JPWO2021149727A1 - - Google Patents

Info

Publication number
JPWO2021149727A1
JPWO2021149727A1 JP2021572768A JP2021572768A JPWO2021149727A1 JP WO2021149727 A1 JPWO2021149727 A1 JP WO2021149727A1 JP 2021572768 A JP2021572768 A JP 2021572768A JP 2021572768 A JP2021572768 A JP 2021572768A JP WO2021149727 A1 JPWO2021149727 A1 JP WO2021149727A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021572768A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021149727A1 publication Critical patent/JPWO2021149727A1/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293Organic, e.g. plastic
    • H01L23/295Organic, e.g. plastic containing a filler
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Polymerisation Methods In General (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2021572768A 2020-01-23 2021-01-20 Pending JPWO2021149727A1 (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020009046 2020-01-23
PCT/JP2021/001867 WO2021149727A1 (ja) 2020-01-23 2021-01-20 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法

Publications (1)

Publication Number Publication Date
JPWO2021149727A1 true JPWO2021149727A1 (zh) 2021-07-29

Family

ID=76991775

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021572768A Pending JPWO2021149727A1 (zh) 2020-01-23 2021-01-20

Country Status (5)

Country Link
JP (1) JPWO2021149727A1 (zh)
KR (1) KR20220131239A (zh)
CN (1) CN115004357A (zh)
TW (1) TW202136467A (zh)
WO (1) WO2021149727A1 (zh)

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5309415B2 (ja) 2005-03-03 2013-10-09 日立化成株式会社 封止用エポキシ樹脂成形材料及び電子部品装置
JP7154732B2 (ja) * 2016-03-31 2022-10-18 味の素株式会社 樹脂組成物
JP7046477B2 (ja) * 2016-07-01 2022-04-04 味の素株式会社 樹脂組成物
JP7102093B2 (ja) * 2016-09-28 2022-07-19 味の素株式会社 樹脂組成物、樹脂シート、回路基板及び半導体チップパッケージ
JP2018133535A (ja) * 2017-02-17 2018-08-23 日立化成株式会社 Wlp構造光半導体素子用封止材、wlp、wlp構造光半導体装置、光半導体装置の製造方法
JP2019029530A (ja) * 2017-07-31 2019-02-21 日立化成株式会社 光半導体装置及び携帯液晶バックライト

Also Published As

Publication number Publication date
CN115004357A (zh) 2022-09-02
WO2021149727A1 (ja) 2021-07-29
KR20220131239A (ko) 2022-09-27
TW202136467A (zh) 2021-10-01

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20231109