JPWO2021220768A1 - - Google Patents

Info

Publication number
JPWO2021220768A1
JPWO2021220768A1 JP2022517597A JP2022517597A JPWO2021220768A1 JP WO2021220768 A1 JPWO2021220768 A1 JP WO2021220768A1 JP 2022517597 A JP2022517597 A JP 2022517597A JP 2022517597 A JP2022517597 A JP 2022517597A JP WO2021220768 A1 JPWO2021220768 A1 JP WO2021220768A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022517597A
Other versions
JP7376701B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021220768A1 publication Critical patent/JPWO2021220768A1/ja
Application granted granted Critical
Publication of JP7376701B2 publication Critical patent/JP7376701B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2022517597A 2020-04-30 2021-04-09 シート剥離方法およびシート剥離装置、並びに、分割方法および分割装置 Active JP7376701B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020080202 2020-04-30
JP2020080202 2020-04-30
PCT/JP2021/014978 WO2021220768A1 (ja) 2020-04-30 2021-04-09 シート剥離方法およびシート剥離装置、並びに、分割方法および分割装置

Publications (2)

Publication Number Publication Date
JPWO2021220768A1 true JPWO2021220768A1 (ja) 2021-11-04
JP7376701B2 JP7376701B2 (ja) 2023-11-08

Family

ID=78373533

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022517597A Active JP7376701B2 (ja) 2020-04-30 2021-04-09 シート剥離方法およびシート剥離装置、並びに、分割方法および分割装置

Country Status (5)

Country Link
JP (1) JP7376701B2 (ja)
KR (1) KR20230002491A (ja)
CN (1) CN115461855A (ja)
TW (1) TW202147417A (ja)
WO (1) WO2021220768A1 (ja)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007109869A (ja) * 2005-10-13 2007-04-26 Lintec Corp 転着装置及び転着方法
JP2012222308A (ja) * 2011-04-14 2012-11-12 Lintec Corp 転写装置および転写方法
JP2015177060A (ja) * 2014-03-14 2015-10-05 株式会社東芝 半導体製造装置および半導体装置の製造方法
JP2016048612A (ja) * 2014-08-27 2016-04-07 株式会社Ｓｃｒｅｅｎホールディングス 膜・触媒層接合体の製造装置および製造方法
WO2019044588A1 (ja) * 2017-09-04 2019-03-07 リンテック株式会社 薄型化板状部材の製造方法、及び薄型化板状部材の製造装置
JP2019175927A (ja) * 2018-03-27 2019-10-10 株式会社東京精密 ウェーハ分割装置及び方法
WO2020017599A1 (ja) * 2018-07-19 2020-01-23 東京エレクトロン株式会社 基板処理システム及び基板処理方法
JP2020057744A (ja) * 2018-10-04 2020-04-09 リンテック株式会社 不要シート除去装置および不要シート除去方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5442288B2 (ja) 2009-03-27 2014-03-12 日東電工株式会社 保護テープ剥離方法およびこれを用いた保護テープ剥離装置
JP6518580B2 (ja) * 2015-12-09 2019-05-22 リンテック株式会社 シート剥離装置および剥離方法
JP6848151B2 (ja) * 2017-05-29 2021-03-24 リンテック株式会社 離間装置および離間方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007109869A (ja) * 2005-10-13 2007-04-26 Lintec Corp 転着装置及び転着方法
JP2012222308A (ja) * 2011-04-14 2012-11-12 Lintec Corp 転写装置および転写方法
JP2015177060A (ja) * 2014-03-14 2015-10-05 株式会社東芝 半導体製造装置および半導体装置の製造方法
JP2016048612A (ja) * 2014-08-27 2016-04-07 株式会社Ｓｃｒｅｅｎホールディングス 膜・触媒層接合体の製造装置および製造方法
WO2019044588A1 (ja) * 2017-09-04 2019-03-07 リンテック株式会社 薄型化板状部材の製造方法、及び薄型化板状部材の製造装置
JP2019175927A (ja) * 2018-03-27 2019-10-10 株式会社東京精密 ウェーハ分割装置及び方法
WO2020017599A1 (ja) * 2018-07-19 2020-01-23 東京エレクトロン株式会社 基板処理システム及び基板処理方法
JP2020057744A (ja) * 2018-10-04 2020-04-09 リンテック株式会社 不要シート除去装置および不要シート除去方法

Also Published As

Publication number Publication date
JP7376701B2 (ja) 2023-11-08
WO2021220768A1 (ja) 2021-11-04
CN115461855A (zh) 2022-12-09
TW202147417A (zh) 2021-12-16
KR20230002491A (ko) 2023-01-05

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