JPWO2021167096A1 - - Google Patents
Info
- Publication number
- JPWO2021167096A1 JPWO2021167096A1 JP2022501093A JP2022501093A JPWO2021167096A1 JP WO2021167096 A1 JPWO2021167096 A1 JP WO2021167096A1 JP 2022501093 A JP2022501093 A JP 2022501093A JP 2022501093 A JP2022501093 A JP 2022501093A JP WO2021167096 A1 JPWO2021167096 A1 JP WO2021167096A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0066—Flame-proofing or flame-retarding additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K21/00—Fireproofing materials
- C09K21/06—Organic materials
- C09K21/08—Organic materials containing halogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
- C08F279/02—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00 on to polymers of conjugated dienes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/02—Halogenated hydrocarbons
- C08K5/03—Halogenated hydrocarbons aromatic, e.g. C6H5-CH2-Cl
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
- C08K5/18—Amines; Quaternary ammonium compounds with aromatically bound amino groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3412—Heterocyclic compounds having nitrogen in the ring having one nitrogen atom in the ring
- C08K5/3432—Six-membered rings
- C08K5/3435—Piperidines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/34—Heterocyclic compounds having nitrogen in the ring
- C08K5/3467—Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
- C08K5/3477—Six-membered rings
- C08K5/3492—Triazines
- C08K5/34926—Triazines also containing heterocyclic groups other than triazine groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
- C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
- C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/06—Polystyrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L9/00—Compositions of homopolymers or copolymers of conjugated diene hydrocarbons
- C08L9/06—Copolymers with styrene
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K21/00—Fireproofing materials
- C09K21/06—Organic materials
- C09K21/12—Organic materials containing phosphorus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
- H01Q9/04—Resonant antennas
- H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/06—Hydrocarbons
- C08F212/08—Styrene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/49—Phosphorus-containing compounds
- C08K5/51—Phosphorus bound to oxygen
- C08K5/52—Phosphorus bound to oxygen only
- C08K5/524—Esters of phosphorous acids, e.g. of H3PO3
- C08K5/526—Esters of phosphorous acids, e.g. of H3PO3 with hydroxyaryl compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L25/00—Compositions of, homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring; Compositions of derivatives of such polymers
- C08L25/02—Homopolymers or copolymers of hydrocarbons
- C08L25/04—Homopolymers or copolymers of styrene
- C08L25/08—Copolymers of styrene
- C08L25/14—Copolymers of styrene with unsaturated esters
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/065—Patch antenna array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/012—Flame-retardant; Preventing of inflammation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022152874A JP7503608B2 (ja) | 2020-02-21 | 2022-09-26 | スチレン系樹脂組成物、難燃性スチレン系樹脂組成物及び成形体、並びにパッチアンテナ |
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2020028494 | 2020-02-21 | ||
JP2020028494 | 2020-02-21 | ||
JP2020072534 | 2020-04-14 | ||
JP2020072534 | 2020-04-14 | ||
JP2020211849 | 2020-12-21 | ||
JP2020211849 | 2020-12-21 | ||
PCT/JP2021/006467 WO2021167096A1 (ja) | 2020-02-21 | 2021-02-19 | スチレン系樹脂組成物、難燃性スチレン系樹脂組成物及び成形体、並びにパッチアンテナ |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022152874A Division JP7503608B2 (ja) | 2020-02-21 | 2022-09-26 | スチレン系樹脂組成物、難燃性スチレン系樹脂組成物及び成形体、並びにパッチアンテナ |
Publications (3)
Publication Number | Publication Date |
---|---|
JPWO2021167096A1 true JPWO2021167096A1 (ja) | 2021-08-26 |
JPWO2021167096A5 JPWO2021167096A5 (ja) | 2022-07-19 |
JP7196359B2 JP7196359B2 (ja) | 2022-12-26 |
Family
ID=77390897
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022501093A Active JP7196359B2 (ja) | 2020-02-21 | 2021-02-19 | スチレン系樹脂組成物、難燃性スチレン系樹脂組成物及び成形体、並びにパッチアンテナ |
JP2022152874A Active JP7503608B2 (ja) | 2020-02-21 | 2022-09-26 | スチレン系樹脂組成物、難燃性スチレン系樹脂組成物及び成形体、並びにパッチアンテナ |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2022152874A Active JP7503608B2 (ja) | 2020-02-21 | 2022-09-26 | スチレン系樹脂組成物、難燃性スチレン系樹脂組成物及び成形体、並びにパッチアンテナ |
