JPWO2021193246A1 - - Google Patents

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Publication number
JPWO2021193246A1
JPWO2021193246A1 JP2022509983A JP2022509983A JPWO2021193246A1 JP WO2021193246 A1 JPWO2021193246 A1 JP WO2021193246A1 JP 2022509983 A JP2022509983 A JP 2022509983A JP 2022509983 A JP2022509983 A JP 2022509983A JP WO2021193246 A1 JPWO2021193246 A1 JP WO2021193246A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022509983A
Other languages
Japanese (ja)
Other versions
JP7374298B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021193246A1 publication Critical patent/JPWO2021193246A1/ja
Application granted granted Critical
Publication of JP7374298B2 publication Critical patent/JP7374298B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/04—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP2022509983A 2020-03-23 2021-03-16 粗化処理銅箔、銅張積層板及びプリント配線板 Active JP7374298B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020051383 2020-03-23
JP2020051383 2020-03-23
PCT/JP2021/010657 WO2021193246A1 (ja) 2020-03-23 2021-03-16 粗化処理銅箔、銅張積層板及びプリント配線板

Publications (2)

Publication Number Publication Date
JPWO2021193246A1 true JPWO2021193246A1 (zh) 2021-09-30
JP7374298B2 JP7374298B2 (ja) 2023-11-06

Family

ID=77890373

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022509983A Active JP7374298B2 (ja) 2020-03-23 2021-03-16 粗化処理銅箔、銅張積層板及びプリント配線板

Country Status (5)

Country Link
JP (1) JP7374298B2 (zh)
KR (1) KR20220130189A (zh)
CN (1) CN115413301A (zh)
TW (1) TWI763387B (zh)
WO (1) WO2021193246A1 (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12060647B2 (en) * 2021-07-06 2024-08-13 Chang Chun Petrochemical Co., Ltd. Surface-treated copper foil and copper clad laminate
TWI756155B (zh) * 2021-07-19 2022-02-21 長春石油化學股份有限公司 表面處理銅箔及銅箔基板
CN117916553A (zh) * 2021-12-22 2024-04-19 三井金属矿业株式会社 铜箔的表面参数的测定方法、铜箔的筛选方法以及表面处理铜箔的制造方法
WO2023182175A1 (ja) * 2022-03-24 2023-09-28 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
WO2023182174A1 (ja) * 2022-03-24 2023-09-28 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
WO2023182176A1 (ja) * 2022-03-24 2023-09-28 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板
WO2023182177A1 (ja) * 2022-03-24 2023-09-28 三井金属鉱業株式会社 粗化処理銅箔、キャリア付銅箔、銅張積層板及びプリント配線板

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004099950A (ja) * 2002-09-06 2004-04-02 Nikko Materials Co Ltd 銅箔の連続電解厚めっき方法及び装置
JP2005008973A (ja) * 2003-06-20 2005-01-13 Hitachi Cable Ltd 銅箔の表面粗化方法
JP2007238968A (ja) * 2006-03-06 2007-09-20 Furukawa Electric Co Ltd:The 銅箔、銅箔の製造方法および前記銅箔を用いた積層回路基板
JP2015148011A (ja) * 2013-08-20 2015-08-20 Jx日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP2018074153A (ja) * 2015-08-06 2018-05-10 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP2018172785A (ja) * 2017-03-31 2018-11-08 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6193534B2 (ja) * 2015-07-03 2017-09-06 三井金属鉱業株式会社 粗化処理銅箔、銅張積層板及びプリント配線板
CN108697006B (zh) * 2017-03-31 2021-07-16 Ｊｘ金属株式会社 表面处理铜箔、附载体铜箔、积层体、印刷配线板的制造方法及电子机器的制造方法
KR102297790B1 (ko) * 2017-05-19 2021-09-06 미쓰이금속광업주식회사 조화 처리 구리박, 캐리어를 구비한 구리박, 동장 적층판 및 프린트 배선판

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004099950A (ja) * 2002-09-06 2004-04-02 Nikko Materials Co Ltd 銅箔の連続電解厚めっき方法及び装置
JP2005008973A (ja) * 2003-06-20 2005-01-13 Hitachi Cable Ltd 銅箔の表面粗化方法
JP2007238968A (ja) * 2006-03-06 2007-09-20 Furukawa Electric Co Ltd:The 銅箔、銅箔の製造方法および前記銅箔を用いた積層回路基板
JP2015148011A (ja) * 2013-08-20 2015-08-20 Jx日鉱日石金属株式会社 表面処理銅箔及びそれを用いた積層板、プリント配線板、電子機器、並びに、プリント配線板の製造方法
JP2018074153A (ja) * 2015-08-06 2018-05-10 Ｊｘ金属株式会社 キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法
JP2018172785A (ja) * 2017-03-31 2018-11-08 Ｊｘ金属株式会社 表面処理銅箔、樹脂層付き表面処理銅箔、キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法

Also Published As

Publication number Publication date
WO2021193246A1 (ja) 2021-09-30
TWI763387B (zh) 2022-05-01
JP7374298B2 (ja) 2023-11-06
KR20220130189A (ko) 2022-09-26
TW202206651A (zh) 2022-02-16
CN115413301A (zh) 2022-11-29

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