JPWO2021065843A1 - - Google Patents

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Publication number
JPWO2021065843A1
JPWO2021065843A1 JP2021551274A JP2021551274A JPWO2021065843A1 JP WO2021065843 A1 JPWO2021065843 A1 JP WO2021065843A1 JP 2021551274 A JP2021551274 A JP 2021551274A JP 2021551274 A JP2021551274 A JP 2021551274A JP WO2021065843 A1 JPWO2021065843 A1 JP WO2021065843A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2021551274A
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JP7245924B2 (ja
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Publication of JPWO2021065843A1 publication Critical patent/JPWO2021065843A1/ja
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Publication of JP7245924B2 publication Critical patent/JP7245924B2/ja
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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
    • G06Q10/00—Administration; Management
    • G06Q10/20—Administration of product repair or maintenance
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R35/00—Testing or calibrating of apparatus covered by the other groups of this subclass
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/001—Measuring interference from external sources to, or emission from, the device under test, e.g. EMC, EMI, EMP or ESD testing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • G01R31/2601—Apparatus or methods therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06N—COMPUTING ARRANGEMENTS BASED ON SPECIFIC COMPUTATIONAL MODELS
    • G06N20/00—Machine learning

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Business, Economics & Management (AREA)
  • Theoretical Computer Science (AREA)
  • Human Resources & Organizations (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Software Systems (AREA)
  • Marketing (AREA)
  • Economics (AREA)
  • Quality & Reliability (AREA)
  • Strategic Management (AREA)
  • Tourism & Hospitality (AREA)
  • General Business, Economics & Management (AREA)
  • Electromagnetism (AREA)
  • Entrepreneurship & Innovation (AREA)
  • Artificial Intelligence (AREA)
  • Data Mining & Analysis (AREA)
  • Evolutionary Computation (AREA)
  • Medical Informatics (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Computing Systems (AREA)
  • Mathematical Physics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2021551274A 2019-09-30 2020-09-28 保守装置、保守方法、および、保守プログラム Active JP7245924B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2019178444 2019-09-30
JP2019178444 2019-09-30
PCT/JP2020/036748 WO2021065843A1 (ja) 2019-09-30 2020-09-28 保守装置、保守方法、および、保守プログラム

Publications (2)

Publication Number Publication Date
JPWO2021065843A1 true JPWO2021065843A1 (ja) 2021-04-08
JP7245924B2 JP7245924B2 (ja) 2023-03-24

Family

ID=75338039

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021551274A Active JP7245924B2 (ja) 2019-09-30 2020-09-28 保守装置、保守方法、および、保守プログラム

Country Status (7)

Country Link
US (1) US12014335B2 (ja)
JP (1) JP7245924B2 (ja)
KR (1) KR20220074918A (ja)
CN (1) CN114502968A (ja)
DE (1) DE112020004662T5 (ja)
TW (2) TW202115413A (ja)
WO (2) WO2021065086A1 (ja)

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001326258A (ja) * 2000-05-17 2001-11-22 Tokyo Seimitsu Co Ltd プローブカードの触針のクリーニング方法
JP2003098226A (ja) * 2001-09-25 2003-04-03 Fuji Xerox Co Ltd プリント基板故障判定方法
JP2003282654A (ja) * 2002-03-20 2003-10-03 Hitachi Ltd 半導体装置の製造方法
JP2005175154A (ja) * 2003-12-10 2005-06-30 Matsushita Electric Ind Co Ltd プローブカードの針先クリーニング方法，半導体装置のウエハ検査装置，データ記録媒体
JP2006105924A (ja) * 2004-10-08 2006-04-20 Renesas Technology Corp 接触抵抗特性解析方法
WO2007105387A1 (ja) * 2006-03-10 2007-09-20 Matsushita Electric Industrial Co., Ltd. 半導体検査システム
JP2007248200A (ja) * 2006-03-15 2007-09-27 Nec Electronics Corp 半導体試験装置の保守システムおよび保守方法
US20110148446A1 (en) * 2009-12-22 2011-06-23 Suto Anthony J Capacitive opens testing in low signal environments
JP2011179842A (ja) * 2010-02-26 2011-09-15 Fujitsu Semiconductor Ltd コンタクタ、半導体装置の試験装置、及び半導体装置の製造方法
JP2011258651A (ja) * 2010-06-07 2011-12-22 Mitsubishi Electric Corp 試験装置、試験方法、そのコンピュータ・プログラムおよびそのプログラムを記録した記録媒体
US20130300429A1 (en) * 2012-05-09 2013-11-14 Schneider Electric USA, Inc. Diagnostic Receptacle For Electric Vehicle Supply Equipment
WO2018139144A1 (ja) * 2017-01-25 2018-08-02 Ntn株式会社 状態監視方法および状態監視装置

