JPWO2021166179A1 - - Google Patents

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Publication number
JPWO2021166179A1
JPWO2021166179A1 JP2022501522A JP2022501522A JPWO2021166179A1 JP WO2021166179 A1 JPWO2021166179 A1 JP WO2021166179A1 JP 2022501522 A JP2022501522 A JP 2022501522A JP 2022501522 A JP2022501522 A JP 2022501522A JP WO2021166179 A1 JPWO2021166179 A1 JP WO2021166179A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022501522A
Other versions
JP7440606B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021166179A1 publication Critical patent/JPWO2021166179A1/ja
Application granted granted Critical
Publication of JP7440606B2 publication Critical patent/JP7440606B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/021—Loading or unloading of containers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/082—Integration of non-optical monitoring devices, i.e. using non-optical inspection means, e.g. electrical means, mechanical means or X-rays

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2022501522A 2020-02-20 2020-02-20 部品実装機および部品実装システム Active JP7440606B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2020/006872 WO2021166179A1 (ja) 2020-02-20 2020-02-20 部品実装機および部品実装システム

Publications (2)

Publication Number Publication Date
JPWO2021166179A1 true JPWO2021166179A1 (ja) 2021-08-26
JP7440606B2 JP7440606B2 (ja) 2024-02-28

Family

ID=77390754

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022501522A Active JP7440606B2 (ja) 2020-02-20 2020-02-20 部品実装機および部品実装システム

Country Status (5)

Country Link
US (1) US20230067782A1 (ja)
EP (1) EP4110030A4 (ja)
JP (1) JP7440606B2 (ja)
CN (1) CN115004878B (ja)
WO (1) WO2021166179A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2024069959A1 (ja) * 2022-09-30 2024-04-04 株式会社Fuji 部品実装機および部品有無判断方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08274500A (ja) * 1996-04-30 1996-10-18 Yamaha Motor Co Ltd 実装機の部品吸着状態検出装置
JP2937785B2 (ja) * 1995-02-02 1999-08-23 ヤマハ発動機株式会社 実装機の部品状態検出装置
JP6043994B2 (ja) * 2011-11-02 2016-12-14 Ｊｕｋｉオートメーションシステムズ株式会社 実装装置、部品切れ判定方法及びプログラム
JP6103800B2 (ja) * 2011-07-01 2017-03-29 富士機械製造株式会社 部品実装機

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5926950A (en) * 1995-12-28 1999-07-27 Fuji Machine Mfg. Co., Ltd. Electronic component transferring device and method, and electronic component mounting system and method
JP3402968B2 (ja) * 1996-11-18 2003-05-06 ヤマハ発動機株式会社 実装装置
JPWO2003088730A1 (ja) * 2002-04-01 2005-08-25 富士機械製造株式会社 対基板作業システム
JP4563205B2 (ja) * 2005-02-08 2010-10-13 富士機械製造株式会社 実装された電子部品の検査方法及び装置
JP5013816B2 (ja) * 2006-11-01 2012-08-29 Ｊｕｋｉ株式会社 表面実装装置
JP5385010B2 (ja) * 2009-05-29 2014-01-08 Ｊｕｋｉ株式会社 電子部品実装装置
US9265186B2 (en) * 2011-11-10 2016-02-16 Delaware Capital Formation, Inc. Camera system for aligning components of a PCB
JP6114509B2 (ja) * 2012-06-28 2017-04-12 ヤマハ発動機株式会社 部品供給装置及び部品実装装置
CN105659719B (zh) * 2013-10-21 2019-10-18 株式会社富士 电子元件装配装置
US10225969B2 (en) * 2015-01-06 2019-03-05 Panasonic Intellectual Property Management Co., Ltd. Electronic component supply apparatus and method of processing component supply tape in electronic component supply apparatus
EP3334264B1 (en) 2015-08-05 2020-10-14 FUJI Corporation Component mounting apparatus
JP2017011316A (ja) 2016-10-21 2017-01-12 富士機械製造株式会社 部品実装機のカセット式フィーダ入替システム
JP6496908B2 (ja) * 2016-10-28 2019-04-10 パナソニックＩｐマネジメント株式会社 部品実装システム
WO2019058416A1 (ja) * 2017-09-19 2019-03-28 株式会社Ｆｕｊｉ 部品実装システム
WO2019058530A1 (ja) * 2017-09-22 2019-03-28 株式会社Ｆｕｊｉ 部品装着機、および部品落下の判定方法
CN112042287B (zh) * 2018-01-18 2022-12-13 雅马哈发动机株式会社 元件安装机、元件用尽判定方法
JP7113187B2 (ja) 2018-01-29 2022-08-05 パナソニックＩｐマネジメント株式会社 部品供給装置および部品装着システムならびに部品装着方法
CN111869342B (zh) * 2018-03-23 2021-11-26 株式会社富士 元件安装装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2937785B2 (ja) * 1995-02-02 1999-08-23 ヤマハ発動機株式会社 実装機の部品状態検出装置
JPH08274500A (ja) * 1996-04-30 1996-10-18 Yamaha Motor Co Ltd 実装機の部品吸着状態検出装置
JP6103800B2 (ja) * 2011-07-01 2017-03-29 富士機械製造株式会社 部品実装機
JP6043994B2 (ja) * 2011-11-02 2016-12-14 Ｊｕｋｉオートメーションシステムズ株式会社 実装装置、部品切れ判定方法及びプログラム

Also Published As

Publication number Publication date
CN115004878B (zh) 2023-10-24
WO2021166179A1 (ja) 2021-08-26
EP4110030A1 (en) 2022-12-28
JP7440606B2 (ja) 2024-02-28
CN115004878A (zh) 2022-09-02
US20230067782A1 (en) 2023-03-02
EP4110030A4 (en) 2023-03-01

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