JPWO2021070283A1 - 電力変換装置 - Google Patents
電力変換装置 Download PDFInfo
- Publication number
- JPWO2021070283A1 JPWO2021070283A1 JP2020540360A JP2020540360A JPWO2021070283A1 JP WO2021070283 A1 JPWO2021070283 A1 JP WO2021070283A1 JP 2020540360 A JP2020540360 A JP 2020540360A JP 2020540360 A JP2020540360 A JP 2020540360A JP WO2021070283 A1 JPWO2021070283 A1 JP WO2021070283A1
- Authority
- JP
- Japan
- Prior art keywords
- pipe
- stage
- cooling
- connecting member
- thyristor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 claims abstract description 98
- 239000003507 refrigerant Substances 0.000 claims abstract description 27
- 238000006243 chemical reaction Methods 0.000 claims abstract description 18
- 230000002093 peripheral effect Effects 0.000 claims description 10
- 239000000498 cooling water Substances 0.000 description 30
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 10
- 238000012856 packing Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000011144 upstream manufacturing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/18—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
- H02M1/327—Means for protecting converters other than automatic disconnection against abnormal temperatures
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/02—Conversion of ac power input into dc power output without possibility of reversal
- H02M7/04—Conversion of ac power input into dc power output without possibility of reversal by static converters
- H02M7/12—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
- H02M7/145—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means
- H02M7/155—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only
- H02M7/162—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only in a bridge configuration
- H02M7/1623—Conversion of ac power input into dc power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode using devices of a thyratron or thyristor type requiring extinguishing means using semiconductor devices only in a bridge configuration with control circuit
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/08—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters
- H02M1/088—Circuits specially adapted for the generation of control voltages for semiconductor devices incorporated in static converters for the simultaneous control of series or parallel connected semiconductor devices
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
- H02M1/32—Means for protecting converters other than automatic disconnection
- H02M1/34—Snubber circuits
- H02M1/346—Passive non-dissipative snubbers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Thermal Sciences (AREA)
- Rectifiers (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
図4は、サイリスタバルブ1の正面図である。図5は、サイリスタバルブ1の上面図である。以下の説明において、左右方向(または横方向)をX方向とし、前後方向をY方向として、上下方向(または縦方向)をZ方向とする。
Claims (6)
- 第1のモジュールを搭載する第1ステージと、
前記第1ステージ上に積層され、第2のモジュールを搭載する第2ステージと、
前記第1および第2のモジュールに冷媒を循環させるための冷媒循環回路とを備え、
前記冷媒循環回路は、
前記第1ステージに配設され、前記第1のモジュールに前記冷媒を通流させるための第1の冷却配管と、
前記第2ステージに配設され、前記第2のモジュールに前記冷媒を通流させるための第2の冷却配管と、
前記第1の冷却配管の開口端に設けられた第1の接続部材と、
前記第2の冷却配管の開口端に設けられた第2の接続部材と、
前記第1の接続部材と前記第2の接続部材とを接続するための接続配管と、
前記接続配管の第1の端部を前記第1の接続部材に結合する第1のカプラと、
前記接続配管の第2の端部を前記第2の接続部材に結合する第2のカプラとを含む、電力変換装置。 - 前記第1のカプラは、
前記第1の接続部材に設けられた第1のソケットと、
前記接続配管の前記第1の端部に設けられ、前記第1のソケットと結合可能に構成された第1のプラグとを有し、
前記第2のカプラは、
前記第2の接続部材に設けられた第2のソケットと、
前記接続配管の前記第2の端部に設けられ、前記第2のソケットと結合可能に構成された第2のプラグとを有する、請求項1に記載の電力変換装置。 - 前記第1および第2のカプラの各々は、ワンタッチカプラである、請求項2に記載の電力変換装置。
- 前記第1および第2の冷却配管の各々は、
直線部と、
前記直線部と前記開口端との間に位置し、前記直線部に対して折り曲げられた曲げ部とを有する、請求項1から3のいずれか1項に記載の電力変換装置。 - 前記接続配管は、前記第1の端部および前記第2の端部の間に配された絶縁配管を有し、前記絶縁配管は、湾曲部を有する、請求項1から4のいずれか1項に記載の電力変換装置。
- 前記接続配管は、前記第1の端部および前記第2の端部の間に配された絶縁配管を有し、
前記第1および第2のプラグの各々は、前記絶縁配管との接続部分の外周面に外側に凸の曲面形状を有する、請求項2または3に記載の電力変換装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2019/039820 WO2021070283A1 (ja) | 2019-10-09 | 2019-10-09 | 電力変換装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP6898532B1 JP6898532B1 (ja) | 2021-07-07 |
JPWO2021070283A1 true JPWO2021070283A1 (ja) | 2021-11-11 |
Family
ID=75437351
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2020540360A Active JP6898532B1 (ja) | 2019-10-09 | 2019-10-09 | 電力変換装置 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20220346272A1 (ja) |
JP (1) | JP6898532B1 (ja) |
WO (1) | WO2021070283A1 (ja) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03208365A (ja) * | 1990-01-10 | 1991-09-11 | Hitachi Ltd | 電子装置の冷却機構及びその使用方法 |
US5043797A (en) * | 1990-04-03 | 1991-08-27 | General Electric Company | Cooling header connection for a thyristor stack |
JPH0787742A (ja) * | 1993-09-16 | 1995-03-31 | Mitsubishi Electric Corp | 水冷式サイリスタバルブ及びマニホルド |
JPH0828773A (ja) * | 1994-07-22 | 1996-02-02 | Fujitsu Ltd | 配管用カプラ |
JPH11332240A (ja) * | 1998-05-08 | 1999-11-30 | Toshiba Corp | 水冷式電力変換装置 |
JP3340960B2 (ja) * | 1998-05-29 | 2002-11-05 | 株式会社東芝 | 水冷式サイリスタバルブ |
US9504184B2 (en) * | 2015-02-12 | 2016-11-22 | International Business Machines Corporation | Flexible coolant manifold-heat sink assembly |
-
2019
- 2019-10-09 WO PCT/JP2019/039820 patent/WO2021070283A1/ja active Application Filing
- 2019-10-09 JP JP2020540360A patent/JP6898532B1/ja active Active
- 2019-10-09 US US17/640,998 patent/US20220346272A1/en active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2021070283A1 (ja) | 2021-04-15 |
JP6898532B1 (ja) | 2021-07-07 |
US20220346272A1 (en) | 2022-10-27 |
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