JPWO2023053160A1 - - Google Patents
Info
- Publication number
- JPWO2023053160A1 JPWO2023053160A1 JP2023531006A JP2023531006A JPWO2023053160A1 JP WO2023053160 A1 JPWO2023053160 A1 JP WO2023053160A1 JP 2023531006 A JP2023531006 A JP 2023531006A JP 2023531006 A JP2023531006 A JP 2023531006A JP WO2023053160 A1 JPWO2023053160 A1 JP WO2023053160A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
- H10N30/067—Forming single-layered electrodes of multilayered piezoelectric or electrostrictive parts
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
- H04R17/00—Piezoelectric transducers; Electrostrictive transducers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/06—Forming electrodes or interconnections, e.g. leads or terminals
- H10N30/063—Forming interconnections, e.g. connection electrodes of multilayered piezoelectric or electrostrictive parts
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/07—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base
- H10N30/072—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies
- H10N30/073—Forming of piezoelectric or electrostrictive parts or bodies on an electrical element or another base by laminating or bonding of piezoelectric or electrostrictive bodies by fusion of metals or by adhesives
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/50—Piezoelectric or electrostrictive devices having a stacked or multilayer structure
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/871—Single-layered electrodes of multilayer piezoelectric or electrostrictive devices, e.g. internal electrodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/872—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices
- H10N30/874—Interconnections, e.g. connection electrodes of multilayer piezoelectric or electrostrictive devices embedded within piezoelectric or electrostrictive material, e.g. via connections
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/87—Electrodes or interconnections, e.g. leads or terminals
- H10N30/875—Further connection or lead arrangements, e.g. flexible wiring boards, terminal pins
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/80—Constructional details
- H10N30/88—Mounts; Supports; Enclosures; Casings
- H10N30/883—Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Transducers For Ultrasonic Waves (AREA)
- Piezo-Electric Transducers For Audible Bands (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2021/035501 WO2023053160A1 (ja) | 2021-09-28 | 2021-09-28 | 圧電素子アッセンブリ及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023053160A1 true JPWO2023053160A1 (https=) | 2023-04-06 |
| JPWO2023053160A5 JPWO2023053160A5 (https=) | 2023-09-06 |
| JP7486670B2 JP7486670B2 (ja) | 2024-05-17 |
Family
ID=85781449
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023531006A Active JP7486670B2 (ja) | 2021-09-28 | 2021-09-28 | 圧電素子アッセンブリ及びその製造方法 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20250204257A1 (https=) |
| JP (1) | JP7486670B2 (https=) |
| WO (1) | WO2023053160A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP4424430A3 (en) * | 2020-01-30 | 2024-11-13 | Suncall Corporation | Ultrasonic transducer and method for manufacturing the same |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006060281A (ja) * | 2004-08-17 | 2006-03-02 | Seiko Epson Corp | 圧電発振器 |
| JP2018051903A (ja) * | 2016-09-28 | 2018-04-05 | ブラザー工業株式会社 | アクチュエータ装置、及び、液体吐出装置 |
| WO2019234854A1 (ja) * | 2018-06-06 | 2019-12-12 | サンコール株式会社 | 超音波トランスデューサー及びその製造方法 |
| WO2021152776A1 (ja) * | 2020-01-30 | 2021-08-05 | サンコール株式会社 | 超音波トランスデューサー及びその製造方法 |
-
2021
- 2021-09-28 JP JP2023531006A patent/JP7486670B2/ja active Active
- 2021-09-28 WO PCT/JP2021/035501 patent/WO2023053160A1/ja not_active Ceased
- 2021-09-28 US US18/696,195 patent/US20250204257A1/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006060281A (ja) * | 2004-08-17 | 2006-03-02 | Seiko Epson Corp | 圧電発振器 |
| JP2018051903A (ja) * | 2016-09-28 | 2018-04-05 | ブラザー工業株式会社 | アクチュエータ装置、及び、液体吐出装置 |
| WO2019234854A1 (ja) * | 2018-06-06 | 2019-12-12 | サンコール株式会社 | 超音波トランスデューサー及びその製造方法 |
| WO2021152776A1 (ja) * | 2020-01-30 | 2021-08-05 | サンコール株式会社 | 超音波トランスデューサー及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2023053160A1 (ja) | 2023-04-06 |
| JP7486670B2 (ja) | 2024-05-17 |
| US20250204257A1 (en) | 2025-06-19 |
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