JPWO2021152776A1 - - Google Patents
Info
- Publication number
- JPWO2021152776A1 JPWO2021152776A1 JP2020519467A JP2020519467A JPWO2021152776A1 JP WO2021152776 A1 JPWO2021152776 A1 JP WO2021152776A1 JP 2020519467 A JP2020519467 A JP 2020519467A JP 2020519467 A JP2020519467 A JP 2020519467A JP WO2021152776 A1 JPWO2021152776 A1 JP WO2021152776A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/30—Piezoelectric or electrostrictive devices with mechanical input and electrical output, e.g. functioning as generators or sensors
- H10N30/302—Sensors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
- B06B1/0629—Square array
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/85—Piezoelectric or electrostrictive active materials
- H10N30/857—Macromolecular compositions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Ultra Sonic Daignosis Equipment (AREA)
- Transducers For Ultrasonic Waves (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2020/003454 WO2021152776A1 (ja) | 2020-01-30 | 2020-01-30 | 超音波トランスデューサー及びその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP6776481B1 JP6776481B1 (ja) | 2020-10-28 |
| JPWO2021152776A1 true JPWO2021152776A1 (https=) | 2021-08-05 |
Family
ID=72916120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2020519467A Active JP6776481B1 (ja) | 2020-01-30 | 2020-01-30 | 超音波トランスデューサー及びその製造方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20230034997A1 (https=) |
| EP (2) | EP4424430A3 (https=) |
| JP (1) | JP6776481B1 (https=) |
| WO (1) | WO2021152776A1 (https=) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022168188A1 (ja) * | 2021-02-03 | 2022-08-11 | サンコール株式会社 | 超音波トランスデューサー及びその製造方法 |
| JP7139545B1 (ja) * | 2021-09-01 | 2022-09-20 | サンコール株式会社 | 超音波トランスデューサー |
| JP7486670B2 (ja) * | 2021-09-28 | 2024-05-17 | サンコール株式会社 | 圧電素子アッセンブリ及びその製造方法 |
| JP7154462B1 (ja) * | 2021-11-25 | 2022-10-17 | サンコール株式会社 | 超音波トランスデューサー及びその製造方法 |
| CA3241842A1 (en) * | 2021-12-15 | 2023-06-22 | K F Group Pty Ltd | Wear sensor |
| JP7659667B2 (ja) * | 2022-02-09 | 2025-04-09 | 株式会社ジャパンディスプレイ | 検出装置 |
| JP7671420B2 (ja) * | 2023-03-27 | 2025-05-01 | サンコール株式会社 | 圧電素子、超音波トランスデューサー及びその製造方法 |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59110978A (ja) | 1982-12-16 | 1984-06-27 | Keihin Seiki Mfg Co Ltd | 制御弁 |
| JP5552825B2 (ja) * | 2010-02-10 | 2014-07-16 | セイコーエプソン株式会社 | アクチュエータ、液滴噴射ヘッド及びその製造方法、並びに液滴噴射装置 |
| US8680745B2 (en) * | 2010-07-21 | 2014-03-25 | General Electric Company | Device for measuring material thickness |
| JP5990930B2 (ja) * | 2012-02-24 | 2016-09-14 | セイコーエプソン株式会社 | 超音波トランスデューサー素子チップおよびプローブ並びに電子機器および超音波診断装置 |
| JP6442821B2 (ja) * | 2013-09-30 | 2018-12-26 | セイコーエプソン株式会社 | 超音波デバイス及び電子機器 |
| JP6229431B2 (ja) * | 2013-10-28 | 2017-11-15 | セイコーエプソン株式会社 | 超音波デバイス、超音波プローブヘッド、超音波プローブ、電子機器および超音波画像装置 |
| JP6252130B2 (ja) * | 2013-11-20 | 2017-12-27 | セイコーエプソン株式会社 | 超音波デバイスおよびその製造方法並びに電子機器および超音波画像装置 |
| JP2015097733A (ja) * | 2013-11-20 | 2015-05-28 | セイコーエプソン株式会社 | 超音波デバイスおよびその製造方法並びに電子機器および超音波画像装置 |
| US9772314B2 (en) * | 2013-12-18 | 2017-09-26 | Seiko Epson Corporation | Ultrasonic sensor and measuring method using the same, and method of manufacturing ultrasonic sensor |
| JP6617536B2 (ja) * | 2015-11-30 | 2019-12-11 | セイコーエプソン株式会社 | 圧電デバイス、圧電モジュール及び電子機器 |
| JP6499097B2 (ja) | 2016-02-15 | 2019-04-10 | 日本電信電話株式会社 | リソース割当計算装置、リソース割当計算方法、及びプログラム |
| JP2017169161A (ja) * | 2016-03-18 | 2017-09-21 | セイコーエプソン株式会社 | 超音波デバイス、超音波測定装置、超音波画像処理装置 |
| JP6801328B2 (ja) * | 2016-04-27 | 2020-12-16 | セイコーエプソン株式会社 | 実装構造体、超音波デバイス、超音波探触子、超音波装置、及び電子機器 |
| JP6836121B2 (ja) * | 2016-08-19 | 2021-02-24 | セイコーエプソン株式会社 | 実装構造体、超音波デバイス、超音波探触子、超音波装置、電子機器、及び実装構造体の製造方法 |
| JP7091699B2 (ja) * | 2018-02-21 | 2022-06-28 | セイコーエプソン株式会社 | 超音波センサー、超音波装置、及び超音波センサーの製造方法 |
| JP6496097B1 (ja) * | 2018-06-06 | 2019-04-03 | サンコール株式会社 | 超音波トランスデューサー及びその製造方法 |
| WO2020170286A1 (ja) | 2019-02-18 | 2020-08-27 | サンコール株式会社 | 超音波トランスデューサー及びその製造方法 |
| WO2020202351A1 (ja) | 2019-03-29 | 2020-10-08 | サンコール株式会社 | 超音波トランスデューサー及びその製造方法 |
| JP7268477B2 (ja) * | 2019-05-20 | 2023-05-08 | Tdk株式会社 | 音響デバイス |
| JP7486670B2 (ja) * | 2021-09-28 | 2024-05-17 | サンコール株式会社 | 圧電素子アッセンブリ及びその製造方法 |
| JP7154462B1 (ja) * | 2021-11-25 | 2022-10-17 | サンコール株式会社 | 超音波トランスデューサー及びその製造方法 |
-
2020
- 2020-01-30 EP EP24189620.8A patent/EP4424430A3/en not_active Withdrawn
- 2020-01-30 JP JP2020519467A patent/JP6776481B1/ja active Active
- 2020-01-30 WO PCT/JP2020/003454 patent/WO2021152776A1/ja not_active Ceased
- 2020-01-30 EP EP20916477.1A patent/EP4099718A4/en active Pending
- 2020-01-30 US US17/788,249 patent/US20230034997A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| EP4099718A1 (en) | 2022-12-07 |
| EP4099718A4 (en) | 2024-02-14 |
| WO2021152776A1 (ja) | 2021-08-05 |
| JP6776481B1 (ja) | 2020-10-28 |
| US20230034997A1 (en) | 2023-02-02 |
| EP4424430A2 (en) | 2024-09-04 |
| EP4424430A3 (en) | 2024-11-13 |
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