CN102246611A - 母线系统得到冷却的功率变换器模块 - Google Patents
母线系统得到冷却的功率变换器模块 Download PDFInfo
- Publication number
- CN102246611A CN102246611A CN2009801494434A CN200980149443A CN102246611A CN 102246611 A CN102246611 A CN 102246611A CN 2009801494434 A CN2009801494434 A CN 2009801494434A CN 200980149443 A CN200980149443 A CN 200980149443A CN 102246611 A CN102246611 A CN 102246611A
- Authority
- CN
- China
- Prior art keywords
- power converter
- converter module
- bus
- deck power
- cavity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000009413 insulation Methods 0.000 claims abstract description 34
- 239000004065 semiconductor Substances 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 14
- 230000004888 barrier function Effects 0.000 claims description 43
- 230000033228 biological regulation Effects 0.000 claims description 6
- 238000003475 lamination Methods 0.000 abstract description 21
- 238000001816 cooling Methods 0.000 abstract description 13
- 239000012530 fluid Substances 0.000 abstract 3
- 239000004020 conductor Substances 0.000 abstract 1
- 239000002826 coolant Substances 0.000 description 11
- 239000002648 laminated material Substances 0.000 description 9
- 239000007788 liquid Substances 0.000 description 9
- 230000004087 circulation Effects 0.000 description 8
- 230000002349 favourable effect Effects 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000012809 cooling fluid Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 239000011810 insulating material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000000153 supplemental effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
- H05K7/1427—Housings
- H05K7/1432—Housings specially adapted for power drive units or power converters
- H05K7/14329—Housings specially adapted for power drive units or power converters specially adapted for the configuration of power bus bars
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Rectifiers (AREA)
- Inverter Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008061468.8 | 2008-12-10 | ||
DE102008061468A DE102008061468A1 (de) | 2008-12-10 | 2008-12-10 | Stromrichtermodul mit gekühlter Verschienung |
DE1020080614688 | 2008-12-10 | ||
PCT/EP2009/062579 WO2010066483A1 (de) | 2008-12-10 | 2009-09-29 | Stromrichtermodul mit gekühlter verschienung |
Publications (2)
Publication Number | Publication Date |
---|---|
CN102246611A true CN102246611A (zh) | 2011-11-16 |
CN102246611B CN102246611B (zh) | 2014-09-10 |
Family
ID=41394851
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN200980149443.4A Active CN102246611B (zh) | 2008-12-10 | 2009-09-29 | 母线系统得到冷却的变流器模块 |
Country Status (6)
Country | Link |
---|---|
US (1) | US8432694B2 (zh) |
EP (1) | EP2364580B1 (zh) |
CN (1) | CN102246611B (zh) |
DE (1) | DE102008061468A1 (zh) |
RU (1) | RU2504864C2 (zh) |
WO (1) | WO2010066483A1 (zh) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106935406A (zh) * | 2015-10-23 | 2017-07-07 | Zf腓德烈斯哈芬股份公司 | 功率电子器件装置 |
CN108122866A (zh) * | 2016-11-28 | 2018-06-05 | 中车株洲电力机车研究所有限公司 | 一种集成化功率模块 |
CN108122871A (zh) * | 2016-11-28 | 2018-06-05 | 中车株洲电力机车研究所有限公司 | 一种h桥臂双面散热功率模块 |
CN109643885A (zh) * | 2016-08-30 | 2019-04-16 | 株式会社自动网络技术研究所 | 电连接箱 |
Families Citing this family (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102010039676B4 (de) * | 2010-08-24 | 2016-06-09 | Mahle International Gmbh | Kühlsystem zum Kühlen von Elektronikkomponenten |
AU2012232967B2 (en) * | 2011-10-31 | 2015-01-15 | Abb Technology Ag | Cabinet with modules having a thermosiphon cooler arrangement |
