JPWO2021033683A1 - - Google Patents

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Publication number
JPWO2021033683A1
JPWO2021033683A1 JP2021537135A JP2021537135A JPWO2021033683A1 JP WO2021033683 A1 JPWO2021033683 A1 JP WO2021033683A1 JP 2021537135 A JP2021537135 A JP 2021537135A JP 2021537135 A JP2021537135 A JP 2021537135A JP WO2021033683 A1 JPWO2021033683 A1 JP WO2021033683A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2021537135A
Other versions
JP7064672B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from PCT/JP2019/048291 external-priority patent/WO2021033344A1/ja
Application filed filed Critical
Publication of JPWO2021033683A1 publication Critical patent/JPWO2021033683A1/ja
Application granted granted Critical
Publication of JP7064672B2 publication Critical patent/JP7064672B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/40Adhesives in the form of films or foils characterised by release liners
    • C09J7/405Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H35/00Delivering articles from cutting or line-perforating machines; Article or web delivery apparatus incorporating cutting or line-perforating devices, e.g. adhesive tape dispensers
    • B65H35/0006Article or web delivery apparatus incorporating cutting or line-perforating devices
    • B65H35/002Hand-held or table apparatus
    • B65H35/0026Hand-held or table apparatus for delivering pressure-sensitive adhesive tape
    • B65H35/0033Hand-held or table apparatus for delivering pressure-sensitive adhesive tape and affixing it to a surface
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D3/00Cutting work characterised by the nature of the cut made; Apparatus therefor
    • B26D3/08Making a superficial cut in the surface of the work without removal of material, e.g. scoring, incising
    • B26D3/085On sheet material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26DCUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
    • B26D7/00Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
    • B26D7/26Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
    • B26D7/2628Means for adjusting the position of the cutting member
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/18Perforating by slitting, i.e. forming cuts closed at their ends without removal of material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B26HAND CUTTING TOOLS; CUTTING; SEVERING
    • B26FPERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
    • B26F1/00Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
    • B26F1/18Perforating by slitting, i.e. forming cuts closed at their ends without removal of material
    • B26F1/22Perforating by slitting, i.e. forming cuts closed at their ends without removal of material to form non-rectilinear cuts, e.g. for tabs
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H37/00Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
    • B65H37/002Web delivery apparatus, the web serving as support for articles, material or another web
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2220/00Function indicators
    • B65H2220/08Function indicators for distinguishing changing an entity in function of another entity purely by mechanical means, i.e. no electronics involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2301/00Handling processes for sheets or webs
    • B65H2301/50Auxiliary process performed during handling process
    • B65H2301/51Modifying a characteristic of handled material
    • B65H2301/515Cutting handled material
    • B65H2301/5153Details of cutting means
    • B65H2301/51538Die-cutting
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2511/00Dimensions; Position; Numbers; Identification; Occurrences
    • B65H2511/10Size; Dimensions
    • B65H2511/13Thickness
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65HHANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00Handled material; Storage means
    • B65H2701/10Handled articles or webs
    • B65H2701/19Specific article or web
    • B65H2701/194Web supporting regularly spaced adhesive articles, e.g. labels, rubber articles, labels or stamps
    • B65H2701/19404Supporting second web with articles as precut portions
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • C09J2301/1242Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape the opposite adhesive layers being different
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00Presence of inorganic and organic materials
    • C09J2400/20Presence of organic materials
    • C09J2400/28Presence of paper

Landscapes

  • Life Sciences & Earth Sciences (AREA)
  • Forests & Forestry (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesive Tapes (AREA)
JP2021537135A 2019-08-20 2020-08-18 ハーフカット済両面テープの製造方法およびハーフカット済両面テープ貼付装置 Active JP7064672B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2019150526 2019-08-20
JP2019150526 2019-08-20
PCT/JP2019/048291 WO2021033344A1 (ja) 2019-08-20 2019-12-10 ハーフカット済両面テープの製造方法およびハーフカット済両面テープ貼付装置
JPPCT/JP2019/048291 2019-12-10
PCT/JP2020/020256 WO2021033384A1 (ja) 2019-08-20 2020-05-22 ハーフカット済両面テープの製造方法およびハーフカット済両面テープ貼付装置
JPPCT/JP2020/020256 2020-05-22
PCT/JP2020/031112 WO2021033683A1 (ja) 2019-08-20 2020-08-18 ハーフカット済両面テープの製造方法およびハーフカット済両面テープ貼付装置

Publications (2)

Publication Number Publication Date
JPWO2021033683A1 true JPWO2021033683A1 (ja) 2021-02-25
JP7064672B2 JP7064672B2 (ja) 2022-05-11

