JPWO2021100366A1 - - Google Patents

Info

Publication number
JPWO2021100366A1
JPWO2021100366A1 JP2021558219A JP2021558219A JPWO2021100366A1 JP WO2021100366 A1 JPWO2021100366 A1 JP WO2021100366A1 JP 2021558219 A JP2021558219 A JP 2021558219A JP 2021558219 A JP2021558219 A JP 2021558219A JP WO2021100366 A1 JPWO2021100366 A1 JP WO2021100366A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2021558219A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021100366A1 publication Critical patent/JPWO2021100366A1/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/80—Constructional details
    • H10K30/88—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K30/00—Organic devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation
    • H10K30/50—Photovoltaic [PV] devices
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Details Of Resistors (AREA)
  • Led Device Packages (AREA)
JP2021558219A 2019-11-19 2020-10-14 Pending JPWO2021100366A1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019208364 2019-11-19
PCT/JP2020/038807 WO2021100366A1 (ja) 2019-11-19 2020-10-14 電子デバイス、硫化防止剤及び封止材

Publications (1)

Publication Number Publication Date
JPWO2021100366A1 true JPWO2021100366A1 (ko) 2021-05-27

Family

ID=75980522

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021558219A Pending JPWO2021100366A1 (ko) 2019-11-19 2020-10-14

Country Status (3)

Country Link
JP (1) JPWO2021100366A1 (ko)
TW (1) TWI777271B (ko)
WO (1) WO2021100366A1 (ko)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7378455B2 (en) * 2005-06-30 2008-05-27 General Electric Company Molding composition and method, and molded article
WO2007052661A1 (ja) * 2005-11-02 2007-05-10 Matsushita Electric Industrial Co., Ltd. 導電性接着剤
JP5678592B2 (ja) * 2009-12-02 2015-03-04 横浜ゴム株式会社 加熱硬化性光半導体封止用シリコーン樹脂組成物およびこれを用いる光半導体封止体
JP5948240B2 (ja) * 2010-04-22 2016-07-06 日本化薬株式会社 銀変色防止剤、銀変色防止樹脂組成物、銀変色防止方法、及びこれを使用した発光ダイオード
TWI621650B (zh) * 2011-06-23 2018-04-21 三井化學股份有限公司 光學半導體用之表面密封劑、使用其的有機ｅｌ裝置的製造方法、有機ｅｌ裝置、有機ｅｌ顯示器面板、以及薄板狀表面密封成形物
US10109503B2 (en) * 2011-07-22 2018-10-23 Advanpack Solutions Pte Ltd. Method of manufacturing semiconductor package device
JP2013131595A (ja) * 2011-12-21 2013-07-04 Hitachi Ltd 金属部材と樹脂の接合方法およびその接合体
JP6064396B2 (ja) * 2012-07-09 2017-01-25 日亜化学工業株式会社 発光装置
AU2014260477B2 (en) * 2013-05-02 2018-04-26 Tera-Barrier Films Pte Ltd Encapsulation barrier stack comprising dendrimer encapsulated nanoparticles
JP2015007672A (ja) * 2013-06-24 2015-01-15 富士フイルム株式会社 フィルムミラー及びフィルムミラーの製造方法
JP2015130452A (ja) * 2014-01-09 2015-07-16 住友ベークライト株式会社 オプトデバイス用導電性樹脂組成物及びオプトデバイス
JP6206262B2 (ja) * 2014-03-11 2017-10-04 コニカミノルタ株式会社 透明導電体、その製造方法及び導電性ペースト
KR102188500B1 (ko) * 2014-07-28 2020-12-09 삼성전자주식회사 발광다이오드 패키지 및 이를 이용한 조명장치
JP2017057339A (ja) * 2015-09-18 2017-03-23 日立化成株式会社 透光性ガスバリア組成物及び硫化防止層、並びに前記硫化防止層を備える光半導体装置及びその製造方法

Also Published As

Publication number Publication date
TWI777271B (zh) 2022-09-11
WO2021100366A1 (ja) 2021-05-27
TW202137434A (zh) 2021-10-01

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Legal Events

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Effective date: 20230913