AU2012232968B2 (en) | 2011-10-31 | 2014-11-13 | Abb Technology Ag | Thermosiphon cooler arrangement in modules with electric and/or electronic components |
CN104011853B (zh) * | 2011-12-26 | 2016-11-09 | 三菱电机株式会社 | 电力用半导体装置及其制造方法 |
US9142482B2 (en) * | 2011-12-27 | 2015-09-22 | Intel Corporation | Transient thermal management systems for semiconductor devices |
JP5880519B2 (ja) * | 2013-10-21 | 2016-03-09 | トヨタ自動車株式会社 | 車載電子装置 |
CN104750207A (zh) * | 2013-12-30 | 2015-07-01 | 鸿富锦精密工业(武汉)有限公司 | 散热模组 |
CN105451503B (zh) * | 2014-07-21 | 2019-03-08 | 联想(北京)有限公司 | 一种电子设备 |
CN105450042B (zh) * | 2014-09-26 | 2018-04-17 | 台达电子工业股份有限公司 | 三电平功率变换器及其功率单元 |
US20160165754A1 (en) * | 2014-12-03 | 2016-06-09 | Vincent Yu | Water cooling heat sink unit |
EP3048716A1 (de) | 2015-01-20 | 2016-07-27 | Siemens Aktiengesellschaft | Umrichteranordnung mit beweglichen Kontakten, aber ortsfester Umrichterbaugruppe |
JP6435905B2 (ja) * | 2015-02-13 | 2018-12-12 | 株式会社デンソー | 電力変換装置 |
DE102015105347B4 (de) * | 2015-04-09 | 2022-03-24 | Semikron Elektronik Gmbh & Co. Kg | Anordnung mit einem leitstungselektronischen Bauteil und mit einer Gleichspannungsverschienung |
EP3163612B1 (en) * | 2015-10-27 | 2021-05-05 | ABB Schweiz AG | Cooling element for electronic components and electronic device |
EP3185660A1 (de) * | 2015-12-22 | 2017-06-28 | Siemens Aktiengesellschaft | Stromschienenanordnung |
KR102131684B1 (ko) | 2016-04-28 | 2020-07-08 | 닛산 지도우샤 가부시키가이샤 | 차량 탑재용 전력 변환 장치 |
US10021802B2 (en) | 2016-09-19 | 2018-07-10 | General Electric Company | Electronic module assembly having low loop inductance |
EP3415856A1 (en) * | 2017-06-13 | 2018-12-19 | Nokia Solutions and Networks Oy | Modular heat exchanger and method for making the same |
DE102018201451A1 (de) | 2018-01-31 | 2019-08-01 | MTU Aero Engines AG | Gleitkontaktkomponente für eine Induktionsheizvorrichtung, Induktionsheizvorrichtung mit einer Gleitkontaktkomponente und Verfahren zur Herstellung einer Gleitkontaktkomponente |
US10680533B1 (en) * | 2019-02-01 | 2020-06-09 | Hamilton Sunstrand Corporation | Common layout rectifier or converter |
CN113823932A (zh) * | 2020-06-18 | 2021-12-21 | 莫列斯有限公司 | 连接器组件 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5923085A (en) * | 1996-05-02 | 1999-07-13 | Chrysler Corporation | IGBT module construction |
CN1794447A (zh) * | 2005-10-25 | 2006-06-28 | 中国南车集团株洲电力机车研究所 | 一种电传动电力电子功率变换器水冷方法及装置 |
CN2842826Y (zh) * | 2005-10-27 | 2006-11-29 | 中国南车集团株洲电力机车研究所 | 一种电传动电力电子功率变换器水冷散热板 |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5325644A (en) | 1976-08-20 | 1978-03-09 | Sumitomo Metal Ind | Process for granulation of melted metallurgical slag |
US4381032A (en) * | 1981-04-23 | 1983-04-26 | Cutchaw John M | Apparatus for cooling high-density integrated circuit packages |
JPH02151056A (ja) * | 1988-12-02 | 1990-06-11 | Hitachi Ltd | 半導体装置用電源基板の製作方法 |
JPH05325644A (ja) * | 1992-05-18 | 1993-12-10 | Fujitsu Ltd | 電源バスバーの構造 |
US5804761A (en) * | 1996-05-02 | 1998-09-08 | Chrysler Corporation | Water cooled DC bus structure |
US5694301A (en) * | 1996-05-02 | 1997-12-02 | Chrysler Corporation | Power structure construction (DC bus cross straps) |
DE19654376B4 (de) | 1996-12-24 | 2005-08-04 | Thyssen Krupp Automotive Gmbh | Seitenaufprallträger für Kfz-Türen |
DE19833491A1 (de) * | 1998-07-24 | 2000-02-03 | Siemens Ag | Niederinduktive Verschienung für einen Dreipunkt-Phasenbaustein |
DE29813254U1 (de) | 1998-07-24 | 1998-10-01 | Siemens Ag | Mehrphasiger Dreipunkt-Stromrichter |