Family

ID=74660823

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2021537135A Active JP7064672B2 (ja) 2019-08-20 2020-08-18 ハーフカット済両面テープの製造方法およびハーフカット済両面テープ貼付装置

Country Status (5)

Country Link
US (1) US20220340788A1 (ja)
EP (1) EP4019443A4 (ja)
JP (1) JP7064672B2 (ja)
CN (1) CN114423695A (ja)
WO (2) WO2021033384A1 (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023228427A1 (ja) * 2022-05-21 2023-11-30 弘康 黒川 粘着テープの貼付装置
CN116062536A (zh) * 2023-02-07 2023-05-05 珠海芯烨电子科技有限公司 双面胶贴装组件、设备及方法

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5991176A (ja) * 1982-11-15 1984-05-25 Nitto Electric Ind Co Ltd 両面接着片配付テ−プの製造方法
JP2003013013A (ja) * 2001-06-27 2003-01-15 Mikata:Kk 両面粘着部材保持構造体
JP2006052256A (ja) * 2004-08-10 2006-02-23 Sanpakku:Kk 遮光用転写シールの製造方法及び製造装置
JP2010023131A (ja) * 2008-07-15 2010-02-04 Takatori Corp フィルムの貼り付け装置及び貼り付け方法
WO2014007116A1 (ja) * 2012-07-03 2014-01-09 東レ株式会社 個片化された接着剤層を有する接着剤シートの製造方法、接着剤シートを用いた配線基板の製造方法、半導体装置の製造方法および接着剤シートの製造装置
JP2014094995A (ja) * 2012-11-07 2014-05-22 Lintec Corp 刃型、接着シート製造装置、剥離方法および接着シート製造方法
JP2016008262A (ja) * 2014-06-24 2016-01-18 プラス株式会社 ハーフカット両面テープ、及びその製造方法
JP2016082166A (ja) * 2014-10-21 2016-05-16 日東電工株式会社 粘着テープ貼付け方法および粘着テープ貼付け装置
JP2018111574A (ja) * 2017-01-12 2018-07-19 日東電工株式会社 テープ貼付け方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5991175A (ja) * 1982-11-15 1984-05-25 Nitto Electric Ind Co Ltd 両面接着片配付テ−プの製造方法
JPS63130688A (ja) * 1986-11-21 1988-06-02 Fuji Photo Film Co Ltd 両面接着テ−プを用いる加工装置
JP5210239B2 (ja) * 2009-05-01 2013-06-12 日東電工株式会社 両面粘着テープ貼付け方法と両面粘着テープ貼付け装置
JP5991176B2 (ja) 2012-12-04 2016-09-14 豊田合成株式会社 Iii族窒化物半導体発光素子の製造方法
JP5978487B2 (ja) 2014-06-25 2016-08-24 大竹技研株式会社 ハイポイドギヤ

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5991176A (ja) * 1982-11-15 1984-05-25 Nitto Electric Ind Co Ltd 両面接着片配付テ−プの製造方法
JP2003013013A (ja) * 2001-06-27 2003-01-15 Mikata:Kk 両面粘着部材保持構造体
JP2006052256A (ja) * 2004-08-10 2006-02-23 Sanpakku:Kk 遮光用転写シールの製造方法及び製造装置
JP2010023131A (ja) * 2008-07-15 2010-02-04 Takatori Corp フィルムの貼り付け装置及び貼り付け方法
WO2014007116A1 (ja) * 2012-07-03 2014-01-09 東レ株式会社 個片化された接着剤層を有する接着剤シートの製造方法、接着剤シートを用いた配線基板の製造方法、半導体装置の製造方法および接着剤シートの製造装置
JP2014094995A (ja) * 2012-11-07 2014-05-22 Lintec Corp 刃型、接着シート製造装置、剥離方法および接着シート製造方法
JP2016008262A (ja) * 2014-06-24 2016-01-18 プラス株式会社 ハーフカット両面テープ、及びその製造方法
JP2016082166A (ja) * 2014-10-21 2016-05-16 日東電工株式会社 粘着テープ貼付け方法および粘着テープ貼付け装置
JP2018111574A (ja) * 2017-01-12 2018-07-19 日東電工株式会社 テープ貼付け方法

Also Published As

Publication number Publication date
EP4019443A4 (en) 2022-11-02
EP4019443A1 (en) 2022-06-29
CN114423695A (zh) 2022-04-29
WO2021033683A1 (ja) 2021-02-25
JP7064672B2 (ja) 2022-05-11
WO2021033384A1 (ja) 2021-02-25
US20220340788A1 (en) 2022-10-27

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