JPWO2021171859A1 - - Google Patents
Info
- Publication number
- JPWO2021171859A1 JPWO2021171859A1 JP2022503169A JP2022503169A JPWO2021171859A1 JP WO2021171859 A1 JPWO2021171859 A1 JP WO2021171859A1 JP 2022503169 A JP2022503169 A JP 2022503169A JP 2022503169 A JP2022503169 A JP 2022503169A JP WO2021171859 A1 JPWO2021171859 A1 JP WO2021171859A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B33/00—Silicon; Compounds thereof
- C01B33/113—Silicon oxides; Hydrates thereof
- C01B33/12—Silica; Hydrates thereof, e.g. lepidoic silicic acid
- C01B33/18—Preparation of finely divided silica neither in sol nor in gel form; After-treatment thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
- B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/10—Metal compounds
- C08K3/105—Compounds containing metals of Groups 1 to 3 or of Groups 11 to 13 of the Periodic Table
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/22—Expanded, porous or hollow particles
- C08K7/24—Expanded, porous or hollow particles inorganic
- C08K7/26—Silicon- containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/54—Particles characterised by their aspect ratio, i.e. the ratio of sizes in the longest to the shortest dimension
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Inorganic Chemistry (AREA)
- Silicon Compounds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2023137916A JP2023158027A (ja) | 2020-02-28 | 2023-08-28 | 中空粒子、該中空粒子の製造方法、樹脂組成物、ならびに該樹脂組成物を用いた樹脂成形体および積層体 |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020033973 | 2020-02-28 | ||
JP2020033973 | 2020-02-28 | ||
PCT/JP2021/002365 WO2021171859A1 (ja) | 2020-02-28 | 2021-01-25 | 中空粒子、該中空粒子の製造方法、樹脂組成物、ならびに該樹脂組成物を用いた樹脂成形体および積層体 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023137916A Division JP2023158027A (ja) | 2020-02-28 | 2023-08-28 | 中空粒子、該中空粒子の製造方法、樹脂組成物、ならびに該樹脂組成物を用いた樹脂成形体および積層体 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021171859A1 true JPWO2021171859A1 (ja) | 2021-09-02 |
JP7385735B2 JP7385735B2 (ja) | 2023-11-22 |
Family
ID=77490850
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022503169A Active JP7385735B2 (ja) | 2020-02-28 | 2021-01-25 | 中空粒子、該中空粒子の製造方法、樹脂組成物、ならびに該樹脂組成物を用いた樹脂成形体および積層体 |
JP2023137916A Pending JP2023158027A (ja) | 2020-02-28 | 2023-08-28 | 中空粒子、該中空粒子の製造方法、樹脂組成物、ならびに該樹脂組成物を用いた樹脂成形体および積層体 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2023137916A Pending JP2023158027A (ja) | 2020-02-28 | 2023-08-28 | 中空粒子、該中空粒子の製造方法、樹脂組成物、ならびに該樹脂組成物を用いた樹脂成形体および積層体 |
Country Status (5)
Country | Link |
---|---|
JP (2) | JP7385735B2 (ja) |
KR (1) | KR20220132585A (ja) |
CN (1) | CN115135601B (ja) |
TW (1) | TW202132452A (ja) |
WO (1) | WO2021171859A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2023238558A1 (ja) * | 2022-06-09 | 2023-12-14 | セトラスホールディングス株式会社 | 中空粒子及びその製造方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007204293A (ja) * | 2006-01-31 | 2007-08-16 | Kyowa Chem Ind Co Ltd | 多孔質粒子およびその製造方法 |
JP2012144394A (ja) * | 2011-01-12 | 2012-08-02 | Konica Minolta Holdings Inc | 中空粒子の製造方法、中空粒子を用いた光学材料及び断熱材料 |
JP2017501099A (ja) * | 2014-05-30 | 2017-01-12 | スギュン アット カンパニー リミテッド | 中空シリカ粒子の製造方法、中空シリカ粒子及びそれらを含む組成物、並びに断熱シート |
JP2017226567A (ja) * | 2016-06-21 | 2017-12-28 | 扶桑化学工業株式会社 | シリカ系中空粒子、コアシェル粒子及びポリスチレン粒子、並びに、それらの製造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007056158A (ja) | 2005-08-25 | 2007-03-08 | Nagoya Institute Of Technology | 樹脂組成物およびそれを用いた配線回路基板 |
CN102264799B (zh) * | 2008-12-25 | 2014-03-26 | 电气化学工业株式会社 | 复合颗粒及其制造方法、中空颗粒、其制造方法及用途 |
JP2017149630A (ja) * | 2016-02-26 | 2017-08-31 | 積水化学工業株式会社 | 複合材料、セラミック基材及び空孔形成用粒子 |
CN109504366A (zh) * | 2019-01-07 | 2019-03-22 | 青岛大学 | 一种稀土络合物包覆纳米空心SiO2和包覆型稀土络合物及其制备方法 |
-
2021
- 2021-01-25 KR KR1020227029229A patent/KR20220132585A/ko unknown
- 2021-01-25 CN CN202180016754.4A patent/CN115135601B/zh active Active
- 2021-01-25 WO PCT/JP2021/002365 patent/WO2021171859A1/ja active Application Filing
- 2021-01-25 JP JP2022503169A patent/JP7385735B2/ja active Active
- 2021-02-22 TW TW110106014A patent/TW202132452A/zh unknown
-
2023
- 2023-08-28 JP JP2023137916A patent/JP2023158027A/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007204293A (ja) * | 2006-01-31 | 2007-08-16 | Kyowa Chem Ind Co Ltd | 多孔質粒子およびその製造方法 |
JP2012144394A (ja) * | 2011-01-12 | 2012-08-02 | Konica Minolta Holdings Inc | 中空粒子の製造方法、中空粒子を用いた光学材料及び断熱材料 |
JP2017501099A (ja) * | 2014-05-30 | 2017-01-12 | スギュン アット カンパニー リミテッド | 中空シリカ粒子の製造方法、中空シリカ粒子及びそれらを含む組成物、並びに断熱シート |
JP2017226567A (ja) * | 2016-06-21 | 2017-12-28 | 扶桑化学工業株式会社 | シリカ系中空粒子、コアシェル粒子及びポリスチレン粒子、並びに、それらの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
KR20220132585A (ko) | 2022-09-30 |
JP7385735B2 (ja) | 2023-11-22 |
JP2023158027A (ja) | 2023-10-26 |
CN115135601A (zh) | 2022-09-30 |
CN115135601B (zh) | 2024-06-07 |
WO2021171859A1 (ja) | 2021-09-02 |
TW202132452A (zh) | 2021-09-01 |
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