US20030218057A1 (en) * | 2000-11-07 | 2003-11-27 | Craig Joseph | Electrical bus with associated porous metal heat sink and method of manufacturing same |
JP3851098B2 (ja) * | 2001-02-26 | 2006-11-29 | 株式会社日立製作所 | 電力変換装置 |
US6574094B1 (en) * | 2002-04-11 | 2003-06-03 | General Dynamics Land Systems Inc. | Method and apparatus for cooling bus bars |
RU2229757C2 (ru) * | 2002-07-29 | 2004-05-27 | Таланин Юрий Васильевич | Устройство для нагрева и охлаждения радиоэлектронной аппаратуры |
US6885553B2 (en) * | 2002-09-27 | 2005-04-26 | Rockwell Automation Technologies, Inc. | Bus bar assembly for use with a compact power conversion assembly |
DE102004018469B3 (de) | 2004-04-16 | 2005-10-06 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH | Leistungshalbleiterschaltung |
RU2280294C2 (ru) * | 2004-10-11 | 2006-07-20 | Юрий Васильевич Таланин | Силовой блок |
US7393236B2 (en) * | 2005-09-02 | 2008-07-01 | Gm Global Technology Operations, Inc. | Integrated thermal and electrical connection system for power devices |
JP4751810B2 (ja) * | 2006-11-02 | 2011-08-17 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
US8007255B2 (en) * | 2006-11-22 | 2011-08-30 | Mitsubishi Heavy Industries, Ltd. | Inverter-integrated electric compressor with inverter storage box arrangement |
DE102007003875A1 (de) | 2007-01-25 | 2008-08-07 | Siemens Ag | Stromrichter |
JP4452953B2 (ja) * | 2007-08-09 | 2010-04-21 | 日立オートモティブシステムズ株式会社 | 電力変換装置 |
US7952875B2 (en) * | 2009-05-29 | 2011-05-31 | GM Global Technology Operations LLC | Stacked busbar assembly with integrated cooling |
-
2008
- 2008-12-10 DE DE102008061468A patent/DE102008061468A1/de not_active Withdrawn
-
2009
- 2009-09-29 CN CN200980149443.4A patent/CN102246611B/zh active Active
- 2009-09-29 WO PCT/EP2009/062579 patent/WO2010066483A1/de active Application Filing
- 2009-09-29 RU RU2011127997/07A patent/RU2504864C2/ru active
- 2009-09-29 US US13/133,798 patent/US8432694B2/en active Active
- 2009-09-29 EP EP09783520A patent/EP2364580B1/de not_active Not-in-force
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5923085A (en) * | 1996-05-02 | 1999-07-13 | Chrysler Corporation | IGBT module construction |
CN1794447A (zh) * | 2005-10-25 | 2006-06-28 | 中国南车集团株洲电力机车研究所 | 一种电传动电力电子功率变换器水冷方法及装置 |
CN2842826Y (zh) * | 2005-10-27 | 2006-11-29 | 中国南车集团株洲电力机车研究所 | 一种电传动电力电子功率变换器水冷散热板 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106935406A (zh) * | 2015-10-23 | 2017-07-07 | Zf腓德烈斯哈芬股份公司 | 功率电子器件装置 |
CN109643885A (zh) * | 2016-08-30 | 2019-04-16 | 株式会社自动网络技术研究所 | 电连接箱 |
CN108122866A (zh) * | 2016-11-28 | 2018-06-05 | 中车株洲电力机车研究所有限公司 | 一种集成化功率模块 |
CN108122871A (zh) * | 2016-11-28 | 2018-06-05 | 中车株洲电力机车研究所有限公司 | 一种h桥臂双面散热功率模块 |
Also Published As
Publication number | Publication date |
---|---|
EP2364580B1 (de) | 2012-10-17 |
US20110249402A1 (en) | 2011-10-13 |
DE102008061468A1 (de) | 2010-06-17 |
CN102246611B (zh) | 2014-09-10 |
WO2010066483A1 (de) | 2010-06-17 |
US8432694B2 (en) | 2013-04-30 |
RU2011127997A (ru) | 2013-01-20 |
EP2364580A1 (de) | 2011-09-14 |
RU2504864C2 (ru) | 2014-01-20 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: Munich, Germany Patentee after: SIEMENS AG Address before: Munich, Germany Patentee before: SIEMENS AG |
|
TR01 | Transfer of patent right |
Effective date of registration: 20240428 Address after: No.1 Haitai Chuangxin 5th Road, Huayuan Industrial Zone (Outer Ring), New Technology Industrial Park, Xiqing District, Tianjin City Patentee after: SIEMENS ELECTRICAL DRIVES Ltd. Country or region after: China Address before: Munich, Germany Patentee before: SIEMENS AG Country or region before: Germany |