JPWO2021038631A1 - - Google Patents

Info

Publication number
JPWO2021038631A1
JPWO2021038631A1 JP2021541766A JP2021541766A JPWO2021038631A1 JP WO2021038631 A1 JPWO2021038631 A1 JP WO2021038631A1 JP 2021541766 A JP2021541766 A JP 2021541766A JP 2021541766 A JP2021541766 A JP 2021541766A JP WO2021038631 A1 JPWO2021038631 A1 JP WO2021038631A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021541766A
Other languages
Japanese (ja)
Other versions
JP7432609B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2021038631A1 publication Critical patent/JPWO2021038631A1/ja
Application granted granted Critical
Publication of JP7432609B2 publication Critical patent/JP7432609B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09909—Special local insulating pattern, e.g. as dam around component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10628—Leaded surface mounted device
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0014—Shaping of the substrate, e.g. by moulding

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2021541766A 2019-08-23 2019-08-23 電子回路装置の製造方法 Active JP7432609B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2019/033067 WO2021038631A1 (ja) 2019-08-23 2019-08-23 電子回路装置及びその製造方法

Publications (2)

Publication Number Publication Date
JPWO2021038631A1 true JPWO2021038631A1 (US07122603-20061017-C00294.png) 2021-03-04
JP7432609B2 JP7432609B2 (ja) 2024-02-16

Family

ID=74685010

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021541766A Active JP7432609B2 (ja) 2019-08-23 2019-08-23 電子回路装置の製造方法

Country Status (4)

Country Link
EP (1) EP4021153A4 (US07122603-20061017-C00294.png)
JP (1) JP7432609B2 (US07122603-20061017-C00294.png)
CN (1) CN114271038B (US07122603-20061017-C00294.png)
WO (1) WO2021038631A1 (US07122603-20061017-C00294.png)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0226274U (US07122603-20061017-C00294.png) * 1988-08-04 1990-02-21
JPH02281684A (ja) * 1989-04-21 1990-11-19 Tokyo Electric Co Ltd 部品実装方法
JPH05335694A (ja) * 1992-05-27 1993-12-17 Mitsubishi Electric Corp 立体構造基板
JPH0818208A (ja) * 1994-06-30 1996-01-19 Suzuki Motor Corp 実装部品倒れ防止治具

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0378233B1 (en) * 1989-01-13 1994-12-28 Matsushita Electric Industrial Co., Ltd. An adhesive composition for use in the mounting of electronic parts and a method for mounting electronic parts on a printed circuit board by the use of the same
JPH0832861B2 (ja) * 1989-01-13 1996-03-29 松下電器産業株式会社 電子部品用接着剤
JPH0729591Y2 (ja) * 1990-09-28 1995-07-05 ホシデン株式会社 チップ形コネクタ
JPH06196851A (ja) * 1992-12-25 1994-07-15 Taiyo Yuden Co Ltd 回路基板に金属部材を取り付けるはんだ付け方法
JPH06237061A (ja) * 1993-02-09 1994-08-23 Sony Corp 半導体装置の実装構造とその実装方法
JP2002335068A (ja) * 2001-05-10 2002-11-22 Matsushita Electric Ind Co Ltd 電子部品の位置矯正方法、および電子部品の位置矯正装置
JP2004265888A (ja) * 2003-01-16 2004-09-24 Sony Corp 半導体装置及びその製造方法
JP4852276B2 (ja) * 2005-08-10 2012-01-11 富士通セミコンダクター株式会社 半導体装置の製造方法
DE102006015676A1 (de) * 2006-04-04 2007-06-14 Siemens Ag Elektronisches Bauteil und elektronisches Steuergerät, insbesondere zur Verwendung in Kraftfahrzeugen
SE0700329L (sv) 2007-02-12 2008-02-26 Isaberg Rapid Ab Häfthammare
JP2009032865A (ja) * 2007-07-26 2009-02-12 Hitachi Ltd 電子装置及び電子装置の製造方法
JP5511156B2 (ja) * 2008-06-30 2014-06-04 シャープ株式会社 半導体デバイスの実装方法、半導体素子モジュールおよび電子情報機器
CN102456960B (zh) * 2010-10-26 2014-04-23 泰科电子(上海)有限公司 连接端子和端子安装装置
JP5850524B2 (ja) * 2011-09-26 2016-02-03 株式会社小糸製作所 車輌用灯具
JP5604413B2 (ja) * 2011-12-20 2014-10-08 シャープ株式会社 バーンイン装置
JP6890249B2 (ja) * 2017-02-24 2021-06-18 パナソニックＩｐマネジメント株式会社 塗布装置及び塗布方法
JP6870067B2 (ja) 2017-03-08 2021-05-12 株式会社Ｆｕｊｉ ３次元実装関連装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0226274U (US07122603-20061017-C00294.png) * 1988-08-04 1990-02-21
JPH02281684A (ja) * 1989-04-21 1990-11-19 Tokyo Electric Co Ltd 部品実装方法
JPH05335694A (ja) * 1992-05-27 1993-12-17 Mitsubishi Electric Corp 立体構造基板
JPH0818208A (ja) * 1994-06-30 1996-01-19 Suzuki Motor Corp 実装部品倒れ防止治具

