JPWO2021199754A1 - - Google Patents

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Publication number
JPWO2021199754A1
JPWO2021199754A1 JP2022511644A JP2022511644A JPWO2021199754A1 JP WO2021199754 A1 JPWO2021199754 A1 JP WO2021199754A1 JP 2022511644 A JP2022511644 A JP 2022511644A JP 2022511644 A JP2022511644 A JP 2022511644A JP WO2021199754 A1 JPWO2021199754 A1 JP WO2021199754A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022511644A
Other languages
Japanese (ja)
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JP7645240B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021199754A1 publication Critical patent/JPWO2021199754A1/ja
Application granted granted Critical
Publication of JP7645240B2 publication Critical patent/JP7645240B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/809—Constructional details of image sensors of hybrid image sensors
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
    • H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
    • H04N25/772—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters
    • H04N25/773—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters comprising photon counting circuits, e.g. single photon detection [SPD] or single photon avalanche diodes [SPAD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/811—Interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W80/00—Direct bonding of chips, wafers or substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W20/00—Interconnections in chips, wafers or substrates
    • H10W20/40—Interconnections external to wafers or substrates, e.g. back-end-of-line [BEOL] metallisations or vias connecting to gate electrodes
    • H10W20/495—Capacitive arrangements or effects of, or between wiring layers
    • H10W20/496—Capacitor integral with wiring layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/951—Materials of bond pads
    • H10W72/952—Materials of bond pads comprising metals or metalloids, e.g. PbSn, Ag or Cu
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/791—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads
    • H10W90/792—Package configurations characterised by the relative positions of pads or connectors relative to package parts of direct-bonded pads between multiple chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W99/00—Subject matter not provided for in other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2022511644A 2020-03-30 2021-02-17 半導体装置及び電子機器 Active JP7645240B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020060404 2020-03-30
JP2020060404 2020-03-30
PCT/JP2021/005876 WO2021199754A1 (ja) 2020-03-30 2021-02-17 半導体装置及び電子機器

Publications (2)

Publication Number Publication Date
JPWO2021199754A1 true JPWO2021199754A1 (https=) 2021-10-07
JP7645240B2 JP7645240B2 (ja) 2025-03-13

Family

ID=77929698

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022511644A Active JP7645240B2 (ja) 2020-03-30 2021-02-17 半導体装置及び電子機器

Country Status (5)

Country Link
US (1) US12170303B2 (https=)
JP (1) JP7645240B2 (https=)
CN (1) CN115315807A (https=)
DE (1) DE112021002165T5 (https=)
WO (1) WO2021199754A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11735616B2 (en) * 2021-12-29 2023-08-22 Nanya Technology Corporation Optical semiconductor device with integrated dies

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04241449A (ja) * 1991-01-16 1992-08-28 Hitachi Ltd 半導体集積回路装置
JP2006128468A (ja) * 2004-10-29 2006-05-18 Seiko Epson Corp 半導体装置
JP2007208101A (ja) * 2006-02-03 2007-08-16 Toshiba Corp 半導体装置
JP2013143446A (ja) * 2012-01-10 2013-07-22 Sony Corp 容量素子、半導体装置及び電子機器
JP2016511941A (ja) * 2013-02-19 2016-04-21 クアルコム，インコーポレイテッド 相補型バックエンドオブライン（ｂｅｏｌ）キャパシタ

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4371799B2 (ja) 2003-12-19 2009-11-25 株式会社リコー 容量素子
JP5512609B2 (ja) 2011-07-11 2014-06-04 ルネサスエレクトロニクス株式会社 半導体集積回路装置
CN106664382B (zh) * 2014-07-15 2019-11-01 普里露尼库斯股份有限公司 固体摄影装置、固体摄影装置的制造方法以及电子机器
JP2018037626A (ja) 2016-09-02 2018-03-08 旭化成エレクトロニクス株式会社 半導体装置及び半導体装置の製造方法
JP2018088648A (ja) 2016-11-29 2018-06-07 ルネサスエレクトロニクス株式会社 固体撮像装置
JP2018148528A (ja) 2017-03-09 2018-09-20 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置および電子機器
WO2019063892A1 (fr) * 2017-09-27 2019-04-04 Airbus Defence And Space Sas Redimensionnement des entites de detection d'un capteur d'image matriciel hybride

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04241449A (ja) * 1991-01-16 1992-08-28 Hitachi Ltd 半導体集積回路装置
JP2006128468A (ja) * 2004-10-29 2006-05-18 Seiko Epson Corp 半導体装置
JP2007208101A (ja) * 2006-02-03 2007-08-16 Toshiba Corp 半導体装置
JP2013143446A (ja) * 2012-01-10 2013-07-22 Sony Corp 容量素子、半導体装置及び電子機器
JP2016511941A (ja) * 2013-02-19 2016-04-21 クアルコム，インコーポレイテッド 相補型バックエンドオブライン（ｂｅｏｌ）キャパシタ

Also Published As

Publication number Publication date
JP7645240B2 (ja) 2025-03-13
WO2021199754A1 (ja) 2021-10-07
CN115315807A (zh) 2022-11-08
DE112021002165T5 (de) 2023-03-23
US20230207597A1 (en) 2023-06-29
US12170303B2 (en) 2024-12-17

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