JPWO2022014329A1 - - Google Patents

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Publication number
JPWO2022014329A1
JPWO2022014329A1 JP2022536236A JP2022536236A JPWO2022014329A1 JP WO2022014329 A1 JPWO2022014329 A1 JP WO2022014329A1 JP 2022536236 A JP2022536236 A JP 2022536236A JP 2022536236 A JP2022536236 A JP 2022536236A JP WO2022014329 A1 JPWO2022014329 A1 JP WO2022014329A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022536236A
Other versions
JP7434564B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Publication of JPWO2022014329A1 publication Critical patent/JPWO2022014329A1/ja
Application granted granted Critical
Publication of JP7434564B2 publication Critical patent/JP7434564B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • General Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
JP2022536236A 2020-07-13 2021-06-30 液処理装置、液供給機構、液処理方法及びコンピュータ記憶媒体 Active JP7434564B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020119743 2020-07-13
JP2020119743 2020-07-13
PCT/JP2021/024724 WO2022014329A1 (ja) 2020-07-13 2021-06-30 液処理装置、液供給機構、液処理方法及びコンピュータ記憶媒体

Publications (2)

Publication Number Publication Date
JPWO2022014329A1 true JPWO2022014329A1 (ja) 2022-01-20
JP7434564B2 JP7434564B2 (ja) 2024-02-20

Family

ID=79555470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022536236A Active JP7434564B2 (ja) 2020-07-13 2021-06-30 液処理装置、液供給機構、液処理方法及びコンピュータ記憶媒体

Country Status (4)

Country Link
JP (1) JP7434564B2 (ja)
KR (1) KR20230038232A (ja)
CN (1) CN115769152A (ja)
WO (1) WO2022014329A1 (ja)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007102754A (ja) * 2005-09-09 2007-04-19 Advance Denki Kogyo Kk 流量制御装置
JP5337541B2 (ja) 2009-03-12 2013-11-06 東京エレクトロン株式会社 処理液供給機構、処理液供給方法、液処理装置、および記憶媒体
JP5045741B2 (ja) * 2009-12-25 2012-10-10 東京エレクトロン株式会社 薬液供給ノズル及び薬液供給方法
JP6932626B2 (ja) * 2017-09-15 2021-09-08 株式会社マンダム ノズルユニット、ならびにそれを備える二液吐出器
JP6995547B2 (ja) 2017-09-22 2022-01-14 株式会社Ｓｃｒｅｅｎホールディングス 薬液生成方法、薬液生成装置および基板処理装置

Also Published As

Publication number Publication date
WO2022014329A1 (ja) 2022-01-20
CN115769152A (zh) 2023-03-07
JP7434564B2 (ja) 2024-02-20
KR20230038232A (ko) 2023-03-17

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