JPWO2021084704A1 - - Google Patents

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Publication number
JPWO2021084704A1
JPWO2021084704A1 JP2021553999A JP2021553999A JPWO2021084704A1 JP WO2021084704 A1 JPWO2021084704 A1 JP WO2021084704A1 JP 2021553999 A JP2021553999 A JP 2021553999A JP 2021553999 A JP2021553999 A JP 2021553999A JP WO2021084704 A1 JPWO2021084704 A1 JP WO2021084704A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021553999A
Other versions
JP7290744B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication of JPWO2021084704A1 publication Critical patent/JPWO2021084704A1/ja
Application granted granted Critical
Publication of JP7290744B2 publication Critical patent/JP7290744B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2021553999A 2019-10-31 2019-10-31 部品供給装置 Active JP7290744B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/042876 WO2021084704A1 (ja) 2019-10-31 2019-10-31 部品供給装置

Publications (2)

Publication Number Publication Date
JPWO2021084704A1 true JPWO2021084704A1 (ja) 2021-05-06
JP7290744B2 JP7290744B2 (ja) 2023-06-13

Family

ID=75715009

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021553999A Active JP7290744B2 (ja) 2019-10-31 2019-10-31 部品供給装置

Country Status (2)

Country Link
JP (1) JP7290744B2 (ja)
WO (1) WO2021084704A1 (ja)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013140581A1 (ja) * 2012-03-22 2013-09-26 富士機械製造株式会社 テープフィーダ
WO2014049679A1 (ja) * 2012-09-25 2014-04-03 富士機械製造株式会社 チップマウンタと装置
JP2016015236A (ja) * 2014-07-02 2016-01-28 株式会社日立製作所 転流式直流遮断器及びその監視方法
WO2017090192A1 (ja) * 2015-11-27 2017-06-01 富士機械製造株式会社 部品供給装置の電源制御装置および電源制御方法
WO2018100735A1 (ja) * 2016-12-02 2018-06-07 株式会社エニイワイヤ サーバラック監視システム
WO2019176033A1 (ja) * 2018-03-14 2019-09-19 株式会社Ｆｕｊｉ 生産ジョブ処理方法及び生産ジョブ処理装置
JP2019186486A (ja) * 2018-04-16 2019-10-24 パナソニックＩｐマネジメント株式会社 電子部品実装システム

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013140581A1 (ja) * 2012-03-22 2013-09-26 富士機械製造株式会社 テープフィーダ
WO2014049679A1 (ja) * 2012-09-25 2014-04-03 富士機械製造株式会社 チップマウンタと装置
JP2016015236A (ja) * 2014-07-02 2016-01-28 株式会社日立製作所 転流式直流遮断器及びその監視方法
WO2017090192A1 (ja) * 2015-11-27 2017-06-01 富士機械製造株式会社 部品供給装置の電源制御装置および電源制御方法
WO2018100735A1 (ja) * 2016-12-02 2018-06-07 株式会社エニイワイヤ サーバラック監視システム
WO2019176033A1 (ja) * 2018-03-14 2019-09-19 株式会社Ｆｕｊｉ 生産ジョブ処理方法及び生産ジョブ処理装置
JP2019186486A (ja) * 2018-04-16 2019-10-24 パナソニックＩｐマネジメント株式会社 電子部品実装システム

Also Published As

Publication number Publication date
WO2021084704A1 (ja) 2021-05-06
JP7290744B2 (ja) 2023-06-13

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