Also Published As

Publication number Publication date
EP4021153A1 (en) 2022-06-29
EP4021153A4 (en) 2022-09-07
WO2021038631A1 (ja) 2021-03-04
CN114271038A (zh) 2022-04-01
CN114271038B (zh) 2024-05-03
JP7432609B2 (ja) 2024-02-16

Similar Documents

Publication Publication Date Title
BR112021017339A2 (US07122603-20061017-C00294.png)
BR112021018450A2 (US07122603-20061017-C00294.png)
BR112021017939A2 (US07122603-20061017-C00294.png)
BR112021017892A2 (US07122603-20061017-C00294.png)
BR112021017782A2 (US07122603-20061017-C00294.png)
BR112021018168A2 (US07122603-20061017-C00294.png)
BR112021017728A2 (US07122603-20061017-C00294.png)
BR112021018452A2 (US07122603-20061017-C00294.png)
BR112021017234A2 (US07122603-20061017-C00294.png)
BR112021017355A2 (US07122603-20061017-C00294.png)
BR112021017703A2 (US07122603-20061017-C00294.png)
BR112021017173A2 (US07122603-20061017-C00294.png)
BR112021018102A2 (US07122603-20061017-C00294.png)
BR112021017083A2 (US07122603-20061017-C00294.png)
BR112021017637A2 (US07122603-20061017-C00294.png)
BR112021012348A2 (US07122603-20061017-C00294.png)
BR112021018250A2 (US07122603-20061017-C00294.png)
BR112021018093A2 (US07122603-20061017-C00294.png)
BR112021018084A2 (US07122603-20061017-C00294.png)
BR112021015080A2 (US07122603-20061017-C00294.png)
BR112021017949A2 (US07122603-20061017-C00294.png)
BR112021017983A2 (US07122603-20061017-C00294.png)
BR112021016205A2 (US07122603-20061017-C00294.png)
BR112021016996A2 (US07122603-20061017-C00294.png)
BR112021017010A2 (US07122603-20061017-C00294.png)

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20211005

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220106

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20220726

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20220831

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20221219

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230313

C60 Trial request (containing other claim documents, opposition documents)

Free format text: JAPANESE INTERMEDIATE CODE: C60

Effective date: 20230313

C11 Written invitation by the commissioner to file amendments

Free format text: JAPANESE INTERMEDIATE CODE: C11

Effective date: 20230421

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20230425

C21 Notice of transfer of a case for reconsideration by examiners before appeal proceedings

Free format text: JAPANESE INTERMEDIATE CODE: C21

Effective date: 20230426

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20230519

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20240205

R150 Certificate of patent or registration of utility model

Ref document number: 7432609

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150