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JPH1054858A (ja) * 1996-08-09 1998-02-24 Sumitomo Wiring Syst Ltd 検査装置及び検査方法
JP3349455B2 (ja) 1998-09-30 2002-11-25 宮崎沖電気株式会社 半導体製造装置のための管理方法および管理システム
JP4326641B2 (ja) * 1999-11-05 2009-09-09 富士機械製造株式会社 装着装置，装着精度検出治具セットおよび装着精度検出方法
JP2002174674A (ja) * 2000-12-05 2002-06-21 Advantest Corp 半導体試験装置及びその予防保守方法
US6594599B1 (en) * 2001-05-09 2003-07-15 Alcatel System, work station and method for testing a product and generating a statistical model that predicts the processibility of making like products
US7129733B2 (en) * 2003-12-02 2006-10-31 Intel Corporation Dynamic overdrive compensation test system and method
CN100549705C (zh) * 2004-05-25 2009-10-14 株式会社村田制作所 测量误差校正方法和电子部件特性测量装置
US7511508B2 (en) * 2004-06-28 2009-03-31 Advantest Corporation Fixture characteristic measuring device, method, program, recording medium, network analyzer, and semiconductor test device
KR100982343B1 (ko) * 2007-06-11 2010-09-15 주식회사 쎄믹스 웨이퍼 프로버의 스테이지 오차 측정 및 보정 장치
TW200926033A (en) * 2007-07-18 2009-06-16 Steven Kays Adaptive electronic design
JP5004027B2 (ja) * 2008-04-22 2012-08-22 富士電機株式会社 インプリント方法およびその装置
JP4802259B2 (ja) * 2009-03-23 2011-10-26 株式会社東芝 テスト装置、テスト方法および補正電圧算出装置
JP5399296B2 (ja) * 2010-02-26 2014-01-29 株式会社モリタ製作所 エアモータ及び医療用ハンドピース
US8838408B2 (en) * 2010-11-11 2014-09-16 Optimal Plus Ltd Misalignment indication decision system and method
CN103278771B (zh) * 2013-05-22 2015-06-17 广西电网公司电力科学研究院 工业现场三相异步电机异常状态的辨识方法
DE102013211038B3 (de) 2013-06-13 2014-10-16 Siemens Aktiengesellschaft Bereitstellen einer Information über einen Alterungszustand eines Halbleiterbauelements
JP6026362B2 (ja) * 2013-07-09 2016-11-16 東京エレクトロン株式会社 基板処理システム、基板処理システムの制御方法、及び記憶媒体
JP6252106B2 (ja) * 2013-10-31 2017-12-27 日本電産リード株式会社 接触子のメンテナンス方法及び検査装置
EP3155490B1 (de) * 2014-07-25 2019-04-03 Siemens Aktiengesellschaft Verfahren, anordnung, und computerprogrammprodukt für eine zustandsbasierte berechnung eines wartungstermins einer technischen anlage
US10357863B2 (en) * 2016-04-19 2019-07-23 Okuma Corporation Error identification method of machine tool and error identification system of the same
JP6981113B2 (ja) * 2017-09-05 2021-12-15 オムロン株式会社 情報処理装置および情報処理方法
CN108921303A (zh) * 2018-05-29 2018-11-30 青岛鹏海软件有限公司 工业电动机的故障诊断及预测性维护方法
JP2020012685A (ja) * 2018-07-13 2020-01-23 日本電産リード株式会社 プローブ、検査治具、及び検査装置

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001326258A (ja) * 2000-05-17 2001-11-22 Tokyo Seimitsu Co Ltd プローブカードの触針のクリーニング方法
JP2003098226A (ja) * 2001-09-25 2003-04-03 Fuji Xerox Co Ltd プリント基板故障判定方法
JP2003282654A (ja) * 2002-03-20 2003-10-03 Hitachi Ltd 半導体装置の製造方法
JP2005175154A (ja) * 2003-12-10 2005-06-30 Matsushita Electric Ind Co Ltd プローブカードの針先クリーニング方法，半導体装置のウエハ検査装置，データ記録媒体
JP2006105924A (ja) * 2004-10-08 2006-04-20 Renesas Technology Corp 接触抵抗特性解析方法
WO2007105387A1 (ja) * 2006-03-10 2007-09-20 Matsushita Electric Industrial Co., Ltd. 半導体検査システム
JP2007248200A (ja) * 2006-03-15 2007-09-27 Nec Electronics Corp 半導体試験装置の保守システムおよび保守方法
US20110148446A1 (en) * 2009-12-22 2011-06-23 Suto Anthony J Capacitive opens testing in low signal environments
JP2011179842A (ja) * 2010-02-26 2011-09-15 Fujitsu Semiconductor Ltd コンタクタ、半導体装置の試験装置、及び半導体装置の製造方法
JP2011258651A (ja) * 2010-06-07 2011-12-22 Mitsubishi Electric Corp 試験装置、試験方法、そのコンピュータ・プログラムおよびそのプログラムを記録した記録媒体
US20130300429A1 (en) * 2012-05-09 2013-11-14 Schneider Electric USA, Inc. Diagnostic Receptacle For Electric Vehicle Supply Equipment
WO2018139144A1 (ja) * 2017-01-25 2018-08-02 Ntn株式会社 状態監視方法および状態監視装置

Also Published As

Publication number Publication date
TW202115413A (zh) 2021-04-16
WO2021065843A1 (ja) 2021-04-08
US20220188776A1 (en) 2022-06-16
US12014335B2 (en) 2024-06-18
TW202115414A (zh) 2021-04-16
DE112020004662T5 (de) 2022-06-15
KR20220074918A (ko) 2022-06-03
JP7245924B2 (ja) 2023-03-24
WO2021065086A1 (ja) 2021-04-08
CN114502968A (zh) 2022-05-13

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