JPWO2021206064A1 - - Google Patents
Info
- Publication number
- JPWO2021206064A1 JPWO2021206064A1 JP2021560027A JP2021560027A JPWO2021206064A1 JP WO2021206064 A1 JPWO2021206064 A1 JP WO2021206064A1 JP 2021560027 A JP2021560027 A JP 2021560027A JP 2021560027 A JP2021560027 A JP 2021560027A JP WO2021206064 A1 JPWO2021206064 A1 JP WO2021206064A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D17/00—Detergent materials or soaps characterised by their shape or physical properties
- C11D17/0004—Non aqueous liquid compositions comprising insoluble particles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- General Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020068593 | 2020-04-06 | ||
PCT/JP2021/014525 WO2021206064A1 (ja) | 2020-04-06 | 2021-04-05 | 樹脂組成物、放熱部材、及び電子機器 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2021206064A1 true JPWO2021206064A1 (ja) | 2021-10-14 |
Family
ID=78023147
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021560027A Pending JPWO2021206064A1 (ja) | 2020-04-06 | 2021-04-05 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20230151216A1 (ja) |
EP (1) | EP4134392A4 (ja) |
JP (1) | JPWO2021206064A1 (ja) |
KR (1) | KR20220164709A (ja) |
CN (1) | CN115362217A (ja) |
TW (1) | TW202144505A (ja) |
WO (1) | WO2021206064A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023149175A1 (ja) * | 2022-02-02 | 2023-08-10 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及びその製造方法 |
CN116515301A (zh) * | 2023-06-02 | 2023-08-01 | 上海阿莱德实业股份有限公司 | 一种柔性高导热金刚石基导热垫片及其制备方法 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3415999B2 (ja) * | 1996-07-05 | 2003-06-09 | 信越化学工業株式会社 | アルコキシシリル変性プロピオン酸エステル |
JP3543663B2 (ja) | 1999-03-11 | 2004-07-14 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物及びその製造方法 |
JP4727017B2 (ja) * | 1999-11-15 | 2011-07-20 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンゴム組成物 |
CN1860181B (zh) | 2003-09-29 | 2011-08-24 | 迈图高新材料日本合同公司 | 导热性有机硅组合物 |
JP4590253B2 (ja) * | 2004-12-16 | 2010-12-01 | 東レ・ダウコーニング株式会社 | オルガノポリシロキサンおよびシリコーン組成物 |
JP4514058B2 (ja) | 2006-08-30 | 2010-07-28 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及びその硬化物 |
JP2010100784A (ja) * | 2008-10-27 | 2010-05-06 | Asahi Kasei Corp | 表面改質された無機化合物微粒子及びその分散体 |
CN103087351B (zh) * | 2011-11-08 | 2014-12-17 | 曹坚林 | 一种含环氧基的线型硅烷偶联剂及其制备方法 |
US20180179383A1 (en) * | 2015-07-01 | 2018-06-28 | Showa Denko K. K. | Thermosetting silicone resin composition containing boron nitride, dispersant for silicone resin compositions, and inorganic filler |
CN105837822B (zh) * | 2016-05-13 | 2020-08-25 | 华东理工大学 | 改性聚硅氧烷乳液及其用途 |
-
2021
- 2021-04-05 CN CN202180026089.7A patent/CN115362217A/zh active Pending
- 2021-04-05 WO PCT/JP2021/014525 patent/WO2021206064A1/ja unknown
- 2021-04-05 KR KR1020227034202A patent/KR20220164709A/ko unknown
- 2021-04-05 EP EP21785102.1A patent/EP4134392A4/en active Pending
- 2021-04-05 US US17/916,632 patent/US20230151216A1/en active Pending
- 2021-04-05 JP JP2021560027A patent/JPWO2021206064A1/ja active Pending
- 2021-04-06 TW TW110112380A patent/TW202144505A/zh unknown
Also Published As
Publication number | Publication date |
---|---|
WO2021206064A1 (ja) | 2021-10-14 |
EP4134392A1 (en) | 2023-02-15 |
CN115362217A (zh) | 2022-11-18 |
EP4134392A4 (en) | 2024-05-01 |
TW202144505A (zh) | 2021-12-01 |
KR20220164709A (ko) | 2022-12-13 |
US20230151216A1 (en) | 2023-05-18 |
Similar Documents
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20240104 |