JPWO2021176913A5 - - Google Patents

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Publication number
JPWO2021176913A5
JPWO2021176913A5 JP2022505043A JP2022505043A JPWO2021176913A5 JP WO2021176913 A5 JPWO2021176913 A5 JP WO2021176913A5 JP 2022505043 A JP2022505043 A JP 2022505043A JP 2022505043 A JP2022505043 A JP 2022505043A JP WO2021176913 A5 JPWO2021176913 A5 JP WO2021176913A5
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JP
Japan
Prior art keywords
ether
acid
liquid according
silane
processing liquid
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022505043A
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English (en)
Japanese (ja)
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JPWO2021176913A1 (https=
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Publication date
Application filed filed Critical
Priority claimed from PCT/JP2021/003521 external-priority patent/WO2021176913A1/ja
Publication of JPWO2021176913A1 publication Critical patent/JPWO2021176913A1/ja
Publication of JPWO2021176913A5 publication Critical patent/JPWO2021176913A5/ja
Priority to JP2023208933A priority Critical patent/JP7614310B2/ja
Pending legal-status Critical Current

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JP2022505043A 2020-03-04 2021-02-01 Pending JPWO2021176913A1 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2023208933A JP7614310B2 (ja) 2020-03-04 2023-12-12 処理液、処理液収容体

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020036719 2020-03-04
PCT/JP2021/003521 WO2021176913A1 (ja) 2020-03-04 2021-02-01 処理液、処理液収容体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2023208933A Division JP7614310B2 (ja) 2020-03-04 2023-12-12 処理液、処理液収容体

Publications (2)

Publication Number Publication Date
JPWO2021176913A1 JPWO2021176913A1 (https=) 2021-09-10
JPWO2021176913A5 true JPWO2021176913A5 (https=) 2022-10-19

Family

ID=77614011

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022505043A Pending JPWO2021176913A1 (https=) 2020-03-04 2021-02-01
JP2023208933A Active JP7614310B2 (ja) 2020-03-04 2023-12-12 処理液、処理液収容体

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2023208933A Active JP7614310B2 (ja) 2020-03-04 2023-12-12 処理液、処理液収容体

Country Status (3)

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US (1) US20230017832A1 (https=)
JP (2) JPWO2021176913A1 (https=)
WO (1) WO2021176913A1 (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20230102276A (ko) * 2021-12-30 2023-07-07 주식회사 이엔에프테크놀로지 실리콘 선택적 식각액 조성물
TW202429525A (zh) * 2022-09-14 2024-07-16 美商富士軟片電子材料美國股份有限公司 表面處理組成物及方法
JP2024124744A (ja) * 2023-03-03 2024-09-13 株式会社Screenホールディングス 基板処理方法および基板処理装置
US20240409812A1 (en) * 2023-06-06 2024-12-12 Tokyo Ohka Kogyo Co., Ltd. Treatment liquid
WO2025100286A1 (ja) * 2023-11-07 2025-05-15 富士フイルム株式会社 薬液、被処理物の処理方法、半導体デバイスの製造方法
WO2025204610A1 (ja) * 2024-03-26 2025-10-02 富士フイルム株式会社 薬液、被処理物の処理方法、半導体デバイスの製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002361819A (ja) * 2001-06-06 2002-12-18 Mitsubishi Chemicals Corp ポジ型平版印刷版の作製方法
EP1803149A2 (en) * 2004-09-15 2007-07-04 Honeywell International, Inc. Treating agent materials
JP2014093407A (ja) * 2012-11-02 2014-05-19 Fujifilm Corp エッチング液、これを用いたエッチング方法及び半導体素子の製造方法
WO2014115758A1 (ja) * 2013-01-24 2014-07-31 昭和電工株式会社 エッチング液
KR102338550B1 (ko) * 2013-06-06 2021-12-14 엔테그리스, 아이엔씨. 질화 티타늄의 선택적인 에칭을 위한 조성물 및 방법
CN107851660B (zh) * 2015-07-09 2022-02-01 恩特格里斯公司 相对于锗选择性蚀刻硅锗的调配物
EP3331978B1 (en) * 2015-08-03 2024-10-09 Fujifilm Electronic Materials USA, Inc. Cleaning composition
KR102067444B1 (ko) * 2015-12-11 2020-01-17 후지필름 가부시키가이샤 반도체 디바이스용 처리액의 보관 방법, 처리액 수용체
JPWO2018061670A1 (ja) * 2016-09-29 2019-06-24 富士フイルム株式会社 処理液、および積層体の処理方法
US10879076B2 (en) * 2017-08-25 2020-12-29 Versum Materials Us, Llc Etching solution for selectively removing silicon-germanium alloy from a silicon-germanium/silicon stack during manufacture of a semiconductor device
JP7104053B2 (ja) * 2017-09-07 2022-07-20 株式会社フジミインコーポレーテッド 研磨用組成物およびシリコン基板研磨方法
JP2019070081A (ja) * 2017-10-10 2019-05-09 Agc株式会社 水性分散液、被膜及び被覆織布
JP6777704B2 (ja) * 2017-10-20 2020-10-28 東京エレクトロン株式会社 基板処理装置、基板処理方法および記憶媒体
US10934484B2 (en) * 2018-03-09 2021-03-02 Versum Materials Us, Llc Etching solution for selectively removing silicon-germanium alloy from a silicon-germanium/ germanium stack during manufacture of a semiconductor device
US11017995B2 (en) * 2018-07-26 2021-05-25 Versum Materials Us, Llc Composition for TiN hard mask removal and etch residue cleaning

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