JPWO2021038631A1 - - Google Patents
Info
- Publication number
- JPWO2021038631A1 JPWO2021038631A1 JP2021541766A JP2021541766A JPWO2021038631A1 JP WO2021038631 A1 JPWO2021038631 A1 JP WO2021038631A1 JP 2021541766 A JP2021541766 A JP 2021541766A JP 2021541766 A JP2021541766 A JP 2021541766A JP WO2021038631 A1 JPWO2021038631 A1 JP WO2021038631A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09118—Moulded substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09909—Special local insulating pattern, e.g. as dam around component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10628—Leaded surface mounted device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0014—Shaping of the substrate, e.g. by moulding
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2019/033067 WO2021038631A1 (ja) | 2019-08-23 | 2019-08-23 | 電子回路装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2021038631A1 true JPWO2021038631A1 (US06633600-20031014-M00021.png) | 2021-03-04 |
JP7432609B2 JP7432609B2 (ja) | 2024-02-16 |
Family
ID=74685010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2021541766A Active JP7432609B2 (ja) | 2019-08-23 | 2019-08-23 | 電子回路装置の製造方法 |
Country Status (4)
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0226274U (US06633600-20031014-M00021.png) * | 1988-08-04 | 1990-02-21 | ||
JPH02281684A (ja) * | 1989-04-21 | 1990-11-19 | Tokyo Electric Co Ltd | 部品実装方法 |
JPH05335694A (ja) * | 1992-05-27 | 1993-12-17 | Mitsubishi Electric Corp | 立体構造基板 |
JPH0818208A (ja) * | 1994-06-30 | 1996-01-19 | Suzuki Motor Corp | 実装部品倒れ防止治具 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0832861B2 (ja) * | 1989-01-13 | 1996-03-29 | 松下電器産業株式会社 | 電子部品用接着剤 |
EP0378233B1 (en) * | 1989-01-13 | 1994-12-28 | Matsushita Electric Industrial Co., Ltd. | An adhesive composition for use in the mounting of electronic parts and a method for mounting electronic parts on a printed circuit board by the use of the same |
JPH0729591Y2 (ja) * | 1990-09-28 | 1995-07-05 | ホシデン株式会社 | チップ形コネクタ |
JPH06196851A (ja) * | 1992-12-25 | 1994-07-15 | Taiyo Yuden Co Ltd | 回路基板に金属部材を取り付けるはんだ付け方法 |
JPH06237061A (ja) * | 1993-02-09 | 1994-08-23 | Sony Corp | 半導体装置の実装構造とその実装方法 |
JP2002335068A (ja) * | 2001-05-10 | 2002-11-22 | Matsushita Electric Ind Co Ltd | 電子部品の位置矯正方法、および電子部品の位置矯正装置 |
JP2004265888A (ja) * | 2003-01-16 | 2004-09-24 | Sony Corp | 半導体装置及びその製造方法 |
JP4852276B2 (ja) * | 2005-08-10 | 2012-01-11 | 富士通セミコンダクター株式会社 | 半導体装置の製造方法 |
DE102006015676A1 (de) * | 2006-04-04 | 2007-06-14 | Siemens Ag | Elektronisches Bauteil und elektronisches Steuergerät, insbesondere zur Verwendung in Kraftfahrzeugen |
SE0700329L (sv) | 2007-02-12 | 2008-02-26 | Isaberg Rapid Ab | Häfthammare |
JP2009032865A (ja) * | 2007-07-26 | 2009-02-12 | Hitachi Ltd | 電子装置及び電子装置の製造方法 |
JP5511156B2 (ja) * | 2008-06-30 | 2014-06-04 | シャープ株式会社 | 半導体デバイスの実装方法、半導体素子モジュールおよび電子情報機器 |
CN102456960B (zh) * | 2010-10-26 | 2014-04-23 | 泰科电子(上海)有限公司 | 连接端子和端子安装装置 |
JP5850524B2 (ja) * | 2011-09-26 | 2016-02-03 | 株式会社小糸製作所 | 車輌用灯具 |
JP5604413B2 (ja) * | 2011-12-20 | 2014-10-08 | シャープ株式会社 | バーンイン装置 |
JP6890249B2 (ja) * | 2017-02-24 | 2021-06-18 | パナソニックIpマネジメント株式会社 | 塗布装置及び塗布方法 |
WO2018163323A1 (ja) | 2017-03-08 | 2018-09-13 | 株式会社Fuji | 3次元実装関連装置 |
-
2019
- 2019-08-23 JP JP2021541766A patent/JP7432609B2/ja active Active
- 2019-08-23 EP EP19943150.3A patent/EP4021153A4/en active Pending
- 2019-08-23 CN CN201980099440.8A patent/CN114271038B/zh active Active
- 2019-08-23 WO PCT/JP2019/033067 patent/WO2021038631A1/ja unknown
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0226274U (US06633600-20031014-M00021.png) * | 1988-08-04 | 1990-02-21 | ||
JPH02281684A (ja) * | 1989-04-21 | 1990-11-19 | Tokyo Electric Co Ltd | 部品実装方法 |
JPH05335694A (ja) * | 1992-05-27 | 1993-12-17 | Mitsubishi Electric Corp | 立体構造基板 |
JPH0818208A (ja) * | 1994-06-30 | 1996-01-19 | Suzuki Motor Corp | 実装部品倒れ防止治具 |
Also Published As
Publication number | Publication date |
---|---|
WO2021038631A1 (ja) | 2021-03-04 |
CN114271038A (zh) | 2022-04-01 |
EP4021153A1 (en) | 2022-06-29 |
JP7432609B2 (ja) | 2024-02-16 |
CN114271038B (zh) | 2024-05-03 |
EP4021153A4 (en) | 2022-09-07 |
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