JPWO2022024529A1 - - Google Patents
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- Publication number
- JPWO2022024529A1 JPWO2022024529A1 JP2022540036A JP2022540036A JPWO2022024529A1 JP WO2022024529 A1 JPWO2022024529 A1 JP WO2022024529A1 JP 2022540036 A JP2022540036 A JP 2022540036A JP 2022540036 A JP2022540036 A JP 2022540036A JP WO2022024529 A1 JPWO2022024529 A1 JP WO2022024529A1
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- H—ELECTRICITY
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- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
- H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
- H10N30/708—Intermediate layers, e.g. barrier, adhesion or growth control buffer layers
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- C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
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- C04B35/4682—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates based on BaTiO3 perovskite phase
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- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/08—Oxides
- C23C14/088—Oxides of the type ABO3 with A representing alkali, alkaline earth metal or Pb and B representing a refractory or rare earth metal
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- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/16—Oxides
- C30B29/22—Complex oxides
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- H10N30/079—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by depositing piezoelectric or electrostrictive layers, e.g. aerosol or screen printing using intermediate layers, e.g. for growth control
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JP2020127689 | 2020-07-28 | ||
PCT/JP2021/020014 WO2022024529A1 (ja) | 2020-07-28 | 2021-05-26 | 圧電膜付き基板及び圧電素子 |
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JP2005108876A (ja) * | 2003-09-26 | 2005-04-21 | Toshiba Corp | 半導体装置及びその製造方法 |
JP2006069837A (ja) | 2004-09-01 | 2006-03-16 | Seiko Epson Corp | 圧電体層、圧電素子、圧電アクチュエーター、圧電ポンプ、インクジェット式記録ヘッド、インクジェットプリンター、表面弾性波素子、周波数フィルタ、発振器、電子回路、薄膜圧電共振子、および電子機器 |
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JP6130085B1 (ja) | 2015-09-11 | 2017-05-17 | 住友精密工業株式会社 | 圧電素子および圧電素子の製造方法 |
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US10614842B1 (en) * | 2018-09-19 | 2020-04-07 | Sae Magnetics (H.K.) Ltd. | Thin-film piezoelectric-material element with protective film composition and insulating film through hole exposing lower electrode film |
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WO2020250632A1 (ja) | 2019-06-12 | 2020-12-17 | 富士フイルム株式会社 | 圧電素子 |
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JP7166987B2 (ja) | 2019-06-12 | 2022-11-08 | 富士フイルム株式会社 | 圧電素子 |
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