JPWO2021246328A1 - - Google Patents
Info
- Publication number
- JPWO2021246328A1 JPWO2021246328A1 JP2022528800A JP2022528800A JPWO2021246328A1 JP WO2021246328 A1 JPWO2021246328 A1 JP WO2021246328A1 JP 2022528800 A JP2022528800 A JP 2022528800A JP 2022528800 A JP2022528800 A JP 2022528800A JP WO2021246328 A1 JPWO2021246328 A1 JP WO2021246328A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020097773 | 2020-06-04 | ||
JP2020097773 | 2020-06-04 | ||
PCT/JP2021/020440 WO2021246328A1 (ja) | 2020-06-04 | 2021-05-28 | 基板処理装置の運用方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021246328A1 true JPWO2021246328A1 (ja) | 2021-12-09 |
JP7455972B2 JP7455972B2 (ja) | 2024-03-26 |
Family
ID=78830495
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022528800A Active JP7455972B2 (ja) | 2020-06-04 | 2021-05-28 | 基板処理装置の運用方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP7455972B2 (ja) |
TW (1) | TW202213596A (ja) |
WO (1) | WO2021246328A1 (ja) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6889568B2 (en) * | 2002-01-24 | 2005-05-10 | Sensarray Corporation | Process condition sensing wafer and data analysis system |
US6828542B2 (en) | 2002-06-07 | 2004-12-07 | Brion Technologies, Inc. | System and method for lithography process monitoring and control |
US6807503B2 (en) | 2002-11-04 | 2004-10-19 | Brion Technologies, Inc. | Method and apparatus for monitoring integrated circuit fabrication |
DE10314150A1 (de) * | 2003-03-28 | 2004-10-21 | Infineon Technologies Ag | Verfahren und Messanordnung zur Erfassung von Umgebungs- und Prozessbedingungen in einer Fertigungsumgebung für Halbleiterwafer |
JP2008032401A (ja) | 2006-07-26 | 2008-02-14 | Fujifilm Corp | 赤外カットフィルタの検査方法及び装置 |
JP2014022578A (ja) | 2012-07-19 | 2014-02-03 | Tokyo Electron Ltd | 処理液供給装置及び処理液供給方法 |
JP2016146440A (ja) | 2015-02-09 | 2016-08-12 | 大日本印刷株式会社 | 液処理装置および液処理方法 |
US10067070B2 (en) | 2015-11-06 | 2018-09-04 | Applied Materials, Inc. | Particle monitoring device |
US20200343116A1 (en) | 2016-10-22 | 2020-10-29 | Matan LAPIDOT | Mobile inspection system for the detection of defect occurrence and location |
-
2021
- 2021-05-25 TW TW110118800A patent/TW202213596A/zh unknown
- 2021-05-28 WO PCT/JP2021/020440 patent/WO2021246328A1/ja active Application Filing
- 2021-05-28 JP JP2022528800A patent/JP7455972B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
TW202213596A (zh) | 2022-04-01 |
JP7455972B2 (ja) | 2024-03-26 |
WO2021246328A1 (ja) | 2021-12-09 |
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