • H01L2224/75754—Guiding structures
    • H01L2224/75755—Guiding structures in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7598—Apparatus for connecting with bump connectors or layer connectors specially adapted for batch processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75—Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/75981—Apparatus chuck
    • H01L2224/75982—Shape
    • H01L2224/75984—Shape of other portions

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2022543864A 2020-08-19 2020-08-19 基板保持具、並びに、ボンディングシステム及びボンディング方法 Active JP7296174B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/031226 WO2022038700A1 (ja) 2020-08-19 2020-08-19 基板保持具、並びに、ボンディングシステム及びボンディング方法

Publications (3)

Publication Number Publication Date
JPWO2022038700A1 true JPWO2022038700A1 (ja) 2022-02-24
JPWO2022038700A5 JPWO2022038700A5 (ja) 2022-11-28
JP7296174B2 JP7296174B2 (ja) 2023-06-22

Family

ID=80323528

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022543864A Active JP7296174B2 (ja) 2020-08-19 2020-08-19 基板保持具、並びに、ボンディングシステム及びボンディング方法

Country Status (5)

Country Link
US (1) US20240014167A1 (ja)
JP (1) JP7296174B2 (ja)
KR (1) KR20230042480A (ja)
CN (1) CN115997278A (ja)
WO (1) WO2022038700A1 (ja)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0621110A (ja) * 1992-07-02 1994-01-28 Fuji Electric Co Ltd 半導体チップの組立治具
JPH10189652A (ja) * 1996-12-25 1998-07-21 Hitachi Ltd 半導体装置
JP2000049210A (ja) * 1998-07-30 2000-02-18 Matsushita Electric Ind Co Ltd 個片基板搬送パレット及び電子部品製造方法
JP2004304168A (ja) * 2003-03-14 2004-10-28 Omron Corp 部品実装基板の製造装置および製造方法
JP2008288460A (ja) * 2007-05-18 2008-11-27 Toyota Motor Corp 部品実装用治具、部品実装装置、および部品実装方法
JP2008294033A (ja) * 2007-05-22 2008-12-04 Panasonic Corp 電子部品実装システムおよび電子部品実装方法
JP2010171172A (ja) * 2009-01-22 2010-08-05 Eisaku Hibi 部品保持治具及び、該部品保持治具を用いた負圧吸着装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3688125B2 (ja) 1998-07-03 2005-08-24 松下電器産業株式会社 電子部品製造方法及び装置
JP4880055B2 (ja) 2010-06-04 2012-02-22 株式会社新川 電子部品実装装置及びその方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0621110A (ja) * 1992-07-02 1994-01-28 Fuji Electric Co Ltd 半導体チップの組立治具
JPH10189652A (ja) * 1996-12-25 1998-07-21 Hitachi Ltd 半導体装置
JP2000049210A (ja) * 1998-07-30 2000-02-18 Matsushita Electric Ind Co Ltd 個片基板搬送パレット及び電子部品製造方法
JP2004304168A (ja) * 2003-03-14 2004-10-28 Omron Corp 部品実装基板の製造装置および製造方法
JP2008288460A (ja) * 2007-05-18 2008-11-27 Toyota Motor Corp 部品実装用治具、部品実装装置、および部品実装方法
JP2008294033A (ja) * 2007-05-22 2008-12-04 Panasonic Corp 電子部品実装システムおよび電子部品実装方法
JP2010171172A (ja) * 2009-01-22 2010-08-05 Eisaku Hibi 部品保持治具及び、該部品保持治具を用いた負圧吸着装置

Also Published As

Publication number Publication date
KR20230042480A (ko) 2023-03-28
WO2022038700A1 (ja) 2022-02-24
CN115997278A (zh) 2023-04-21
US20240014167A1 (en) 2024-01-11
JP7296174B2 (ja) 2023-06-22

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