JPWO2021084649A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2021084649A5
JPWO2021084649A5 JP2021553958A JP2021553958A JPWO2021084649A5 JP WO2021084649 A5 JPWO2021084649 A5 JP WO2021084649A5 JP 2021553958 A JP2021553958 A JP 2021553958A JP 2021553958 A JP2021553958 A JP 2021553958A JP WO2021084649 A5 JPWO2021084649 A5 JP WO2021084649A5
Authority
JP
Japan
Prior art keywords
alcohol
inkjet head
head according
epoxy resin
manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021553958A
Other languages
English (en)
Japanese (ja)
Other versions
JP7276490B2 (ja
JPWO2021084649A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2019/042575 external-priority patent/WO2021084649A1/ja
Publication of JPWO2021084649A1 publication Critical patent/JPWO2021084649A1/ja
Publication of JPWO2021084649A5 publication Critical patent/JPWO2021084649A5/ja
Application granted granted Critical
Publication of JP7276490B2 publication Critical patent/JP7276490B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2021553958A 2019-10-30 2019-10-30 インクジェットヘッド及びインクジェットヘッドの製造方法 Active JP7276490B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/042575 WO2021084649A1 (ja) 2019-10-30 2019-10-30 インクジェットヘッド及びインクジェットヘッドの製造方法

Publications (3)

Publication Number Publication Date
JPWO2021084649A1 JPWO2021084649A1 (https=) 2021-05-06
JPWO2021084649A5 true JPWO2021084649A5 (https=) 2022-07-04
JP7276490B2 JP7276490B2 (ja) 2023-05-18

Family

ID=75714927

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021553958A Active JP7276490B2 (ja) 2019-10-30 2019-10-30 インクジェットヘッド及びインクジェットヘッドの製造方法

Country Status (5)

Country Link
US (1) US11919308B2 (https=)
EP (1) EP4052913B1 (https=)
JP (1) JP7276490B2 (https=)
CN (1) CN114641396B (https=)
WO (1) WO2021084649A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7840744B2 (ja) * 2022-03-17 2026-04-06 旭化成株式会社 一液性エポキシ樹脂組成物用マスターバッチ型硬化剤、及びエポキシ樹脂組成物
WO2024075602A1 (ja) * 2022-10-07 2024-04-11 株式会社スリーボンド エポキシ樹脂組成物

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51139478A (en) 1975-05-27 1976-12-01 Nitto Electric Ind Co Box components for assembling
JPH093164A (ja) 1995-06-15 1997-01-07 Nitto Denko Corp マイクロカプセル型硬化剤または硬化促進剤、およびそれを含有してなるエポキシ樹脂組成物
JP2000129238A (ja) * 1998-10-26 2000-05-09 Nitto Denko Corp シート状接着剤組成物およびそれを用いた電子部品装置ならびにそのリペアー方法
JP2004277458A (ja) * 2003-03-12 2004-10-07 Nagase Chemtex Corp １液型エポキシ樹脂組成物およびそれを用いた１液型エポキシ樹脂系接着剤
JP4237088B2 (ja) * 2003-07-24 2009-03-11 東京応化工業株式会社 感光性樹脂組成物および該組成物を用いたパターン形成方法
KR100717028B1 (ko) * 2005-09-13 2007-05-10 삼성전자주식회사 전도성 에폭시 수지를 구비한 잉크젯 프린터 헤드
JP2007269959A (ja) 2006-03-31 2007-10-18 Nippon Handa Kk 導電性接着剤、電子装置およびその製造方法
US7923488B2 (en) * 2006-10-16 2011-04-12 Trillion Science, Inc. Epoxy compositions
JP5279117B2 (ja) 2008-05-28 2013-09-04 コニカミノルタ株式会社 インクジェットヘッド
JP2011032387A (ja) * 2009-08-03 2011-02-17 Toppan Forms Co Ltd 硬化性組成物
JP2011109005A (ja) * 2009-11-20 2011-06-02 Sumitomo Electric Ind Ltd 配線板接続体の製造方法、および配線板
EP2527151B1 (en) * 2010-01-22 2019-03-13 Konica Minolta IJ Technologies, Inc. Method for manufacturing inkjet head
JP6525630B2 (ja) * 2015-02-18 2019-06-05 キヤノン株式会社 液体吐出ヘッドおよびその製造方法

Similar Documents

Publication Publication Date Title
BR112017013230A2 (pt) composição de resina epóxi
AR108329A1 (es) Composiciones adhesivas sin solvente de dos componentes que comprenden un poliol iniciado con amina
WO2014062475A3 (en) Toughened, curable epoxy compositions for high temperature applications
RU2016110087A (ru) Склеивание композиционных материалов
JPWO2021084649A5 (https=)
MY178563A (en) Film, method for its production, and method for producing semiconductor element using the film
JP2014507971A5 (https=)
PH12017500465B1 (en) Thermosetting resin composition
JP2016065942A5 (https=)
BR112015021037A2 (pt) composição de resina curável, processo para preparar uma composição de resina curável, composição de resina curada e artigo
RU2017105909A (ru) Отверждаемый при низкой температуре расклинивающий наполнитель
MX2019014065A (es) Sistemas de resina epoxidica para materiales compuestos.
WO2016117579A9 (ja) 熱硬化性樹脂組成物、硬化膜、硬化膜付き基板および電子部品
MX2017008270A (es) Matriz reticulada con oxazolidinona e isocianurato para material reforzado con fibra.
MX2020000988A (es) Recubrimiento de curado a baja temperatura formado a traves de migracion de catalizador facilitada por polaridad entre capas en un mecanismo de curado de doble capa.
JP2015016660A5 (https=)
BR112015009489A2 (pt) composição de agente de cura, composição curável, processo para preparar uma composição de agente de cura, processo para preparar uma composição curável, processo para preparar um termofixo e artigo termofixo curado
JP2015030273A5 (https=)
JP2010028087A5 (https=)
BR112017000219A2 (pt) adesivo durável à falha de alta tg de cura retardada
BR112017000856A2 (pt) adesivos estruturais tendo resistência à lavagem melhorada e método para distribuir os mesmos
JP2017535638A5 (https=)
TWI486419B (zh) 膠帶
WO2016046647A3 (ja) 硬化樹脂膜の製造方法
DK3532526T3 (da) Hurtighærdende epoxyharpikssammensætning til fiber-matrix-halvfærdige produkter