Country Status (6)
Country | Link |
---|---|
US (1) | US20230099634A1 (ja) |
JP (2) | JP7196359B2 (ja) |
KR (1) | KR20220110788A (ja) |
CN (1) | CN115087702B (ja) |
DE (1) | DE112021001158T5 (ja) |
WO (1) | WO2021167096A1 (ja) |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013151055A1 (ja) * | 2012-04-02 | 2013-10-10 | Psジャパン株式会社 | ポリスチレン系樹脂組成物及びこれを成形してなる導光板 |
JP2015151493A (ja) * | 2014-02-17 | 2015-08-24 | 三菱樹脂株式会社 | ウェルダー加工用フィルム |
JP2019189682A (ja) * | 2018-04-19 | 2019-10-31 | Psジャパン株式会社 | 難燃性スチレン系樹脂組成物及び成形品 |
Family Cites Families (24)
Publication number | Priority date | Publication date | Assignee | Title |
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DE69841728D1 (de) | 1997-06-30 | 2010-07-29 | Basf Se | Verwendung von NOR-HALS Verbindung als flammhemmende Additive in Polymerzusammensetzungen |
JP2001192565A (ja) | 2000-01-11 | 2001-07-17 | Idemitsu Petrochem Co Ltd | 難燃性熱可塑性樹脂組成物 |
JP4467816B2 (ja) | 2001-02-27 | 2010-05-26 | 株式会社日立製作所 | 低誘電正接樹脂組成物、硬化性フィルム、硬化物およびそれを用いた電気部品とその製法 |
JP3778857B2 (ja) * | 2002-02-08 | 2006-05-24 | Psジャパン株式会社 | 芳香族モノビニル系樹脂の製造方法 |
JP4822657B2 (ja) * | 2003-02-14 | 2011-11-24 | 東洋スチレン株式会社 | 食品包装材料用ゴム変性スチレン系樹脂組成物 |
JP4130133B2 (ja) * | 2003-02-21 | 2008-08-06 | 電気化学工業株式会社 | スチレン−(メタ)アクリル酸系共重合樹脂の製造方法 |
US20090111699A1 (en) | 2004-03-02 | 2009-04-30 | Adeka Corporation | Weakly Basic Hindered Amines Having Carbonate Skeletons, Synthetic Resin Compositions, And Coating Compositions |
JP2008537964A (ja) | 2005-01-19 | 2008-10-02 | ケビン ジー. ネルソン、 | 誘電体材料のための方法および組成物 |
JP4753624B2 (ja) * | 2005-05-24 | 2011-08-24 | 富士電機株式会社 | 難燃性樹脂加工品 |
DE602007003357D1 (de) | 2006-07-05 | 2009-12-31 | Basf Se | Verfahren zur herstellung sterisch gehinderter nitroxylether |
JP2009185265A (ja) * | 2008-02-11 | 2009-08-20 | Ntn Corp | 誘電性エラストマー組成物および高周波用電子部品材料 |
JP5414168B2 (ja) | 2007-11-14 | 2014-02-12 | 株式会社Adeka | 加工性の改善された難燃剤組成物、難燃性合成樹脂組成物及びその成形品 |
JP5415788B2 (ja) * | 2009-03-09 | 2014-02-12 | 東洋スチレン株式会社 | 導光板 |
WO2011099461A1 (ja) * | 2010-02-09 | 2011-08-18 | 丸菱油化工業株式会社 | 難燃剤及び難燃性樹脂組成物 |
RU2012145171A (ru) * | 2010-03-25 | 2014-04-27 | Басф Се | Огнезащитные композиции солей фосфиновых кислот и нитроксильных производных |
JP2014173034A (ja) * | 2013-03-11 | 2014-09-22 | Ps Japan Corp | 導光板用ポリスチレン系樹脂組成物及び導光板 |
KR102457996B1 (ko) * | 2015-02-12 | 2022-10-24 | 덴카 주식회사 | 광학용 스티렌계 수지 조성물 |
TWI596120B (zh) * | 2016-08-30 | 2017-08-21 | 奇美實業股份有限公司 | (甲基)丙烯酸酯系-苯乙烯系共聚物及其組成物以及成型品 |
WO2018051793A1 (ja) | 2016-09-13 | 2018-03-22 | 旭硝子株式会社 | 高周波デバイス用ガラス基板と高周波デバイス用回路基板 |
KR20180051793A (ko) | 2016-11-09 | 2018-05-17 | 조용직 | Rna 추출 시약 |
JP6353949B1 (ja) * | 2017-03-30 | 2018-07-04 | 東洋スチレン株式会社 | 熱可塑性樹脂組成物 |
JP6941487B2 (ja) * | 2017-06-16 | 2021-09-29 | デンカ株式会社 | 延伸シート及びその成形品 |
JP6988204B2 (ja) * | 2017-06-29 | 2022-01-05 | 昭和電工マテリアルズ株式会社 | 熱硬化性樹脂組成物、プリプレグ、積層板、プリント配線板及び高速通信対応モジュール |
JP7062501B2 (ja) | 2018-04-17 | 2022-05-06 | Psジャパン株式会社 | 難燃性スチレン系樹脂組成物及び成形品 |
-
2021
- 2021-02-19 WO PCT/JP2021/006467 patent/WO2021167096A1/ja active Application Filing
- 2021-02-19 KR KR1020227022452A patent/KR20220110788A/ko unknown
- 2021-02-19 DE DE112021001158.8T patent/DE112021001158T5/de active Pending
- 2021-02-19 CN CN202180014483.9A patent/CN115087702B/zh active Active
- 2021-02-19 JP JP2022501093A patent/JP7196359B2/ja active Active
- 2021-02-19 US US17/904,594 patent/US20230099634A1/en active Pending
-
2022
- 2022-09-26 JP JP2022152874A patent/JP7503608B2/ja active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2013151055A1 (ja) * | 2012-04-02 | 2013-10-10 | Psジャパン株式会社 | ポリスチレン系樹脂組成物及びこれを成形してなる導光板 |
JP2015151493A (ja) * | 2014-02-17 | 2015-08-24 | 三菱樹脂株式会社 | ウェルダー加工用フィルム |
JP2019189682A (ja) * | 2018-04-19 | 2019-10-31 | Psジャパン株式会社 | 難燃性スチレン系樹脂組成物及び成形品 |
Also Published As
Publication number | Publication date |
---|---|
KR20220110788A (ko) | 2022-08-09 |
CN115087702A (zh) | 2022-09-20 |
DE112021001158T5 (de) | 2022-12-22 |
US20230099634A1 (en) | 2023-03-30 |
JP7196359B2 (ja) | 2022-12-26 |
CN115087702B (zh) | 2024-05-31 |
JP7503608B2 (ja) | 2024-06-20 |
JP2022180568A (ja) | 2022-12-06 |
WO2021167096A1 (ja) | 2021-08-26 |
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