JPWO2021124549A1 - - Google Patents

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Publication number
JPWO2021124549A1
JPWO2021124549A1 JP2021565285A JP2021565285A JPWO2021124549A1 JP WO2021124549 A1 JPWO2021124549 A1 JP WO2021124549A1 JP 2021565285 A JP2021565285 A JP 2021565285A JP 2021565285 A JP2021565285 A JP 2021565285A JP WO2021124549 A1 JPWO2021124549 A1 JP WO2021124549A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021565285A
Other versions
JPWO2021124549A5 (ja
JP7113985B2 (ja
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Publication of JPWO2021124549A1 publication Critical patent/JPWO2021124549A1/ja
Publication of JPWO2021124549A5 publication Critical patent/JPWO2021124549A5/ja
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Publication of JP7113985B2 publication Critical patent/JP7113985B2/ja
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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/12Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Electrodes Of Semiconductors (AREA)
JP2021565285A 2019-12-20 2019-12-20 半導体素子及び半導体素子の製造方法 Active JP7113985B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/050098 WO2021124549A1 (ja) 2019-12-20 2019-12-20 半導体素子及び半導体素子の製造方法

Publications (3)

Publication Number Publication Date
JPWO2021124549A1 true JPWO2021124549A1 (ja) 2021-06-24
JPWO2021124549A5 JPWO2021124549A5 (ja) 2022-02-17
JP7113985B2 JP7113985B2 (ja) 2022-08-05

Family

ID=76478379

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021565285A Active JP7113985B2 (ja) 2019-12-20 2019-12-20 半導体素子及び半導体素子の製造方法

Country Status (2)

Country Link
JP (1) JP7113985B2 (ja)
WO (1) WO2021124549A1 (ja)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05183189A (ja) * 1991-11-08 1993-07-23 Nichia Chem Ind Ltd p型窒化ガリウム系化合物半導体の製造方法。
JP2014116483A (ja) * 2012-12-11 2014-06-26 Toyoda Gosei Co Ltd 半導体素子の製造方法、および半導体素子
JP2014183146A (ja) * 2013-03-19 2014-09-29 Toyoda Gosei Co Ltd 半導体装置およびその製造方法
JP2015079894A (ja) * 2013-10-17 2015-04-23 新電元工業株式会社 半導体装置及び半導体装置の製造方法
JP2019175905A (ja) * 2018-03-27 2019-10-10 豊田合成株式会社 半導体装置の製造方法
JP2020027855A (ja) * 2018-08-10 2020-02-20 ローム株式会社 SiC半導体装置
JP2020181891A (ja) * 2019-04-25 2020-11-05 株式会社豊田中央研究所 窒化物半導体装置および窒化物半導体装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5183189B2 (ja) 2007-12-21 2013-04-17 株式会社タカラ 蓄熱材マット

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05183189A (ja) * 1991-11-08 1993-07-23 Nichia Chem Ind Ltd p型窒化ガリウム系化合物半導体の製造方法。
JP2014116483A (ja) * 2012-12-11 2014-06-26 Toyoda Gosei Co Ltd 半導体素子の製造方法、および半導体素子
JP2014183146A (ja) * 2013-03-19 2014-09-29 Toyoda Gosei Co Ltd 半導体装置およびその製造方法
JP2015079894A (ja) * 2013-10-17 2015-04-23 新電元工業株式会社 半導体装置及び半導体装置の製造方法
JP2019175905A (ja) * 2018-03-27 2019-10-10 豊田合成株式会社 半導体装置の製造方法
JP2020027855A (ja) * 2018-08-10 2020-02-20 ローム株式会社 SiC半導体装置
JP2020181891A (ja) * 2019-04-25 2020-11-05 株式会社豊田中央研究所 窒化物半導体装置および窒化物半導体装置の製造方法

Also Published As

Publication number Publication date
WO2021124549A1 (ja) 2021-06-24
JP7113985B2 (ja) 2022-08-05

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