JPWO2023038035A1 - - Google Patents
Info
- Publication number
- JPWO2023038035A1 JPWO2023038035A1 JP2023546952A JP2023546952A JPWO2023038035A1 JP WO2023038035 A1 JPWO2023038035 A1 JP WO2023038035A1 JP 2023546952 A JP2023546952 A JP 2023546952A JP 2023546952 A JP2023546952 A JP 2023546952A JP WO2023038035 A1 JPWO2023038035 A1 JP WO2023038035A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/10—Materials in mouldable or extrudable form for sealing or packing joints or covers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021147100 | 2021-09-09 | ||
| PCT/JP2022/033480 WO2023038035A1 (ja) | 2021-09-09 | 2022-09-06 | 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPWO2023038035A1 true JPWO2023038035A1 (zh) | 2023-03-16 |
Family
ID=85507616
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023546952A Pending JPWO2023038035A1 (zh) | 2021-09-09 | 2022-09-06 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JPWO2023038035A1 (zh) |
| KR (1) | KR20240052770A (zh) |
| TW (1) | TW202313759A (zh) |
| WO (1) | WO2023038035A1 (zh) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6874350B2 (ja) * | 2016-12-06 | 2021-05-19 | 住友ベークライト株式会社 | 樹脂シート |
| JP7258453B2 (ja) * | 2017-03-31 | 2023-04-17 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物、キャリア付樹脂膜、プリプレグ、プリント配線基板および半導体装置 |
| JP6787279B2 (ja) * | 2017-08-24 | 2020-11-18 | 味の素株式会社 | 樹脂組成物 |
| WO2019127391A1 (zh) * | 2017-12-29 | 2019-07-04 | 广东生益科技股份有限公司 | 马来酰亚胺树脂组合物、预浸料、层压板和印刷电路板 |
| JP7206613B2 (ja) * | 2018-04-02 | 2023-01-18 | 味の素株式会社 | 樹脂組成物 |
| KR20220025804A (ko) * | 2019-06-26 | 2022-03-03 | 쇼와덴코머티리얼즈가부시끼가이샤 | 밀봉용 수지 조성물, 전자 부품 장치 및 전자 부품 장치의 제조 방법 |
-
2022
- 2022-09-06 WO PCT/JP2022/033480 patent/WO2023038035A1/ja active Application Filing
- 2022-09-06 KR KR1020247007904A patent/KR20240052770A/ko unknown
- 2022-09-06 JP JP2023546952A patent/JPWO2023038035A1/ja active Pending
- 2022-09-08 TW TW111133996A patent/TW202313759A/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TW202313759A (zh) | 2023-04-01 |
| KR20240052770A (ko) | 2024-04-23 |
| WO2023038035A1 (ja) | 2023-03-16 |