JPWO2021201013A1 - - Google Patents

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Publication number
JPWO2021201013A1
JPWO2021201013A1 JP2022512576A JP2022512576A JPWO2021201013A1 JP WO2021201013 A1 JPWO2021201013 A1 JP WO2021201013A1 JP 2022512576 A JP2022512576 A JP 2022512576A JP 2022512576 A JP2022512576 A JP 2022512576A JP WO2021201013 A1 JPWO2021201013 A1 JP WO2021201013A1
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JP
Japan
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JP2022512576A
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Japanese (ja)
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JP7724207B2 (ja
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/06—Polystyrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Polymerisation Methods In General (AREA)
JP2022512576A 2020-04-01 2021-03-30 封止剤、硬化体、有機エレクトロルミネッセンス表示装置、及び、有機エレクトロルミネッセンス表示装置の製造方法 Active JP7724207B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020066063 2020-04-01
JP2020066063 2020-04-01
JP2020143725 2020-08-27
JP2020143725 2020-08-27
PCT/JP2021/013656 WO2021201013A1 (ja) 2020-04-01 2021-03-30 封止剤、硬化体、有機エレクトロルミネッセンス表示装置、及び、有機エレクトロルミネッセンス表示装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2021201013A1 true JPWO2021201013A1 (https=) 2021-10-07
JP7724207B2 JP7724207B2 (ja) 2025-08-15

Family

ID=77928626

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022512576A Active JP7724207B2 (ja) 2020-04-01 2021-03-30 封止剤、硬化体、有機エレクトロルミネッセンス表示装置、及び、有機エレクトロルミネッセンス表示装置の製造方法

Country Status (4)

Country Link
JP (1) JP7724207B2 (https=)
CN (1) CN115336389B (https=)
TW (1) TWI869579B (https=)
WO (1) WO2021201013A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022085599A1 (ja) * 2020-10-20 2022-04-28 デンカ株式会社 封止剤、硬化体、有機エレクトロルミネッセンス表示装置、及び、有機エレクトロルミネッセンス表示装置の製造方法
WO2022210785A1 (ja) * 2021-03-31 2022-10-06 デンカ株式会社 組成物、硬化体及び有機ｅｌ表示装置
JP2025125432A (ja) * 2024-02-15 2025-08-27 デンカ株式会社 組成物、硬化体、表示装置および太陽電池

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015010207A (ja) * 2013-07-01 2015-01-19 株式会社カネカ Ｆｐｄ貼り合わせ用活性エネルギー線硬化性ダム組成物
WO2016170893A1 (ja) * 2015-04-20 2016-10-27 Jnc株式会社 硬化性樹脂組成物、およびその硬化物を利用した有機電界発光素子などの電子デバイス
JP2018021209A (ja) * 2014-11-13 2018-02-08 積水化学工業株式会社 硬化体、電子部品、及び、表示素子
WO2018179544A1 (ja) * 2017-03-30 2018-10-04 リンテック株式会社 熱電変換モジュール及びその製造方法
JP2018165835A (ja) * 2018-07-05 2018-10-25 ソマール株式会社 ハードコート膜
JP2019011443A (ja) * 2017-06-30 2019-01-24 協立化学産業株式会社 有機ｅｌ素子の封止用のカチオン重合硬化型樹脂組成物、及びそれを用いた有機ｅｌ素子
JP6620273B1 (ja) * 2019-08-21 2019-12-11 ナミックス株式会社 エポキシ樹脂組成物
JP2020021714A (ja) * 2018-08-03 2020-02-06 パナソニックＩｐマネジメント株式会社 有機ｅｌ素子封止用紫外線硬化性樹脂組成物、有機ｅｌ発光装置の製造方法及び有機ｅｌ発光装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005320404A (ja) * 2004-05-07 2005-11-17 Nagase Chemtex Corp 電子部品シール用接着剤組成物及び有機電界発光装置の製造方法
US7535646B2 (en) * 2006-11-17 2009-05-19 Eastman Kodak Company Light emitting device with microlens array
JP5916220B2 (ja) * 2012-07-19 2016-05-11 日本化薬株式会社 エネルギー線硬化型樹脂組成物及びその硬化物
KR102497896B1 (ko) * 2016-09-16 2023-02-08 세키스이가가쿠 고교가부시키가이샤 유기 일렉트로 루미네선스 표시 소자용 봉지제
JP6474432B2 (ja) * 2017-01-11 2019-02-27 日本化薬株式会社 エネルギー線硬化型樹脂組成物及びその硬化物

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015010207A (ja) * 2013-07-01 2015-01-19 株式会社カネカ Ｆｐｄ貼り合わせ用活性エネルギー線硬化性ダム組成物
JP2018021209A (ja) * 2014-11-13 2018-02-08 積水化学工業株式会社 硬化体、電子部品、及び、表示素子
WO2016170893A1 (ja) * 2015-04-20 2016-10-27 Jnc株式会社 硬化性樹脂組成物、およびその硬化物を利用した有機電界発光素子などの電子デバイス
WO2018179544A1 (ja) * 2017-03-30 2018-10-04 リンテック株式会社 熱電変換モジュール及びその製造方法
JP2019011443A (ja) * 2017-06-30 2019-01-24 協立化学産業株式会社 有機ｅｌ素子の封止用のカチオン重合硬化型樹脂組成物、及びそれを用いた有機ｅｌ素子
JP2018165835A (ja) * 2018-07-05 2018-10-25 ソマール株式会社 ハードコート膜
JP2020021714A (ja) * 2018-08-03 2020-02-06 パナソニックＩｐマネジメント株式会社 有機ｅｌ素子封止用紫外線硬化性樹脂組成物、有機ｅｌ発光装置の製造方法及び有機ｅｌ発光装置
JP6620273B1 (ja) * 2019-08-21 2019-12-11 ナミックス株式会社 エポキシ樹脂組成物

Also Published As

Publication number Publication date
WO2021201013A1 (ja) 2021-10-07
KR20220164509A (ko) 2022-12-13
TW202142666A (zh) 2021-11-16
CN115336389B (zh) 2025-10-24
JP7724207B2 (ja) 2025-08-15
TWI869579B (zh) 2025-01-11
CN115336389A (zh) 2022-11-11

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