CN115336389B - 密封剂、固化体、有机电致发光显示装置、及有机电致发光显示装置的制造方法 - Google Patents

密封剂、固化体、有机电致发光显示装置、及有机电致发光显示装置的制造方法

Info

Publication number
CN115336389B
CN115336389B CN202180024196.6A CN202180024196A CN115336389B CN 115336389 B CN115336389 B CN 115336389B CN 202180024196 A CN202180024196 A CN 202180024196A CN 115336389 B CN115336389 B CN 115336389B
Authority
CN
China
Prior art keywords
mass
sealant
polymerizable compound
sealant according
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180024196.6A
Other languages
English (en)
Chinese (zh)
Other versions
CN115336389A (zh
Inventor
石田泰则
栗村启之
山下幸彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Denka Co Ltd filed Critical Denka Co Ltd
Publication of CN115336389A publication Critical patent/CN115336389A/zh
Application granted granted Critical
Publication of CN115336389B publication Critical patent/CN115336389B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/06—Polystyrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
    • C08L25/02—Homopolymers or copolymers of hydrocarbons
    • C08L25/04—Homopolymers or copolymers of styrene
    • C08L25/08—Copolymers of styrene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C08L33/02—Homopolymers or copolymers of acids; Metal or ammonium salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K3/00—Materials not provided for elsewhere
    • C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
    • C09K3/1006—Materials in mouldable or extrudable form for sealing or packing joints or covers characterised by the chemical nature of one of its constituents
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/005—Additives being defined by their particle size in general

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Polymerisation Methods In General (AREA)
CN202180024196.6A 2020-04-01 2021-03-30 密封剂、固化体、有机电致发光显示装置、及有机电致发光显示装置的制造方法 Active CN115336389B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2020066063 2020-04-01
JP2020-066063 2020-04-01
JP2020143725 2020-08-27
JP2020-143725 2020-08-27
PCT/JP2021/013656 WO2021201013A1 (ja) 2020-04-01 2021-03-30 封止剤、硬化体、有機エレクトロルミネッセンス表示装置、及び、有機エレクトロルミネッセンス表示装置の製造方法

Publications (2)

Publication Number Publication Date
CN115336389A CN115336389A (zh) 2022-11-11
CN115336389B true CN115336389B (zh) 2025-10-24

Family

ID=77928626

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180024196.6A Active CN115336389B (zh) 2020-04-01 2021-03-30 密封剂、固化体、有机电致发光显示装置、及有机电致发光显示装置的制造方法

Country Status (4)

Country Link
JP (1) JP7724207B2 (https=)
CN (1) CN115336389B (https=)
TW (1) TWI869579B (https=)
WO (1) WO2021201013A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022085599A1 (ja) * 2020-10-20 2022-04-28 デンカ株式会社 封止剤、硬化体、有機エレクトロルミネッセンス表示装置、及び、有機エレクトロルミネッセンス表示装置の製造方法
WO2022210785A1 (ja) * 2021-03-31 2022-10-06 デンカ株式会社 組成物、硬化体及び有機ｅｌ表示装置
JP2025125432A (ja) * 2024-02-15 2025-08-27 デンカ株式会社 組成物、硬化体、表示装置および太陽電池

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015010207A (ja) * 2013-07-01 2015-01-19 株式会社カネカ Ｆｐｄ貼り合わせ用活性エネルギー線硬化性ダム組成物
CN104470971A (zh) * 2012-07-19 2015-03-25 日本化药株式会社 能量射线固化型树脂组合物及其固化物
WO2016170893A1 (ja) * 2015-04-20 2016-10-27 Jnc株式会社 硬化性樹脂組成物、およびその硬化物を利用した有機電界発光素子などの電子デバイス

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005320404A (ja) * 2004-05-07 2005-11-17 Nagase Chemtex Corp 電子部品シール用接着剤組成物及び有機電界発光装置の製造方法
US7535646B2 (en) * 2006-11-17 2009-05-19 Eastman Kodak Company Light emitting device with microlens array
CN106232634B (zh) * 2014-11-13 2019-08-16 积水化学工业株式会社 固化体、电子部件及显示元件
KR102497896B1 (ko) * 2016-09-16 2023-02-08 세키스이가가쿠 고교가부시키가이샤 유기 일렉트로 루미네선스 표시 소자용 봉지제
JP6474432B2 (ja) * 2017-01-11 2019-02-27 日本化薬株式会社 エネルギー線硬化型樹脂組成物及びその硬化物
CN110494997A (zh) 2017-03-30 2019-11-22 琳得科株式会社 热电转换模块及其制造方法
JP6653842B2 (ja) * 2017-06-30 2020-02-26 協立化学産業株式会社 有機ｅｌ素子の封止用のカチオン重合硬化型樹脂組成物、及びそれを用いた有機ｅｌ素子
JP6778716B2 (ja) * 2018-07-05 2020-11-04 ソマール株式会社 ハードコート膜
JP7262038B2 (ja) * 2018-08-03 2023-04-21 パナソニックＩｐマネジメント株式会社 有機ｅｌ素子封止用紫外線硬化性樹脂組成物、有機ｅｌ発光装置の製造方法及び有機ｅｌ発光装置
KR102187495B1 (ko) * 2019-08-21 2020-12-08 나믹스 가부시끼가이샤 에폭시 수지 조성물

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104470971A (zh) * 2012-07-19 2015-03-25 日本化药株式会社 能量射线固化型树脂组合物及其固化物
JP2015010207A (ja) * 2013-07-01 2015-01-19 株式会社カネカ Ｆｐｄ貼り合わせ用活性エネルギー線硬化性ダム組成物
WO2016170893A1 (ja) * 2015-04-20 2016-10-27 Jnc株式会社 硬化性樹脂組成物、およびその硬化物を利用した有機電界発光素子などの電子デバイス

Also Published As

Publication number Publication date
WO2021201013A1 (ja) 2021-10-07
KR20220164509A (ko) 2022-12-13
JPWO2021201013A1 (https=) 2021-10-07
TW202142666A (zh) 2021-11-16
JP7724207B2 (ja) 2025-08-15
TWI869579B (zh) 2025-01-11
CN115336389A (zh) 2022-11-11

Similar Documents

Publication Publication Date Title
CN104487474B (zh) 树脂组合物
KR102772994B1 (ko) 봉지제, 경화체, 유기 일렉트로 루미네센스 표시 장치 및 장치의 제조 방법
KR102385321B1 (ko) 수지 조성물
KR102814018B1 (ko) 조성물
CN115336389B (zh) 密封剂、固化体、有机电致发光显示装置、及有机电致发光显示装置的制造方法
JP7514285B2 (ja) 組成物
KR102536932B1 (ko) 유기 일렉트로 루미네센스 소자용 봉지제
JP7523568B2 (ja) 封止剤、硬化体、有機エレクトロルミネッセンス表示装置、及び、有機エレクトロルミネッセンス表示装置の製造方法
KR102955287B1 (ko) 밀봉제, 경화체, 유기 전계발광 표시장치, 및 유기 전계발광 표시장치의 제조 방법
JP4555611B2 (ja) 有機エレクトロルミネッセンス素子封止剤及びトップエミッション方式の有機エレクトロルミネッセンス素子
JP7671842B2 (ja) 組成物、硬化体及び有機ｅｌ表示装置
WO2025220565A1 (ja) 光電変換素子用封止材、ダム材、フィル材、ダム材を用いた装置の製造方法、およびフィル材を用いた装置の製造方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant